DE3242856A1 - Verfahren zum festklemmen und kuehlen eines halbleiterplaettchens waehrend seiner bearbeitung - Google Patents

Verfahren zum festklemmen und kuehlen eines halbleiterplaettchens waehrend seiner bearbeitung

Info

Publication number
DE3242856A1
DE3242856A1 DE19823242856 DE3242856A DE3242856A1 DE 3242856 A1 DE3242856 A1 DE 3242856A1 DE 19823242856 DE19823242856 DE 19823242856 DE 3242856 A DE3242856 A DE 3242856A DE 3242856 A1 DE3242856 A1 DE 3242856A1
Authority
DE
Germany
Prior art keywords
pressure plate
fluid
plate
pressure
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19823242856
Other languages
German (de)
English (en)
Inventor
Robert Billings Bramhall jun.
Norman Leonard Gloucester Mass. Turner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of DE3242856A1 publication Critical patent/DE3242856A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19823242856 1981-11-24 1982-11-19 Verfahren zum festklemmen und kuehlen eines halbleiterplaettchens waehrend seiner bearbeitung Withdrawn DE3242856A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US32451281A 1981-11-24 1981-11-24

Publications (1)

Publication Number Publication Date
DE3242856A1 true DE3242856A1 (de) 1983-06-01

Family

ID=23263921

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823242856 Withdrawn DE3242856A1 (de) 1981-11-24 1982-11-19 Verfahren zum festklemmen und kuehlen eines halbleiterplaettchens waehrend seiner bearbeitung

Country Status (5)

Country Link
JP (1) JPS5893247A (nl)
DE (1) DE3242856A1 (nl)
FR (1) FR2517124A1 (nl)
GB (1) GB2109996B (nl)
NL (1) NL8204560A (nl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396005B2 (en) 2004-10-01 2008-07-08 Unaxis International Trading Ltd. Clamping device and transport mechanism for transporting substrates

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0775158B2 (ja) * 1986-05-20 1995-08-09 東京エレクトロン株式会社 半導体製造装置用高真空チヤンバ−における駆動装置
JPH0770297B2 (ja) * 1986-05-20 1995-07-31 東京エレクトロン株式会社 イオン注入装置におけるウエハ保持装置
US5044314A (en) * 1986-10-15 1991-09-03 Advantage Production Technology, Inc. Semiconductor wafer processing apparatus
US4938815A (en) * 1986-10-15 1990-07-03 Advantage Production Technology, Inc. Semiconductor substrate heater and reactor process and apparatus
US4956046A (en) * 1986-10-15 1990-09-11 Advantage Production Technology, Inc. Semiconductor substrate treating method
US4778559A (en) * 1986-10-15 1988-10-18 Advantage Production Technology Semiconductor substrate heater and reactor process and apparatus
US4891335A (en) * 1986-10-15 1990-01-02 Advantage Production Technology Inc. Semiconductor substrate heater and reactor process and apparatus
US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
CN110379729B (zh) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 加热基座及半导体加工设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
FR2501907A1 (fr) * 1981-03-13 1982-09-17 Thomson Csf Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396005B2 (en) 2004-10-01 2008-07-08 Unaxis International Trading Ltd. Clamping device and transport mechanism for transporting substrates

Also Published As

Publication number Publication date
GB2109996A (en) 1983-06-08
FR2517124B1 (nl) 1985-02-15
FR2517124A1 (fr) 1983-05-27
NL8204560A (nl) 1983-06-16
JPS5893247A (ja) 1983-06-02
GB2109996B (en) 1985-08-07

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: BERNHARDT, K., DIPL.-ING., PAT.-ANW., 8000 MUENCHE

8139 Disposal/non-payment of the annual fee