DE3269823D1 - Electroless nickel-boron plating - Google Patents

Electroless nickel-boron plating

Info

Publication number
DE3269823D1
DE3269823D1 DE8282304210T DE3269823T DE3269823D1 DE 3269823 D1 DE3269823 D1 DE 3269823D1 DE 8282304210 T DE8282304210 T DE 8282304210T DE 3269823 T DE3269823 T DE 3269823T DE 3269823 D1 DE3269823 D1 DE 3269823D1
Authority
DE
Germany
Prior art keywords
electroless nickel
boron plating
plating
boron
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282304210T
Other languages
German (de)
English (en)
Inventor
Glenn O Mallory
Theresa Horhn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Richardson Chemical Co
Original Assignee
Richardson Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Richardson Chemical Co filed Critical Richardson Chemical Co
Application granted granted Critical
Publication of DE3269823D1 publication Critical patent/DE3269823D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8282304210T 1981-08-24 1982-08-10 Electroless nickel-boron plating Expired DE3269823D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29552381A 1981-08-24 1981-08-24

Publications (1)

Publication Number Publication Date
DE3269823D1 true DE3269823D1 (en) 1986-04-17

Family

ID=23138067

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282304210T Expired DE3269823D1 (en) 1981-08-24 1982-08-10 Electroless nickel-boron plating

Country Status (4)

Country Link
EP (1) EP0073583B1 (fr)
JP (1) JPS5842766A (fr)
CA (1) CA1176404A (fr)
DE (1) DE3269823D1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
JPH01222064A (ja) * 1988-03-02 1989-09-05 Hitachi Ltd 化学ニッケルめっき液およびそれを使用する方法
JP2002226974A (ja) * 2000-11-28 2002-08-14 Ebara Corp 無電解Ｎｉ−Ｂめっき液、電子デバイス装置及びその製造方法
US6645567B2 (en) * 2001-12-19 2003-11-11 Intel Corporation Electroless plating bath composition and method of using
JP2013028866A (ja) * 2006-03-09 2013-02-07 Okuno Chemical Industries Co Ltd 無電解ニッケルめっき液
JP5344416B2 (ja) * 2006-03-09 2013-11-20 奥野製薬工業株式会社 自己触媒型無電解ニッケルめっき液用耐折り曲げ性向上剤及び自己触媒型無電解ニッケルめっき液
CN111118480B (zh) * 2020-01-14 2022-02-11 常州大学 一种低温化学镀Ni-B二元合金层的化学镀液及化学镀方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1198167B (de) * 1958-11-26 1965-08-05 Du Pont Waessriges Bad zur chemischen Abscheidung von UEberzuegen aus Nickel-Bor- oder Kobalt-Bor-Legierungen
US4139660A (en) * 1963-07-16 1979-02-13 Bernhard Joos Method for increasing solid surface tension
GB1360592A (en) * 1973-02-14 1974-07-17 Rca Corp Electroless cobalt plating bath
US4019910A (en) * 1974-05-24 1977-04-26 The Richardson Chemical Company Electroless nickel polyalloy plating baths
US4151311A (en) * 1976-01-22 1979-04-24 Nathan Feldstein Post colloid addition of catalytic promoters to non noble metal principal catalytic compounds in electroless plating catalysts
IT1070268B (it) * 1976-10-19 1985-03-29 Alfachimici Spa Composizione per la deposizione anelettrica di leghe a base di nichelio
US4259376A (en) * 1977-09-16 1981-03-31 Nathan Feldstein Catalytic promoters in electroless plating catalysts applied as an emulsion
GB2066857A (en) * 1980-01-07 1981-07-15 Vmei Lenin Nis >Method for the production of an abrasive surface

Also Published As

Publication number Publication date
JPS5842766A (ja) 1983-03-12
EP0073583B1 (fr) 1986-03-12
CA1176404A (fr) 1984-10-23
JPH0153352B2 (fr) 1989-11-14
EP0073583A1 (fr) 1983-03-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition