DE3279554D1 - Selective etching method of polyimide type resin film - Google Patents

Selective etching method of polyimide type resin film

Info

Publication number
DE3279554D1
DE3279554D1 DE8282111392T DE3279554T DE3279554D1 DE 3279554 D1 DE3279554 D1 DE 3279554D1 DE 8282111392 T DE8282111392 T DE 8282111392T DE 3279554 T DE3279554 T DE 3279554T DE 3279554 D1 DE3279554 D1 DE 3279554D1
Authority
DE
Germany
Prior art keywords
resin film
etching method
type resin
selective etching
polyimide type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282111392T
Other languages
German (de)
English (en)
Inventor
Atsushi Saiki
Takao Iwayanagi
Saburo Nonogaki
Takashi Nishida
Seiki Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3279554D1 publication Critical patent/DE3279554D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
DE8282111392T 1981-12-21 1982-12-09 Selective etching method of polyimide type resin film Expired DE3279554D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56205326A JPS58108229A (ja) 1981-12-21 1981-12-21 ポリイミド系樹脂膜の選択エツチング方法

Publications (1)

Publication Number Publication Date
DE3279554D1 true DE3279554D1 (en) 1989-04-20

Family

ID=16505075

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282111392T Expired DE3279554D1 (en) 1981-12-21 1982-12-09 Selective etching method of polyimide type resin film

Country Status (5)

Country Link
US (1) US4436583A (https=)
EP (1) EP0082417B1 (https=)
JP (1) JPS58108229A (https=)
KR (1) KR900003253B1 (https=)
DE (1) DE3279554D1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664962A (en) * 1985-04-08 1987-05-12 Additive Technology Corporation Printed circuit laminate, printed circuit board produced therefrom, and printed circuit process therefor
US4908096A (en) * 1988-06-24 1990-03-13 Allied-Signal Inc. Photodefinable interlevel dielectrics
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5208066A (en) * 1989-03-18 1993-05-04 Hitachi, Ltd. Process of forming a patterned polyimide film and articles including such a film
US4911786A (en) * 1989-04-26 1990-03-27 International Business Machines Corporation Method of etching polyimides and resulting passivation structure
US5183534A (en) * 1990-03-09 1993-02-02 Amoco Corporation Wet-etch process and composition
US5470693A (en) * 1992-02-18 1995-11-28 International Business Machines Corporation Method of forming patterned polyimide films
KR0126792B1 (ko) * 1994-04-11 1998-04-01 김광호 폴리이미드(Polyimide) 표면 처리방법
US5441815A (en) * 1994-08-29 1995-08-15 Industrial Technology Research Institute Process for producing easily removable polyimide resin film
TW535454B (en) * 1999-10-21 2003-06-01 Semiconductor Energy Lab Electro-optical device
US6713587B2 (en) 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
EP1520454B1 (en) * 2002-06-27 2012-01-25 PPG Industries Ohio, Inc. Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof
US6824959B2 (en) * 2002-06-27 2004-11-30 Ppg Industries Ohio, Inc. Process for creating holes in polymeric substrates
US7745339B2 (en) * 2006-02-24 2010-06-29 Hynix Semiconductor Inc. Method for forming fine pattern of semiconductor device
KR100694412B1 (ko) * 2006-02-24 2007-03-12 주식회사 하이닉스반도체 반도체소자의 미세패턴 형성방법
KR20130012376A (ko) * 2011-07-25 2013-02-04 삼성전자주식회사 반도체 발광소자 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833436A (en) 1972-09-05 1974-09-03 Buckbee Mears Co Etching of polyimide films
JPS5222071A (en) * 1975-08-13 1977-02-19 Hitachi Ltd Method of selective etching of film of polyamide resin
US4349619A (en) * 1979-09-19 1982-09-14 Japan Synthetic Rubber Co., Ltd. Photoresist composition
JPS5744143A (en) * 1980-08-29 1982-03-12 Tokyo Ohka Kogyo Co Ltd Composition and method for forming micropattern

Also Published As

Publication number Publication date
KR900003253B1 (ko) 1990-05-12
EP0082417A3 (en) 1986-03-26
EP0082417A2 (en) 1983-06-29
KR840003145A (ko) 1984-08-13
JPS58108229A (ja) 1983-06-28
JPH0219972B2 (https=) 1990-05-07
US4436583A (en) 1984-03-13
EP0082417B1 (en) 1989-03-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee