DE3364871D1 - Method for packaging electronic parts - Google Patents

Method for packaging electronic parts

Info

Publication number
DE3364871D1
DE3364871D1 DE8383302137T DE3364871T DE3364871D1 DE 3364871 D1 DE3364871 D1 DE 3364871D1 DE 8383302137 T DE8383302137 T DE 8383302137T DE 3364871 T DE3364871 T DE 3364871T DE 3364871 D1 DE3364871 D1 DE 3364871D1
Authority
DE
Germany
Prior art keywords
electronic parts
packaging electronic
packaging
parts
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383302137T
Other languages
German (de)
English (en)
Inventor
Yoshitaka Fukuoka
Toshiaki Komine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3364871D1 publication Critical patent/DE3364871D1/de
Expired legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49885—Assembling or joining with coating before or during assembling
DE8383302137T 1982-04-24 1983-04-15 Method for packaging electronic parts Expired DE3364871D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57068931A JPS58186951A (ja) 1982-04-24 1982-04-24 電子部品のパッケ−ジング方法

Publications (1)

Publication Number Publication Date
DE3364871D1 true DE3364871D1 (en) 1986-09-04

Family

ID=13387893

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383302137T Expired DE3364871D1 (en) 1982-04-24 1983-04-15 Method for packaging electronic parts

Country Status (4)

Country Link
US (1) US4517738A (enExample)
EP (1) EP0092944B1 (enExample)
JP (1) JPS58186951A (enExample)
DE (1) DE3364871D1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4722137A (en) * 1986-02-05 1988-02-02 Hewlett-Packard Company High frequency hermetically sealed package for solid-state components
JPS6376444A (ja) * 1986-09-19 1988-04-06 Nec Corp チツプキヤリア
DE3784213T2 (de) * 1986-10-29 1993-06-03 Toshiba Kawasaki Kk Elektronischer apparat mit einem keramischen substrat.
DE3703280A1 (de) * 1987-02-04 1988-08-18 Licentia Gmbh Schaltungsanordnung mit einem oder mehreren integrierten schaltkreisen
JPH0282556A (ja) * 1988-09-19 1990-03-23 Toshiba Corp ハイブリッドｉｃの封止方法
US5059557A (en) * 1989-08-08 1991-10-22 Texas Instruments Incorporated Method of electrically connecting integrated circuits by edge-insertion in grooved support members
FI109960B (fi) * 1991-09-19 2002-10-31 Nokia Corp Elektroninen laite
EP0547807A3 (en) * 1991-12-16 1993-09-22 General Electric Company Packaged electronic system
CA2146123C (en) * 1992-10-20 2005-01-11 Janusz Kuzma Package and method of construction
DE19527611B4 (de) * 1995-07-28 2006-05-24 Schulz-Harder, Jürgen, Dr.-Ing. Verfahren zum Herstellen eines Substrats für elektrische Schaltkreise
SE517022C2 (sv) * 1999-12-07 2002-04-02 Imego Ab Förseglingsanordning samt metod för hermetisk försegling
SE516622C2 (sv) 2000-06-15 2002-02-05 Uddeholm Tooling Ab Stållegering, plastformningsverktyg och seghärdat ämne för plastformningsverktyg
WO2008128300A1 (en) * 2007-04-23 2008-10-30 Cochlear Limited Implant assembly
TWI445103B (zh) * 2010-08-19 2014-07-11 乾坤科技股份有限公司 電子封裝結構及其封裝方法
DE102012216926A1 (de) * 2012-09-20 2014-03-20 Jumatech Gmbh Verfahren zur Herstellung eines Leiterplattenelements sowie Leiterplattenelement
JP6629660B2 (ja) * 2015-06-02 2020-01-15 日本特殊陶業株式会社 セラミックパッケージおよびその製造方法
DE102016110539A1 (de) * 2016-06-08 2017-12-14 Biotronik Se & Co. Kg Stoffschlüssige metallische Verbindung basierend auf einer galvanischen Abscheidung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2965962A (en) * 1954-12-07 1960-12-27 Rca Corp Hermetic seal and method of making the same
US3191268A (en) * 1958-02-28 1965-06-29 Gen Motors Corp Process for encapsulating transistors
US3211827A (en) * 1959-11-17 1965-10-12 Texas Instruments Inc Container closure device
US3210171A (en) * 1960-09-12 1965-10-05 Sylvania Electric Prod Method of supplying heat of fusion to glass-to-glass seal
US3217088A (en) * 1962-11-30 1965-11-09 Owens Illinois Glass Co Joining glass members and encapsulation of small electrical components
US3485996A (en) * 1967-01-11 1969-12-23 Ibm Laser welding
US3823468A (en) * 1972-05-26 1974-07-16 N Hascoe Method of fabricating an hermetically sealed container
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
JPS5949698B2 (ja) * 1980-05-09 1984-12-04 松下電器産業株式会社 電子部品の封止方法
JPS577042A (en) * 1980-06-16 1982-01-14 Hitachi Ltd Manufacture of electron gun cathode assembly

Also Published As

Publication number Publication date
US4517738A (en) 1985-05-21
EP0092944B1 (en) 1986-07-30
JPS58186951A (ja) 1983-11-01
EP0092944A1 (en) 1983-11-02
JPS6219062B2 (enExample) 1987-04-25

Similar Documents

Publication Publication Date Title
GB8327366D0 (en) Apparatus for electronic publishing
GB2159990B (en) Method for securely communicating
DE3277756D1 (en) Electronic package
GB8322130D0 (en) Apparatus for packaging articles
GB8307067D0 (en) Electronic apparatus
DE3169420D1 (en) Package for electrical components
GB8333706D0 (en) Packaging machine method
DE3364871D1 (en) Method for packaging electronic parts
GB8320954D0 (en) Packaging apparatus
HUT37018A (en) Method for processing soyq
GB8332072D0 (en) Currency-dispensing method
YU237283A (en) Process for obtaiing 7-carboxy-methoxy-phenyl-acetamido-3-cephem derivatives
GB2118439B (en) Fungistatic method
ZA833211B (en) Tray-type cartons
IE823079L (en) Packaging method
JPS5783099A (en) Package for electric/electronic part
GB8323569D0 (en) Apparatus for forming packages
DE3477125D1 (en) Apparatus for automatically inserting electronic part
GB2069382B (en) Machine for forming the leads of electronic components
GB2150918B (en) Packaging tubes for electronic components
GB2127380B (en) Packaging tubes for electronic components
GB8415920D0 (en) Electronic focusing method
EP0100144A3 (en) Low cost electronic apparatus construction method
GB2126802B (en) High density packaging for electronic circuits
GB2090072B (en) Package for electronic components

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee