DE3170125D1 - A soldering method and apparatus - Google Patents
A soldering method and apparatusInfo
- Publication number
- DE3170125D1 DE3170125D1 DE8181106012T DE3170125T DE3170125D1 DE 3170125 D1 DE3170125 D1 DE 3170125D1 DE 8181106012 T DE8181106012 T DE 8181106012T DE 3170125 T DE3170125 T DE 3170125T DE 3170125 D1 DE3170125 D1 DE 3170125D1
- Authority
- DE
- Germany
- Prior art keywords
- soldering method
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10510780A JPS5731195A (en) | 1980-08-01 | 1980-08-01 | Method of soldering leadless electric part |
JP53381 | 1981-01-08 | ||
JP56053040A JPS57169295A (en) | 1981-04-10 | 1981-04-10 | Method of soldering electric part or like |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3170125D1 true DE3170125D1 (en) | 1985-05-30 |
Family
ID=27274501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8181106012T Expired DE3170125D1 (en) | 1980-08-01 | 1981-07-30 | A soldering method and apparatus |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0045909B1 (de) |
CA (1) | CA1159575A (de) |
DE (1) | DE3170125D1 (de) |
GB (1) | GB2083773B (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3111809C2 (de) * | 1981-03-25 | 1985-05-15 | Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen | Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken |
GB2117690B (en) * | 1982-04-02 | 1986-01-08 | Zevatron Gmbh | Apparatus for soldering workpieces |
DE4402758A1 (de) * | 1994-01-31 | 1995-08-03 | Moedinger Volker | Verfahren zum Aufbringen von Flußmittel auf Leiterplatten |
US5509598A (en) * | 1994-05-31 | 1996-04-23 | The Boc Group, Inc. | Wave soldering apparatus and process |
DE19955659A1 (de) * | 1999-11-19 | 2001-05-31 | Messer Griesheim Gmbh | Verfahren und Vorrichtung zum flussmittelfreien Löten mit reaktivgasangereicherten Metallschmelzen |
CN109392299B (zh) * | 2017-08-08 | 2022-03-29 | 伊利诺斯工具制品有限公司 | 锡膏喷嘴、工作台和加锡膏装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3705457A (en) * | 1970-11-02 | 1972-12-12 | Electrovert Mfg Co Ltd | Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces |
JPS5376372A (en) * | 1976-12-17 | 1978-07-06 | Matsushita Electric Ind Co Ltd | Device for attaching chip circuit parts |
US4093113A (en) * | 1977-02-08 | 1978-06-06 | Usm Corporation | Seam soldering mechanism |
-
1981
- 1981-07-28 GB GB8123286A patent/GB2083773B/en not_active Expired
- 1981-07-30 DE DE8181106012T patent/DE3170125D1/de not_active Expired
- 1981-07-30 EP EP81106012A patent/EP0045909B1/de not_active Expired
- 1981-07-31 CA CA000383012A patent/CA1159575A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0045909A1 (de) | 1982-02-17 |
GB2083773A (en) | 1982-03-31 |
EP0045909B1 (de) | 1985-04-24 |
CA1159575A (en) | 1983-12-27 |
GB2083773B (en) | 1984-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8328 | Change in the person/name/address of the agent |
Free format text: SCHMIDT, H., DIPL.-ING. DR.-ING., PAT.-ANW., 8000 MUENCHEN |