DE3063310D1 - Lead frame carrier, in particular for integrated circuit housing, and housing comprising such a carrier - Google Patents

Lead frame carrier, in particular for integrated circuit housing, and housing comprising such a carrier

Info

Publication number
DE3063310D1
DE3063310D1 DE8080400971T DE3063310T DE3063310D1 DE 3063310 D1 DE3063310 D1 DE 3063310D1 DE 8080400971 T DE8080400971 T DE 8080400971T DE 3063310 T DE3063310 T DE 3063310T DE 3063310 D1 DE3063310 D1 DE 3063310D1
Authority
DE
Germany
Prior art keywords
carrier
housing
integrated circuit
lead frame
circuit housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080400971T
Other languages
English (en)
Inventor
Yves Dardelet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE3063310D1 publication Critical patent/DE3063310D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE8080400971T 1979-07-17 1980-06-27 Lead frame carrier, in particular for integrated circuit housing, and housing comprising such a carrier Expired DE3063310D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7918465A FR2462024A1 (fr) 1979-07-17 1979-07-17 Plate-forme support de grille de connexion, notamment pour boitier de circuits integres, et boitier comportant une telle plate-forme

Publications (1)

Publication Number Publication Date
DE3063310D1 true DE3063310D1 (en) 1983-07-07

Family

ID=9227968

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080400971T Expired DE3063310D1 (en) 1979-07-17 1980-06-27 Lead frame carrier, in particular for integrated circuit housing, and housing comprising such a carrier

Country Status (3)

Country Link
EP (1) EP0023165B1 (de)
DE (1) DE3063310D1 (de)
FR (1) FR2462024A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0163081B1 (de) * 1984-05-02 1990-01-17 GTE Products Corporation Verfahren zum Herstellen eines gekapselten IC-Plättchens
DE3572566D1 (en) * 1984-05-02 1989-09-28 Gte Prod Corp Method of making lead frame support for ic chip
ATE48205T1 (de) * 1984-05-02 1989-12-15 Gte Prod Corp Verfahren zum herstellen eines in einem gehaeuse montierten ic-plaettchens.
DE3566476D1 (en) * 1984-05-02 1988-12-29 Gte Prod Corp Packaged integrated circuit chip
JP2569717B2 (ja) * 1987-06-05 1997-01-08 日本電装株式会社 樹脂封止型半導体装置およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3559002A (en) * 1968-12-09 1971-01-26 Gen Electric Semiconductor device with multiple shock absorbing and passivation layers
IT993429B (it) * 1973-09-26 1975-09-30 Sgs Ates Componenti Perfezionamento di una cassa per dispositivo a semiconduttori
US4012765A (en) * 1975-09-24 1977-03-15 Motorola, Inc. Lead frame for plastic encapsulated semiconductor assemblies
US4084312A (en) * 1976-01-07 1978-04-18 Motorola, Inc. Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies

Also Published As

Publication number Publication date
FR2462024B1 (de) 1983-03-18
EP0023165B1 (de) 1983-05-18
FR2462024A1 (fr) 1981-02-06
EP0023165A1 (de) 1981-01-28

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee