DE3277563D1 - Method of preserving the solderability of copper - Google Patents

Method of preserving the solderability of copper

Info

Publication number
DE3277563D1
DE3277563D1 DE8282902330T DE3277563T DE3277563D1 DE 3277563 D1 DE3277563 D1 DE 3277563D1 DE 8282902330 T DE8282902330 T DE 8282902330T DE 3277563 T DE3277563 T DE 3277563T DE 3277563 D1 DE3277563 D1 DE 3277563D1
Authority
DE
Germany
Prior art keywords
solderability
preserving
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282902330T
Other languages
English (en)
Inventor
John Le Roy Parker
Robert Bruce Ranes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of DE3277563D1 publication Critical patent/DE3277563D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE8282902330T 1981-07-17 1982-06-23 Method of preserving the solderability of copper Expired DE3277563D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/284,044 US4373656A (en) 1981-07-17 1981-07-17 Method of preserving the solderability of copper
PCT/US1982/000846 WO1983000415A1 (en) 1981-07-17 1982-06-23 Method of preserving the solderability of copper

Publications (1)

Publication Number Publication Date
DE3277563D1 true DE3277563D1 (en) 1987-12-03

Family

ID=23088649

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282902330T Expired DE3277563D1 (en) 1981-07-17 1982-06-23 Method of preserving the solderability of copper

Country Status (8)

Country Link
US (1) US4373656A (de)
EP (1) EP0083631B1 (de)
JP (1) JPS58501113A (de)
CA (1) CA1193523A (de)
DE (1) DE3277563D1 (de)
GB (1) GB2102840B (de)
HK (1) HK7586A (de)
WO (1) WO1983000415A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287155A (ja) * 1985-06-14 1986-12-17 Hitachi Ltd 半導体装置及び半導体装置の製造方法
US4876116A (en) * 1986-09-11 1989-10-24 Raychem Corporation Metal conductors with improved solderability
US4731128A (en) * 1987-05-21 1988-03-15 International Business Machines Corporation Protection of copper from corrosion
US5639515A (en) * 1987-11-10 1997-06-17 Toyo Kohan Co., Ltd. Method for post-treatment of plated steel sheet for soldering
US5075965A (en) * 1990-11-05 1991-12-31 International Business Machines Low temperature controlled collapse chip attach process
US5374331A (en) * 1991-10-22 1994-12-20 Argus International Preflux coating method
US5178965A (en) * 1992-02-14 1993-01-12 Rockwell International Corporation Uniform solder coating on roughened substrate
US5294400A (en) * 1993-03-30 1994-03-15 Nalco Chemical Company Corrosion prevention in boilers using 1,3-imidazole
US5474798A (en) * 1994-08-26 1995-12-12 Macdermid, Incorporated Method for the manufacture of printed circuit boards
US5583285A (en) * 1994-11-29 1996-12-10 Lucent Technologies Inc. Method for detecting a coating material on a substrate
US5858074A (en) * 1997-07-29 1999-01-12 National Research Council Of Canada Organic solderability preservative compositions
AU2004203209B2 (en) * 2000-11-20 2005-07-21 Silverbrook Research Pty Ltd Apparatus and Process for Applying Two-Part Binding Adhesive to Pages at Printing
US20070221503A1 (en) 2006-03-22 2007-09-27 Brian Larson Precoat composition for organic solderability preservative
US7794531B2 (en) * 2007-01-08 2010-09-14 Enthone Inc. Organic solderability preservative comprising high boiling temperature alcohol
JP6746457B2 (ja) * 2016-10-07 2020-08-26 三菱日立パワーシステムズ株式会社 タービン翼の製造方法
US11186771B2 (en) 2017-06-05 2021-11-30 Versum Materials Us, Llc Etching solution for selectively removing silicon nitride during manufacture of a semiconductor device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2163984A (en) * 1935-12-09 1939-06-27 Petkovic Valentin Anton Process for the preparation of a rust-preventing coating on metallic objects
DE1048759B (de) * 1954-05-12 1959-01-15 ]oh A Benckiser GmbH Che mische labrik Ludw igshafen Rhein I Verfahren zur \ erhmderung von Korrosionen an Gegenstanden die Kupfer insbesondere in Kombination mit Eisen enthalten
GB907793A (en) * 1959-12-04 1962-10-10 Ici Ltd Improvements in or relating to corrosion inhibitors for copper and copper containingalloys
FR2089003A5 (de) * 1970-04-02 1972-01-07 Shikoku Chem
US3864139A (en) * 1970-12-04 1975-02-04 Amchem Prod Pretreatment compositions and use thereof in treating metal surfaces
US3716421A (en) * 1971-03-19 1973-02-13 Gte Sylvania Inc Compositions for improved solderability of copper
JPS5223988B1 (de) * 1971-07-29 1977-06-28
NL7114590A (de) * 1971-10-22 1973-04-25
US3933531A (en) * 1972-04-11 1976-01-20 Natsuo Sawa Method of rust-preventing for copper and copper alloy
JPS4998731A (de) * 1973-01-30 1974-09-18
US4059218A (en) * 1974-12-23 1977-11-22 Allegheny Ludlum Industries, Inc. Method of soldering with phosphoric acid soldering flux
US3998993A (en) * 1975-06-09 1976-12-21 Bell Telephone Laboratories, Incorporated Electrical device having a metal surface bearing a corrosion inhibitor
DE2531163C2 (de) * 1975-07-11 1985-05-15 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Verbesserung der Lötbarkeit elektrischer Leiterplatten
US4014715A (en) * 1975-12-08 1977-03-29 General Electric Company Solder cleaning and coating composition
CA1083335A (en) * 1976-05-10 1980-08-12 Chemed Corporation Composition and method of inhibiting corrosion
JPS5312077A (en) * 1976-07-20 1978-02-03 Fujitsu Ltd Method of producing multilayer printed board
US4340167A (en) * 1977-12-27 1982-07-20 Rca Corporation Coated printed circuit wiring board and method of soldering

Also Published As

Publication number Publication date
GB2102840A (en) 1983-02-09
US4373656A (en) 1983-02-15
HK7586A (en) 1986-02-07
JPS6316223B2 (de) 1988-04-07
CA1193523A (en) 1985-09-17
JPS58501113A (ja) 1983-07-14
WO1983000415A1 (en) 1983-02-03
EP0083631B1 (de) 1987-10-28
GB2102840B (en) 1985-02-20
EP0083631A1 (de) 1983-07-20
EP0083631A4 (de) 1985-02-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN

8339 Ceased/non-payment of the annual fee