DE3367399D1 - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
DE3367399D1
DE3367399D1 DE8383101889T DE3367399T DE3367399D1 DE 3367399 D1 DE3367399 D1 DE 3367399D1 DE 8383101889 T DE8383101889 T DE 8383101889T DE 3367399 T DE3367399 T DE 3367399T DE 3367399 D1 DE3367399 D1 DE 3367399D1
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383101889T
Other languages
German (de)
English (en)
Inventor
Isamu Tanaka
Hitoshi Oka
Akira Tomizawa
Hiroshi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3367399D1 publication Critical patent/DE3367399D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE8383101889T 1982-02-26 1983-02-25 Epoxy resin composition Expired DE3367399D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57029007A JPS58147416A (ja) 1982-02-26 1982-02-26 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
DE3367399D1 true DE3367399D1 (en) 1986-12-11

Family

ID=12264343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383101889T Expired DE3367399D1 (en) 1982-02-26 1983-02-25 Epoxy resin composition

Country Status (5)

Country Link
US (1) US4460718A (enExample)
EP (1) EP0087790B1 (enExample)
JP (1) JPS58147416A (enExample)
KR (1) KR860001554B1 (enExample)
DE (1) DE3367399D1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6082673A (ja) * 1983-10-14 1985-05-10 Hitachi Ltd 耐めつき性ソルダレジストインク組成物
KR860001555B1 (ko) * 1983-10-14 1986-10-04 가부시기가이샤 히다찌세이사꾸쇼 에폭시 수지 조성물
US4689375A (en) * 1984-09-27 1987-08-25 Ciba-Geigy Corporation Curable mixtures containing diethylphenyl biguanide and the use thereof
JPS633067A (ja) * 1986-06-24 1988-01-08 Somar Corp 粉体塗料組成物
US5189081A (en) * 1988-07-04 1993-02-23 Somar Corporation Penetrable, epoxy resin composition comprising glycidyl ether of bisphenol modified with glycol or urethane, and inorganic filler
EP0350232A3 (en) * 1988-07-04 1991-04-10 Somar Corporation Penetrable, epoxy resin composition
US4959267A (en) * 1988-11-23 1990-09-25 Du Pont Canada Inc. Fiber reinforced rubber products
US5464886A (en) * 1990-10-19 1995-11-07 Tran; Bang T. Polymer concrete coating for pipe, tubular shapes, other metal members and metal structures
JP2649473B2 (ja) * 1993-04-14 1997-09-03 株式会社巴川製紙所 エポキシ樹脂接着組成物
US5585421A (en) * 1994-03-31 1996-12-17 Somar Corporation Composition dispensable at high speed for bonding electric parts to printed wiring boards
KR100399332B1 (ko) * 1994-12-26 2003-09-26 히다치 가세고교 가부시끼가이샤 필름 형상의 유기 다이본딩재의 라미네이트 방법,다이본딩 방법, 라미네이트 장치, 다이본딩 장치, 반도체장치 및 반도체장치의 제조방법
US6717242B2 (en) * 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
TW310481B (enExample) * 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US6534181B2 (en) 2000-03-27 2003-03-18 Neltec, Inc. Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds
DE102006056311B4 (de) * 2006-11-29 2018-03-01 Alzchem Trostberg Gmbh Verwendung von Guanidin-Derivaten als Beschleuniger bei der Härtung von Epoxidharzsystemen
PT2307359E (pt) * 2008-07-22 2012-02-02 Basf Se Combinações contendo resinas epoxi e misturas de aminas com derivados de guanidina
US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US8262895B2 (en) 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
JP6491417B2 (ja) * 2014-03-10 2019-03-27 互応化学工業株式会社 ソルダーレジスト用樹脂組成物、マーキングインク用樹脂組成物、硬化物及びプリント配線板
JP7003575B2 (ja) * 2017-10-30 2022-01-20 昭和電工マテリアルズ株式会社 アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CS120978A (enExample) *
NL110641C (enExample) * 1958-07-08
US3210379A (en) * 1960-07-25 1965-10-05 Ciba Ltd Epoxide compounds
US3261809A (en) * 1962-11-02 1966-07-19 American Cyanamid Co Substituted isobiguanide catalysts for epoxy resins
GB1037895A (en) * 1964-06-29 1966-08-03 Sels Et Prod Chim Sa Epoxy resin compositions
US3443988A (en) * 1965-05-06 1969-05-13 Photocircuits Corp Printed circuits,work holders and method of preventing electroless metal deposition
US3391113A (en) * 1966-10-14 1968-07-02 Dow Chemical Co Rapid curing epoxy resin compositions
CH525924A (de) * 1969-05-19 1972-07-31 Ciba Geigy Ag Härtbare Mischung aus Epoxidharz und Biguanid
US3732286A (en) * 1971-11-01 1973-05-08 Goodrich Co B F Compositions comprising an epoxy resin, dicyaniamide and an acylguanidine
US3795657A (en) * 1972-08-21 1974-03-05 Dow Chemical Co Epoxy resin compositions containing aromatic biguanides as latent curing agents therefor
DE2649402A1 (de) * 1976-10-29 1978-05-03 Sueddeutsche Kalkstickstoff Haerter fuer heisshaertende epoxidharze
DE2914085A1 (de) * 1979-04-07 1980-10-16 Basf Ag Additionsprodukt und seine verwendung

Also Published As

Publication number Publication date
EP0087790A1 (en) 1983-09-07
JPS6210567B2 (enExample) 1987-03-06
KR840002861A (ko) 1984-07-21
EP0087790B1 (en) 1986-11-05
JPS58147416A (ja) 1983-09-02
KR860001554B1 (ko) 1986-10-04
US4460718A (en) 1984-07-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition