DE3326571A1 - METHOD FOR STRUCTURING MATERIAL SURFACES BY LASER RADIATION - Google Patents

METHOD FOR STRUCTURING MATERIAL SURFACES BY LASER RADIATION

Info

Publication number
DE3326571A1
DE3326571A1 DE19833326571 DE3326571A DE3326571A1 DE 3326571 A1 DE3326571 A1 DE 3326571A1 DE 19833326571 DE19833326571 DE 19833326571 DE 3326571 A DE3326571 A DE 3326571A DE 3326571 A1 DE3326571 A1 DE 3326571A1
Authority
DE
Germany
Prior art keywords
laser radiation
structuring
laser
material surfaces
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19833326571
Other languages
German (de)
Inventor
Ernst Dr. DDR 6902 Jena Heumann
Jürgen Dipl.-Phys. DDR 4850 Weißenfels Kleinschmidt
Klaus Dipl.-Phys. DDR 5300 Weimar Vogler
Gerhard Dr. DDR 6900 Jena Wiederhold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jenoptik AG
Original Assignee
Jenoptik Jena GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena GmbH filed Critical Jenoptik Jena GmbH
Publication of DE3326571A1 publication Critical patent/DE3326571A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/262—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used recording or marking of inorganic surfaces or materials, e.g. glass, metal, or ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/267—Marking of plastic artifacts, e.g. with laser

Description

Verfahren zur Strukturierung von Materialoberflächen mittels LaserstrahlungProcess for structuring material surfaces by means of laser radiation

Die Erfindung betrifft ein "Verfahren zur Strukturierung der Oberfläche von Materialien mit Laserstrahlung, welche von den Materialien selbst nicht absorbiert wird. Das Verfahren ist geeignet, das transparente Material zu gravieren oder strukturierte Bedampfungen aufzubringen.The invention relates to a "method for structuring the Surface of materials with laser radiation, which from the Materials themselves is not absorbed. The method is suitable for engraving or texturing the transparent material Apply vapor deposition.

Die Beschriftung oder gezielte Strukturierung von an sich für die Laserstrahlung transparenten Materialien ist bisher nur mit hohem technischen Aufwand möglich. 3s sind dafür bisher zwei Prinziplösungen bekannt (D. Ehrlich et. al·, Laser photochemistry at surfaces for applications in microelectronics, ISEE Journ. QB-I^ (1981) 110, techn. digest, CLSO 81; M. Nowicki, Laser in üllektroniktechnologie und Materialbearbeitung, Leipzig, 1982).The labeling or targeted structuring of materials that are transparent to the laser radiation is currently only possible possible with high technical effort. 3s, two principle solutions are known so far (D. Ehrlich et. Al., Laser photochemistry at surfaces for applications in microelectronics, ISEE Journ. QB-I ^ (1981) 110, tech. digest, CLSO 81; M. Nowicki, lasers in electronics technology and material processing, Leipzig, 1982).

1. Räumlich gezielte epitaktische Abscheidung durch laserinduzierte Dissoziation von metallorganischen GaspartikeIn. Der Vorteil gegenüber bisherigen photolithografischen Verfahren beruht darauf, daß zusätzliche Masken für die Strukturierung nicht erforderlich sind. Die Nachteile dieses Verfahrens liegen im hohen technischen Aufwand und in der Tatsache, daß nur ausgewählte, der Laserstrahlung angepaßte, chemische "verbindungen ausgenutzt werden können.1. Spatially targeted epitaxial deposition by laser-induced Dissociation of organometallic gas particles. The advantage over previous photolithographic processes is based on the fact that additional masks for the structuring are not required. The disadvantages of this process are the high technical complexity and the The fact that only selected chemical compounds that are adapted to the laser radiation can be used.

332657J.332657J.

2. Aufdampfen dünner Schichten im Hochvakuum, die durch Abdampfen spezieller Materialien durch Laserstrahlung erfolgt· Zur Strukturierung von Oberflächen sind zusätzliche Masken erforderlich. Die Nachteile des Verfahrens liegen in der erforderlichen Maskierung und in dem hohen technischen Aufwand (Hochvakuumerzeugung)·2. Evaporation of thin layers in a high vacuum produced by evaporation Special materials are made by laser radiation · Additional masks are required for structuring surfaces necessary. The disadvantages of the method are the masking required and the high technical complexity (High vacuum generation)

Beide Verfahren sind bisher über das Laborstadium nicht hinausgekommen· Both processes have so far not got beyond the laboratory stage

Methoden zum Gravieren von für die Laserstrahlung an sich transparenten Materialien sind bisher nicht bekannt.Methods for engraving materials that are inherently transparent to the laser radiation are not yet known.

Die Erfindung verfolgt das Ziel, Materialien durch Bedampfung oder Gravur zu strukturieren, die sich bisher einer derartigen Bearbeitung durch Laserstrahlung entzogen·The invention aims to produce materials by vapor deposition or to structure engraving, which up to now could not be processed by laser radiation

Der Erfindung liegt die Aufgabe zugrunde, die Strukturierung mittels Laserstrahlung auch auf solche Matex^ialien auszudehnen, die bislang dafür ungeeignet waren.The invention is based on the object of extending the structuring by means of laser radiation also to such materials, which were previously unsuitable for this.

Die Lösung dieser Aufgabe gelingt mit einem Verfahren, bei dem erfindungsgemäß das zu strukturierende Material mit seiner der Strahlungsquelle abgewandten Oberfläche mit einer Metalloberfläche oder der Oberfläche eines anderen, die Laserstrahlung absorbierenden Materials in Kontakt gebracht wird. Der durch die Erfindung erreichte große technische .Fortschritt zeigt sich dadurch, daß die Methoden des Lasergravierens und -beschriftens auch auf für die Laserstrahlung durchsichtige Materialien ausgedehnt werden kann.This object is achieved with a method in which, according to the invention, the material to be structured with its The surface facing away from the radiation source with a metal surface or the surface of another, the laser radiation absorbent material is brought into contact. The great technical progress achieved by the invention is shown by the fact that the methods of laser engraving and labeling are also transparent for the laser radiation Materials can be stretched.

Das zu strukturierende, für die Laserstrahlung transparente Material wird mit einer Metallunterlage oder mit einer anderen, die Laserstrahlung absorbierenden Unterlage in direkten Kontakt gebracht. Die Laserstrahlung durchdringt das transparente Material und wird von der Unterlage absorbiert. Das hierbei entstehende Plasma und die damit verbundene Schockwelle strukturieren das transparente Material auf der der Strahlungsquelle abgewandten Seite. Je nach Wahl der Laserparameter (Energie, Impulsdauer, Impulsfolge) kann das transparente Material entweder graviert oder mit den Materialpartikeln der absorbierenden Unterlage bedampft werden·The material to be structured, transparent for the laser radiation, is covered with a metal base or with another, brought into direct contact with the support that absorbs laser radiation. The laser radiation penetrates the transparent material and is absorbed by the surface. The resulting plasma and the associated shock wave structure this transparent material on the side facing away from the radiation source. Depending on the choice of laser parameters (energy, pulse duration, Pulse sequence) the transparent material can either be engraved or vaporized with the material particles of the absorbent base will·

Durch gesteuerte führung des Laserstrahles lassen sich damit beliebige Strukturen, insbesondere auch Leiterstrukturen, ohne weitere Hilfsmaßnahmen (Gasstrahl, Maske, Vakuum) auf das an sich für die Laserstrahlung transparente Material aufbringen·Controlled guidance of the laser beam can be used to any structures, in particular conductor structures, without further auxiliary measures (gas jet, mask, vacuum) on the Apply material transparent to the laser radiation

Claims (1)

PatentanspruchClaim 1. Verfahren zur Strukturierung der Oberfläche von Laserstrahlung nicht absorbierenden Materialien dadurch gekennzeichnet, daß die zu strukturierende Oberfläche, der Strahlungsquelle abgewandt, mit einer Metalloberfläche oder der Oberfläche eines anderen, die Laserstrahlung absorbierenden Materials in Kontakt gebracht wird.1. Process for structuring the surface of laser radiation non-absorbent materials characterized in that the surface to be structured, the Turning away from the radiation source, with a metal surface or the surface of another, the laser radiation absorbent material is brought into contact.
DE19833326571 1982-08-05 1983-07-23 METHOD FOR STRUCTURING MATERIAL SURFACES BY LASER RADIATION Withdrawn DE3326571A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD82242261A DD237817A1 (en) 1982-08-05 1982-08-05 METHOD FOR STRUCTURING MATERIAL SURFACES BY MEANS OF LASER RADIATION

Publications (1)

Publication Number Publication Date
DE3326571A1 true DE3326571A1 (en) 1984-02-09

Family

ID=5540456

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833326571 Withdrawn DE3326571A1 (en) 1982-08-05 1983-07-23 METHOD FOR STRUCTURING MATERIAL SURFACES BY LASER RADIATION

Country Status (4)

Country Link
DD (1) DD237817A1 (en)
DE (1) DE3326571A1 (en)
FR (1) FR2537028B1 (en)
GB (1) GB2126956B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801356A (en) * 1995-08-16 1998-09-01 Santa Barbara Research Center Laser scribing on glass using Nd:YAG laser
DE19912879C2 (en) * 1998-09-21 2002-11-07 Agency Ind Science Techn Process for removing a transparent solid with laser beams
DE102005030272A1 (en) * 2005-06-21 2007-01-04 Hansgrohe Ag Method for producing decorative surface structures
DE102011055364A1 (en) 2011-11-15 2013-05-23 Hochschule für Angewandte Wissenschaft und Kunst - Hildesheim/Holzminden/Göttingen Method for removing material from glass surfaces
DE102012010635A1 (en) 2012-05-18 2013-11-21 Leibniz-Institut für Oberflächenmodifizierung e.V. Three dimensional structuring or shaping of hard, brittle, and optical materials, comprises patterning surface of a hard, brittle and optical material with an ultra-short pulse laser, where surface of structure is smoothed by plasma jet

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2630947B1 (en) * 1988-05-09 1991-04-05 Renaud Richard LASER WELDING PROCESS OF PARTS IN ONE OR MORE LIGHT REFLECTING METALS, AND RESULTING ARTICLES
JP3401425B2 (en) * 1998-01-21 2003-04-28 理化学研究所 Laser processing method and laser processing apparatus
KR100283415B1 (en) * 1998-07-29 2001-06-01 구자홍 Method and apparatus of machining a transparent medium by laser
DE10118178C2 (en) * 2001-04-11 2003-05-08 Draexlmaier Lisa Gmbh Composite trim and process for its manufacture
DE10304371A1 (en) * 2003-02-04 2004-08-12 Magna Naturstein Gmbh Processing surfaces of transparent materials, especially glass, involves bringing surface into contact with material that absorbs laser beams, processing with laser beam, removing absorbent material

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3787210A (en) * 1971-09-30 1974-01-22 Ncr Laser recording technique using combustible blow-off

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801356A (en) * 1995-08-16 1998-09-01 Santa Barbara Research Center Laser scribing on glass using Nd:YAG laser
DE19912879C2 (en) * 1998-09-21 2002-11-07 Agency Ind Science Techn Process for removing a transparent solid with laser beams
DE102005030272A1 (en) * 2005-06-21 2007-01-04 Hansgrohe Ag Method for producing decorative surface structures
DE102011055364A1 (en) 2011-11-15 2013-05-23 Hochschule für Angewandte Wissenschaft und Kunst - Hildesheim/Holzminden/Göttingen Method for removing material from glass surfaces
DE102011055364A8 (en) * 2011-11-15 2013-08-01 Hochschule Für Angewandte Wissenschaft Und Kunst Hildesheim/Holzminden/Göttingen Method for removing material from glass surfaces
DE102012010635A1 (en) 2012-05-18 2013-11-21 Leibniz-Institut für Oberflächenmodifizierung e.V. Three dimensional structuring or shaping of hard, brittle, and optical materials, comprises patterning surface of a hard, brittle and optical material with an ultra-short pulse laser, where surface of structure is smoothed by plasma jet
DE102012010635B4 (en) 2012-05-18 2022-04-07 Leibniz-Institut für Oberflächenmodifizierung e.V. Process for 3D structuring and shaping of surfaces made of hard, brittle and optical materials

Also Published As

Publication number Publication date
GB2126956B (en) 1985-09-11
GB8321002D0 (en) 1983-09-07
DD237817A1 (en) 1986-07-30
GB2126956A (en) 1984-04-04
FR2537028A1 (en) 1984-06-08
FR2537028B1 (en) 1986-06-20

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8141 Disposal/no request for examination