DE3070125D1 - Air-cooled hybrid electronic package - Google Patents

Air-cooled hybrid electronic package

Info

Publication number
DE3070125D1
DE3070125D1 DE8080106640T DE3070125T DE3070125D1 DE 3070125 D1 DE3070125 D1 DE 3070125D1 DE 8080106640 T DE8080106640 T DE 8080106640T DE 3070125 T DE3070125 T DE 3070125T DE 3070125 D1 DE3070125 D1 DE 3070125D1
Authority
DE
Germany
Prior art keywords
air
electronic package
hybrid electronic
cooled hybrid
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080106640T
Other languages
English (en)
Inventor
Frank Edward Andros
Ghazaros Krikor Kerjilian
Bert Edgar Stevens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3070125D1 publication Critical patent/DE3070125D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE8080106640T 1979-12-26 1980-10-29 Air-cooled hybrid electronic package Expired DE3070125D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/106,966 US4291364A (en) 1979-12-26 1979-12-26 Air-cooled hybrid electronic package

Publications (1)

Publication Number Publication Date
DE3070125D1 true DE3070125D1 (en) 1985-03-21

Family

ID=22314170

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080106640T Expired DE3070125D1 (en) 1979-12-26 1980-10-29 Air-cooled hybrid electronic package

Country Status (5)

Country Link
US (1) US4291364A (de)
EP (1) EP0031419B1 (de)
JP (1) JPS5836519B2 (de)
CA (1) CA1133106A (de)
DE (1) DE3070125D1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3321321A1 (de) * 1982-06-19 1983-12-22 Ferranti plc, Gatley, Cheadle, Cheshire Elektrische schaltungsanordnung
FR2545274B1 (fr) * 1983-04-29 1985-07-05 Thomson Csf Procede de fabrication d'un dissipateur thermique a picots et dissipateur obtenu par ce procede
US4628992A (en) * 1984-01-23 1986-12-16 At&T Information Systems Induced flow heat exchanger
US4644443A (en) * 1985-09-27 1987-02-17 Texas Instruments Incorporated Computer cooling system using recycled coolant
US4769557A (en) * 1987-02-19 1988-09-06 Allen-Bradley Company, Inc. Modular electric load controller
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
US4931904A (en) * 1989-05-30 1990-06-05 Motorola, Inc. Localized circuit card cooling device
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
JP2544497B2 (ja) * 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置
US5097385A (en) * 1990-04-18 1992-03-17 International Business Machines Corporation Super-position cooling
JP2934493B2 (ja) * 1990-10-24 1999-08-16 株式会社日立製作所 電子機器の冷却装置
US5208729A (en) * 1992-02-14 1993-05-04 International Business Machines Corporation Multi-chip module
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US5351748A (en) * 1993-01-21 1994-10-04 Baruch Dagan Tubular pin fin heat sink for electronic components
US5416427A (en) * 1993-02-11 1995-05-16 Tracewell Enclosures, Inc. Test and development apparatus for bus-based circuit modules with open side and backplane access features
US5548486A (en) * 1994-01-21 1996-08-20 International Business Machines Corporation Pinned module
US5717572A (en) * 1995-02-15 1998-02-10 Unisys Corporation Passively cooled display door
US5878483A (en) * 1995-06-01 1999-03-09 International Business Machines Corporation Hammer for forming bulges in an array of compliant pin blanks
US5604665A (en) * 1995-06-30 1997-02-18 International Business Machines Corporation Multiple parallel impingement flow cooling with tuning
US6661666B1 (en) 2002-09-24 2003-12-09 Agilent Technologies, Inc. Device for enhancing the local cooling of electronic packages subject to laminar air flow
US7347267B2 (en) * 2004-11-19 2008-03-25 Halliburton Energy Services, Inc. Method and apparatus for cooling flasked instrument assemblies
US7751189B2 (en) * 2007-09-07 2010-07-06 Intel Corporation Cooling arrangement to cool components on circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2138376C3 (de) * 1971-07-31 1978-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kühlsystem für in Schränken untergebrachte elektronische Geräte
DE2162390A1 (de) * 1971-12-16 1973-06-20 Krupp Gmbh Verfahren zur erzeugung von spaltgas und vorrichtung zur durchfuehrung des verfahrens
US4019098A (en) * 1974-11-25 1977-04-19 Sundstrand Corporation Heat pipe cooling system for electronic devices
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4259843A (en) * 1979-10-09 1981-04-07 Cromemco Inc. Isolation chamber for electronic devices
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules

Also Published As

Publication number Publication date
EP0031419B1 (de) 1985-02-06
JPS5694798A (en) 1981-07-31
CA1133106A (en) 1982-10-05
EP0031419A3 (en) 1983-01-26
JPS5836519B2 (ja) 1983-08-09
US4291364A (en) 1981-09-22
EP0031419A2 (de) 1981-07-08

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee