DE3275702D1 - Permanently connecting a set of conductive tracks on a subtrate with a co-operating set on a printed circuit - Google Patents
Permanently connecting a set of conductive tracks on a subtrate with a co-operating set on a printed circuitInfo
- Publication number
- DE3275702D1 DE3275702D1 DE8282303243T DE3275702T DE3275702D1 DE 3275702 D1 DE3275702 D1 DE 3275702D1 DE 8282303243 T DE8282303243 T DE 8282303243T DE 3275702 T DE3275702 T DE 3275702T DE 3275702 D1 DE3275702 D1 DE 3275702D1
- Authority
- DE
- Germany
- Prior art keywords
- subtrate
- printed circuit
- conductive tracks
- permanently connecting
- operating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08119678A GB2100933B (en) | 1981-06-25 | 1981-06-25 | Permanently connecting a set of conductive tracks on a substrate with a cooperating set on a printed circuit. |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3275702D1 true DE3275702D1 (en) | 1987-04-16 |
Family
ID=10522815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282303243T Expired DE3275702D1 (en) | 1981-06-25 | 1982-06-22 | Permanently connecting a set of conductive tracks on a subtrate with a co-operating set on a printed circuit |
Country Status (5)
Country | Link |
---|---|
US (1) | US4457796A (de) |
EP (1) | EP0068793B1 (de) |
JP (1) | JPS5830193A (de) |
DE (1) | DE3275702D1 (de) |
GB (1) | GB2100933B (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594096A (ja) * | 1982-06-30 | 1984-01-10 | 日本メクトロン株式会社 | 異種回路基板相互の接続方法 |
FR2547680B1 (fr) * | 1983-06-15 | 1985-10-04 | Asulab Sa | Procede de connexion de deux conducteurs |
JPS61501924A (ja) * | 1984-04-19 | 1986-09-04 | アンプ インコ−ポレ−テツド | 異方導電性接着剤組成物 |
EP0179805A1 (de) * | 1984-04-19 | 1986-05-07 | AMP INCORPORATED (a New Jersey corporation) | Anisotropische leitfähige haftzusammensetzung |
US4626309A (en) * | 1984-07-02 | 1986-12-02 | Motorola, Inc. | Selective bonding interconnection mask |
GB2170612A (en) * | 1985-02-01 | 1986-08-06 | Stc Plc | Liquid crystal cells |
US4661192A (en) * | 1985-08-22 | 1987-04-28 | Motorola, Inc. | Low cost integrated circuit bonding process |
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US5262229A (en) * | 1991-11-04 | 1993-11-16 | United Technical Products, Inc. | Conductive releasable adhesive and method of making same |
US5275856A (en) * | 1991-11-12 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
US5308667A (en) * | 1992-10-16 | 1994-05-03 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
US6741221B2 (en) * | 2001-02-15 | 2004-05-25 | Integral Technologies, Inc. | Low cost antennas using conductive plastics or conductive composites |
US7034403B2 (en) * | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2771969A (en) * | 1952-11-26 | 1956-11-27 | Gulton Ind Inc | Method for joining metallic and ceramic members |
US3134930A (en) * | 1961-11-17 | 1964-05-26 | Electro Optical Systems Inc | Microminiature circuitry |
US3406126A (en) * | 1966-12-07 | 1968-10-15 | Avco Corp | Conductive synthetic resin composition containing carbon filaments |
GB1311659A (en) * | 1969-07-30 | 1973-03-28 | Secr Defence | Electrical device substrates |
CA977953A (en) * | 1970-04-15 | 1975-11-18 | Charles Davidoff | Metal-containing fibrous material |
NL7016929A (de) * | 1970-11-19 | 1972-05-24 | ||
US3774232A (en) * | 1971-11-11 | 1973-11-20 | Circuit Stik Inc | Package for integrated circuit chip |
US3743890A (en) * | 1972-01-03 | 1973-07-03 | Gte Automatic Electric Lab Inc | Diode matrix card assembly with conductive elastomeric material connectors |
US3823252A (en) * | 1972-10-26 | 1974-07-09 | Owens Illinois Inc | Conducting element having bundled substantially parallel crystalline conductors and process for manufacture |
US3972755A (en) * | 1972-12-14 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Dielectric circuit board bonding |
US4012117A (en) * | 1974-07-29 | 1977-03-15 | Rca Corporation | Liquid crystal module |
JPS5237744A (en) * | 1975-09-19 | 1977-03-23 | Seiko Epson Corp | Electronic desk computer with liquid crystal display |
CA1097495A (en) * | 1976-05-24 | 1981-03-17 | James H. Aumiller | Electrically conductive adhesive |
CH634422A5 (de) * | 1978-10-27 | 1983-01-31 | Bbc Brown Boveri & Cie | Anzeigeelement mit zwei planparallelen, durch abstandshalter in einem abstand voneinander gehaltenen platten. |
US4587038A (en) * | 1980-06-26 | 1986-05-06 | Canon Kabushiki Kaisha | Electro-optic display device and a method of producing the same |
US4388132A (en) * | 1981-06-01 | 1983-06-14 | Burroughs Corporation | Method of attaching a protective film to an integrated circuit |
US4413257A (en) * | 1981-07-13 | 1983-11-01 | Beckman Instruments, Inc. | Conductive particle lead termination for an electro-optic display |
-
1981
- 1981-06-25 GB GB08119678A patent/GB2100933B/en not_active Expired
-
1982
- 1982-06-10 US US06/386,859 patent/US4457796A/en not_active Expired - Fee Related
- 1982-06-22 DE DE8282303243T patent/DE3275702D1/de not_active Expired
- 1982-06-22 EP EP82303243A patent/EP0068793B1/de not_active Expired
- 1982-06-24 JP JP57109108A patent/JPS5830193A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB2100933B (en) | 1985-04-17 |
US4457796A (en) | 1984-07-03 |
EP0068793A3 (en) | 1984-05-02 |
GB2100933A (en) | 1983-01-06 |
EP0068793A2 (de) | 1983-01-05 |
JPS5830193A (ja) | 1983-02-22 |
EP0068793B1 (de) | 1987-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: STC P.L.C., LONDON, GB |
|
8328 | Change in the person/name/address of the agent |
Free format text: WALLACH, C., DIPL.-ING. KOCH, G., DIPL.-ING. HAIBACH, T., DIPL.-PHYS. DR.RER.NAT. FELDKAMP, R., DIPL.-ING., PAT.-ANW., 8000 MUENCHEN |
|
8363 | Opposition against the patent | ||
8331 | Complete revocation |