DE3024030A1 - RC-Network film circuits - made using a polyimide film support coated on both sides with a poly:fluoroethylene-propylene! polymer - Google Patents

RC-Network film circuits - made using a polyimide film support coated on both sides with a poly:fluoroethylene-propylene! polymer

Info

Publication number
DE3024030A1
DE3024030A1 DE19803024030 DE3024030A DE3024030A1 DE 3024030 A1 DE3024030 A1 DE 3024030A1 DE 19803024030 DE19803024030 DE 19803024030 DE 3024030 A DE3024030 A DE 3024030A DE 3024030 A1 DE3024030 A1 DE 3024030A1
Authority
DE
Germany
Prior art keywords
propylene
sides
polyimide film
layers
fluoroethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19803024030
Other languages
German (de)
Inventor
Helmold Dipl.-Phys. 8000 München Kausche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19803024030 priority Critical patent/DE3024030A1/en
Publication of DE3024030A1 publication Critical patent/DE3024030A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10045—Mounted network component having plural terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

in the form of a film circuit comprises a carrier film of polyimide film coated on both sides with fluoroethylene- propylene polymer, with applied conductor tracks, resistance layers and condensors. The coating layers of fluoroethylene- propylene are e.g. only ca. 2.5 micrometres thick. In an example, polyimide carrier film (1) is pref. 30-50 microns thick and is coated on both sides with polyfluoroethylene- propylene layers (2) ca. 2.5 micrometres thick. The coated polyimide film substrate has good temp. resistance, excellent interlayer adhesion and allows the formation of condensers (esp. with glow discharge polymeric dielectrics) with improved regenerative properties.

Description

RC-Netzwerk in Form einer Folienschaltung.RC network in the form of a membrane circuit.

Die vorliegende Erfindung betrifft ein RC-Netzwerk in Form einer Folienschaltung, welches eine Polyimidfolie als Substrat und darauf aufgebrachte Leiterbahnen und Widerstandsschichten und Kondensatoren enthält. Ein derartiges RC-Netzwerk ist aus der DE-OS 2834906 bekannt.The present invention relates to an RC network in the form of a membrane circuit, which a polyimide film as a substrate and conductor tracks applied to it and Contains resistive layers and capacitors. Such an RC network is off the DE-OS 2834906 known.

Dort ist für das Substrat eine ganze Reihe von Folienmaterialien angegeben. Von diesen Materialien erfüllt jedoch keines alle Bedingungen, die für hochwertige RC-Netzwerke erforderlich sind.A whole range of film materials is specified there for the substrate. However, none of these materials meet all the requirements for high quality RC networks are required.

Die Aufgabe, die der vorliegenden Erfindung zugrundiiegt, besteht darin, daß das RC-Netzwerk einerseits temperatur beständig ist, daß andererseits Kondensatoren mit einem hochwertigen Dielektrikum ausreichend regenerierfähig sind und daß die einzelnen Schichten gut aufeinander haften.The object on which the present invention is based exists in the fact that the RC network is temperature resistant on the one hand, and that on the other Capacitors with a high-quality dielectric are sufficiently regenerative and that the individual layers adhere well to one another.

Diese Aufgabe wird bei einem RC-Netzwerk der eingangs beschriebenen Art dadurch gelöst, daß als Substrat eine Polyimidfolie dient, die beidseitig mit Polyfluoräthylenr propylen beschichtet ist.In the case of an RC network, this task becomes the one described at the beginning Art solved in that a polyimide film is used as the substrate, which is on both sides with Polyfluoräthylenr propylene is coated.

Die Polyimidfolie ist zwar temperaturbeständig, unterstützt aber die Regenerierfähigkeit nicht. Eine Folie aus Polyfluoräthylenpropylen ist wiederum weniger temperatulW beständig und relativ weich, so daß Kontakte auf dieser Folie nicht mit der notwendigen Haltbarkeit angebracht werden können. Außerdem treten bei Verwendung dieser Folie in der Schaltung Schäden durch plastisches Verformen der Folie beim Umrollen von einer Rolle auf eine andere auf.The polyimide film is temperature-resistant, but supports the Regenerative ability not. A film made of polyfluoroethylene propylene is again less temperature resistant and relatively soft, so that contacts on this slide cannot be attached with the necessary durability. Also kick if this foil is used in the circuit, damage due to plastic deformation the film on when it is rolled from one roll to another.

Eine Verbundfolie aus Polyimid und Polyfluoräthylenpropy len scheint zunächst ungünstig, da diese beiden Stoffe unterschiedliche Ausdehnungskoeffizienten besitzen. Erst durch die beidseitige Beschichtung der Polyimidfolie wird ein Einrollen bei der Bearbeitung unter Temperaturbelastung verhindert.A composite film made of polyimide and Polyfluoräthylenpropy len seems initially unfavorable because these two substances have different coefficients of expansion own. Only when the polyimide film is coated on both sides does it curl up prevented during processing under thermal stress.

Die Polyfluoräthylenpropylenschichten fördern die Regenerierfähigkeit, so daß Kondensatoren mit einem Dielektrikum aus Glimmpolymerisatschichten aufgebracht werden können. Polyfluoräthylenpropylen weist auch sowohl gegenüber dem Polyimid als auch gegenüber den Materialien der Kondensatoren eine ausreichende Haftung auf.The polyfluoroethylene propylene layers promote the ability to be regenerated, so that capacitors are applied with a dielectric made of glow polymer layers can be. Polyfluoroethylene propylene also exhibits against both the polyimide as well as sufficient adhesion to the materials of the capacitors.

Die Polyimidfolie weist zweckmäßig eine für die Verarbeitung günstige Dicke von etwa 30 bis 50# auf, während die Polyfluoräthylenpropylenschichten vorteilhaft nur etwa 2,5- dick sind. Dadurch wird der Einfluß der untersch~ lichen Ausdehnungskoeffizienten besonders klein gehalten.The polyimide film expediently has one which is favorable for processing Thickness of about 30 to 50 #, while the polyfluoroethylene propylene layers are advantageous are only about 2.5- thick. This reduces the influence of the different expansion coefficients kept particularly small.

Die zweiseitige Beschichtung der Polyimidfolie mit Polyfluoräthylenpropylen ist unabhängig davon vorteilhaft, ob die Folie einseitig oder beidseitig mit elektrischen Bauelementen und/oder Leiterbahnen beschichtet ist.The two-sided coating of the polyimide film with polyfluoroethylene propylene is advantageous regardless of whether the film is one-sided or both-sided with electrical Components and / or conductor tracks is coated.

Die Erfindung wird nun anhand einer Figur näher erläutert.The invention will now be explained in more detail with reference to a figure.

Sie ist nicht auf das in der Figur gezeigte Beispiel beschränkt. Die Figur zeigt ein erfindungsgemäßes RC-Netzwerk in geschnittener Ansicht.It is not limited to the example shown in the figure. the Figure shows an inventive RC network in a sectional view.

Auf eine Substratfolie 1 aus Polyimid sind beidseitig Schichten 2 aus Polyfluoräthylenpropylen aufgebracht.Layers 2 are on both sides of a substrate film 1 made of polyimide applied from polyfluoroethylene propylene.

Auf einer dieser Schichten 2 ist ein RC-Netzwerk aufgebracht, welches im vorliegenden Beispiel aus einer Serienschaltung eines Widerstandes 3 und eines Kondensators 4 besteht. Der Kondensator 4 enthält ein hochwertiges Dielektrikum 5, welches vorzugsweise aus einer Glimmpoly-4 # fl ß q merisatschicht besteht, und zwei gegenpolige Beläge 6 und 7, welche mit Kontaktflächen 8 bzw. 9 elektrisch leitend verbunden sind. Der Widerstand 3 ist mit der Kontaktfläche 8 und einer weiteren Kontaktfläche 10 elektrisch leitend verbunden. Hierzu reicht die Widerstandsschicht 11 unter die Kontaktflächen 8 und 9. Der Belag 7 des Kondensators 4 kann aus der Widerstandsschicht 11 gebildet sein.An RC network is applied to one of these layers 2, which in the present example from a series circuit of a resistor 3 and one Capacitor 4 is made. The capacitor 4 contains a high quality dielectric 5, which preferably consists of a Glimmpoly-4 # fl ß q merisate layer consists, and two oppositely poled pads 6 and 7, which with contact surfaces 8 and 9, respectively are electrically connected. The resistor 3 is connected to the contact surface 8 and a further contact surface 10 connected in an electrically conductive manner. This is enough the resistance layer 11 under the contact surfaces 8 and 9. The coating 7 of the capacitor 4 can be formed from the resistance layer 11.

Der Belag 6 überlappt vorteilhaft die Widerstandsschicht 11, reicht aber nicht ganz an die Kontaktfläche 6 heran.The covering 6 advantageously overlaps the resistance layer 11, is sufficient but not quite close to the contact surface 6.

So ergibt sich eine gegen mechanische Beanspruchung unempfindliche Anordnung, da die Widerstandsschicht 11 und der Belag 6 sehr dünn sind und ein direkter Kontakt zwischen dem Belag 6 und der Kontaktfläche 8 bei einer mechanischen Beanspruchung des Netzwerkes aufbrechen und z.B. als Wackelkontakt stören könnte. Dieser Aufbau ist insbesondere für einen regenerierfähig dünnen Belag 6 vorteilhaft. Er gewährleistet auch auf den relativ weichen, verformbaren Polyfluoräthylenpropylenschichten eine sichere, dauerhafte Kontaktierung.This results in one that is insensitive to mechanical stress Arrangement, since the resistance layer 11 and the coating 6 are very thin and a direct one Contact between the covering 6 and the contact surface 8 in the event of mechanical stress of the network and could disrupt it as a loose contact, for example. This structure is particularly advantageous for a regenerable thin covering 6. He guarantees also on the relatively soft, deformable polyfluoroethylene propylene layers safe, permanent contact.

Die Schicht 2 aus Polyfluoräthylenprapylen fördert die Regenerierfähigkeit des Kondensators 4 und weist infolge der Stützung durch die Polyimidfolie 1 auch bei Erhitzung des Widerstandes 3 eine ausreichende mechanische Stabilität auf.The layer 2 made of polyfluoroethylene-propylene promotes the ability to regenerate of the capacitor 4 and, as a result of the support by the polyimide film 1, also has when the resistor 3 is heated, there is sufficient mechanical stability.

4 Patentansprüche 1 Figur4 claims 1 figure

Claims (4)

Patentansprüche (3 RC-Netzwerk in Form einer Folienschaltung, welches eine Polyimidfolie als Substrat und darauf aufgebrachte Leiterbahnen und Widerstands schichten und Kondensatoren enthält, d a d u r c h g e k e n n z e i c h n e t, daß die Polyimidfolie beidseitig mit Polyfluoräthylenpropylen beschichtet ist. Claims (3 RC network in the form of a membrane circuit, which a polyimide film as a substrate and conductor tracks and resistor applied to it contains layers and capacitors, that the polyimide film is coated on both sides with polyfluoroethylene propylene. 2. RC-Netzwerk nach Anspruch 1, d a d u r c h g e -k e n n z e i c h n e t, daß die Kondensatoren als Dielektrikum Glimmpolymerisatschichten enthalten. 2. RC network according to claim 1, d a d u r c h g e -k e n n z e i c h n e t that the capacitors contain glow polymer layers as dielectric. 3. RC-Netzwerk nach einem der Ansprtlche 1 oder 2, d a -d u r c h g e k e n n z e i c h n e t, daß die Polyfluoräthylenpropylenschichten nur etwa 2,5#im dick sind. 3. RC network according to one of claims 1 or 2, d a -d u r c h it is not noted that the polyfluoroethylene propylene layers are only about 2.5 # im thick. 4. RC-Netzwerk nach einem der AnsprUche 1 bis 3, d a -d u r c h g e k e n n z e i c h n e t, daß der freiliegende Belag (6) des Kondensators (4) die Widerstandsschicht (11) in der Nähe der entsprechenden Kontaktfläche (8) überlappt und nur über diese Widerstandsschicht (11) mit der Kontaktfläche (8) elektrisch leitend verbunden ist. 4. RC network according to one of claims 1 to 3, d a -d u r c h g e k e n n n z e i c h n e t that the exposed coating (6) of the capacitor (4) the Resistance layer (11) in the vicinity of the corresponding contact surface (8) overlaps and only via this resistance layer (11) electrically with the contact surface (8) is conductively connected.
DE19803024030 1980-06-26 1980-06-26 RC-Network film circuits - made using a polyimide film support coated on both sides with a poly:fluoroethylene-propylene! polymer Withdrawn DE3024030A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19803024030 DE3024030A1 (en) 1980-06-26 1980-06-26 RC-Network film circuits - made using a polyimide film support coated on both sides with a poly:fluoroethylene-propylene! polymer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803024030 DE3024030A1 (en) 1980-06-26 1980-06-26 RC-Network film circuits - made using a polyimide film support coated on both sides with a poly:fluoroethylene-propylene! polymer

Publications (1)

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DE3024030A1 true DE3024030A1 (en) 1982-01-14

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DE19803024030 Withdrawn DE3024030A1 (en) 1980-06-26 1980-06-26 RC-Network film circuits - made using a polyimide film support coated on both sides with a poly:fluoroethylene-propylene! polymer

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2593016A1 (en) * 1986-01-14 1987-07-17 Asahi Chem Res Lab METHOD FOR FORMING ELECTRIC CIRCUITS ON A BASE PLATE
FR2593015A1 (en) * 1986-01-14 1987-07-17 Asahi Chem Res Lab METHOD FOR PRODUCING ELECTRIC CIRCUITS ON A BASE PLATE
EP0442674A2 (en) * 1990-02-14 1991-08-21 Eli Lilly And Company Thin film electrical component with polymer substrate
WO1999041832A1 (en) * 1998-02-11 1999-08-19 Bourns, Inc. Passive component integrated circuit chip
US8022603B2 (en) * 2006-02-14 2011-09-20 Delphi Technologies Holding S.Arl Piezoelectric actuator

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE680283C (en) * 1933-07-23 1939-08-26 Telefunken Gmbh Electrical capacitor constructed as a combined resistance and capacitance element
US3252830A (en) * 1958-03-05 1966-05-24 Gen Electric Electric capacitor and method for making the same
DE1962690A1 (en) * 1968-12-16 1970-07-02 Gen Electric Thin-film circuits on flexible dielectric carriers
DE1639061B1 (en) * 1966-10-31 1971-08-26 Western Electric Co DISTRIBUTED RC CIRCUIT IN THIN-LAYER DESIGN
DE2157923A1 (en) * 1970-11-27 1972-06-08 Western Electric Co Method of making a specific RC circuit
DE2356582A1 (en) * 1972-11-16 1974-05-22 Western Electric Co RC NETWORK
US3967222A (en) * 1975-05-27 1976-06-29 Trw Inc. Distributed resistance-capacitance component
DE2805152A1 (en) * 1977-02-08 1978-08-10 Thomson Csf DIELECTRIC COMPOSING AN ORGANIC POLYMERISATE AND PROCESS FOR ITS MANUFACTURING
DE2227751B2 (en) * 1972-06-07 1979-02-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Electric capacitor and process for its manufacture

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE680283C (en) * 1933-07-23 1939-08-26 Telefunken Gmbh Electrical capacitor constructed as a combined resistance and capacitance element
US3252830A (en) * 1958-03-05 1966-05-24 Gen Electric Electric capacitor and method for making the same
DE1639061B1 (en) * 1966-10-31 1971-08-26 Western Electric Co DISTRIBUTED RC CIRCUIT IN THIN-LAYER DESIGN
DE1962690A1 (en) * 1968-12-16 1970-07-02 Gen Electric Thin-film circuits on flexible dielectric carriers
DE2157923A1 (en) * 1970-11-27 1972-06-08 Western Electric Co Method of making a specific RC circuit
DE2227751B2 (en) * 1972-06-07 1979-02-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Electric capacitor and process for its manufacture
DE2356582A1 (en) * 1972-11-16 1974-05-22 Western Electric Co RC NETWORK
US3967222A (en) * 1975-05-27 1976-06-29 Trw Inc. Distributed resistance-capacitance component
DE2805152A1 (en) * 1977-02-08 1978-08-10 Thomson Csf DIELECTRIC COMPOSING AN ORGANIC POLYMERISATE AND PROCESS FOR ITS MANUFACTURING

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DE-Z: Telefunken, RMI, 6509 124, v. 21.03.66, S. 1-8 *
US-Z: Mater.Engng., 89, 1979, 4, S. 38-42, 5S, 2B, 8T *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2593016A1 (en) * 1986-01-14 1987-07-17 Asahi Chem Res Lab METHOD FOR FORMING ELECTRIC CIRCUITS ON A BASE PLATE
FR2593015A1 (en) * 1986-01-14 1987-07-17 Asahi Chem Res Lab METHOD FOR PRODUCING ELECTRIC CIRCUITS ON A BASE PLATE
EP0442674A2 (en) * 1990-02-14 1991-08-21 Eli Lilly And Company Thin film electrical component with polymer substrate
EP0442674A3 (en) * 1990-02-14 1992-02-26 Eli Lilly And Company Thin film electrical component
AU631297B2 (en) * 1990-02-14 1992-11-19 Eli Lilly And Company Thin film electrical component
WO1999041832A1 (en) * 1998-02-11 1999-08-19 Bourns, Inc. Passive component integrated circuit chip
US8022603B2 (en) * 2006-02-14 2011-09-20 Delphi Technologies Holding S.Arl Piezoelectric actuator

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