DE1962690A1 - Thin-film circuits on flexible dielectric carriers - Google Patents

Description

1 River Road
SCHENECTADY, NY / USA

Thin-film circuits on flexible dielectric substrates

The invention relates to integrated electronic circuits (IC) and, more particularly, to circuits having active and passive components on a thin flexible support and a method for their manufacture.

A number of passive circuit components such as capacitors, resistors and inductors can be mounted directly on carriers or documents are provided which are thick or thin and

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are relatively inflexible or flexible. These circuits can be in various combinations on a wide variety of substrates be manufactured to have a predetermined intermediate function or complete puncture in an overall electronic circuit and are therefore known as hybrid circuits. The manufacture of passive components usually includes the application of suitable thin dielectric layers and metallic layers on the substrate as required Sequence in a predetermined geometric arrangement or a subsequently produced geometric arrangement a.

An active circuit element, such as a transistor or a silicon-based integrated circuit (SIC), can can be connected directly to the passive circuit or can initially be connected to intermediate connection devices also known as hybrid interconnectors, and the interconnector can then be used with the passive circuit get connected. If the hybrid circuits need to be connected to each other or to other circuit components, Hybrid interconnect devices can also be provided.

The flexible base can also be used in other ways than a sheet, Strip or tape with the most varied of geometric shapes can be known. An elongated strip part can for example suitably tailored to individual circuits or components on individual squares, rectangles or otherwise defined parts of the strip material. The term "band" also includes some degree of flexibility which allows the tape to be folded or rolled up on itself.

It is desirable to have the aforementioned circuits and components on a very thin and usually freely flexible substrate

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manufacture, preferably on a synthetic resin material in tape form, so that one takes the greatest advantage of the flexibility properties with regard to the final location and use attained. It is also highly desirable to have the circuits and components mentioned in predetermined obtain geometric patterns through quasi-continuous, continuous or high-volume manufacturing processes, so that you get a maximum of economic advantages. In order to keep the overall circuit thin, the characteristic of a capacitor and for the sake of the continuous manufacturing process, however, are very thin dielectric Layers desired. In addition, there are certain problems with the temperature properties of very thin carriers Plastic or synthetic resin and usually with the Separation process for metals associated with high temperatures tied together.

It is therefore an object of this invention to provide an improved combination from a very thin circuit component on a very thin flexible carrier.

It is another object of the invention to provide an improved combination of a thin film capacitor on a thin flexible carrier.

It is a further object of this invention to provide an improved combination of a thin film resistor on a thin one flexible tracer.

It is another object of the invention to provide an improved combination a thin film device with distributed parameter on a thin flexible support.

It is another object of the invention to provide an improved combination of multiple interconnected circuit construction

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-H-

allocate in a thin layer on a thin flexible support deliver.

It is another object of the invention to provide an improved interconnect for hybrid circuits in thin-film technology on one tape.

It is another object of the invention to provide an almost continuous process or a high volume process for manufacture of integrated circuits in thin-film technology.

It is a further object of the invention to provide an improved hybrid circuit on tape and in thin film technology, which contains active and passive circuit elements.

In short, the invention in one of its preferred embodiments includes a very thin, flexible carrier made of one synthetic resin, for example less than about 0.25 mm (0.010 inch) thick. Very thin layers more suitable Metals, such as chromium or copper, are suitably used by vacuum deposition, for example on the strip Layer over the entire surface or in one or more predetermined patterns, which the pattern of a capacitor, a resistor, an inductor or combinations thereof and a predetermined pattern for an electronic Can form circuit applied. The capacitor parts of the metal layer are suitably with a very thin layer of dielectric material covered, for example by photopolymerization of anhydrides and dianhydrides, Another metal layer is then used to serve as the capacitor electrode on the opposite side. the The above components or circuits are suitable for continuous manufacturing processes or high-volume manufacturing processes in static or dynamic production.

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ORIGINAL BATHROOM

The invention is illustrated in connection with the following Description of the images.

Pig. 1 is an illustration of passive circuit components on a carrier in the form of a flexible tape made from a synthetic plastic.

Pig. Figure 2 is a schematic representation of an applicable manufacturing process for making the circuit according to Pig. I.

Pig. 3 is a schematic representation of a transmission wheel for transmitting a map of the circuit.

Fig. 4 is a schematic representation of an arrangement which continuous ultra-violet deposition of dielectric on a flexible tape.

PIg. Figure 5 is an illustration of a larger piece of flexible Tape with a variety of capacitors.

Pig. 6 is an illustration of a modification of the capacitor band according to Fig. 5

PIg. Figure 7 is an illustration of a greater length of flexible Tape with a variety of resistances.

Fig. 8 is an illustration of the tape applied Circuit of FIGS. 1, 5, 6 and 7 in coiled form and inserted into a cup.

Flg. Figure 9 is an illustration of an interconnector for hybrids Circuits on a tape (HTI).

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Pig. 1 is an illustration of an exemplary embodiment of the invention incorporating a thin film capacitor and a Contains resistance element on a thin flexible tape. The circuit 10 shown in Fig. 1 on a tape (HTC) closes a thin flexible tape 11, which is slightly flexible because of its small thickness and the composition of its material is. It is an aspect of this invention that the circuits described be applied to thin tape materials in such May be applied in such a way that the ligaments are bent or otherwise twisted to a significant and considerable extent without adversely affecting the puncture capability of the circuit components.

A band 11 made of a thin, flexible material is particularly advantageous because its flexibility makes it the necessary Allow distortions that are necessary to store the tape in finished and unfinished form, and allow that Tape runs under severe bending stress through a number of operations to form components, and around the Promote mass production of many components on a continuous strip of economically viable material. The support in the form of the thin tape can be made of a wide variety of materials, including organic and inorganic Compounds or paper or fiber-like materials. A preferred embodiment of the invention is used a film made of a synthetic plastic such as polyethylene terephthalate (Mylar), fluorinated ethylene propylene copolymer (FEP), polytetrafluoroethylene (Teflon), poly- / imide (Kapton) or polyolefin synthetic resins. These synthetic resin films are preferably less than about 0.25 mm (0.010 inches) thick in order to take full advantage of both cost and efficiency Achieve flexibility.

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A key aspect of the invention is a plurality of components such as resistors, inductors and capacitors as individual components or as part of a given one Provide electrical circuit, which is referred to as a hybrid circuit on a tape in thin-film technology will. "Thin film hybrid circuit tape" usually includes metal layers 100 8 to 20,000 8 thick. the Dielectrics can be less than 100 8 to about 20,000 8 in thickness. Although the invention is a beneficial means is, with which one can produce large quantities of individual and discrete thin-film components or a large number of specific groups of similar components, the preferred embodiment is the given complete circuit or the hybrid circuit which includes a plurality of different components and which both in one continuous or almost continuously.

The multitude of mixed circuit components such as resistors and capacitors including the connection lines in addition, are produced on the belt 11 by various known methods in a predetermined and favorable arrangement, which depends on how the belt 11 is prepared. For example, elements 12 and 13 are shown in FIG. 1 Resistance elements and may be made of a metal or non-metal with the dimensions and shape which are desired Provide resistance. Usually a metal is preferred for the resistive elements 12. Such metals as copper Nickel, chromium, etc. are applicable and chromium is the preferred embodiment. The resistance elements 12 can be provided on the belt 11 by any of various means known in the art. For example, you can be successful certain manufacturing processes including plating, sputtering »printing, deposition in general and vapor deposition or vapor deposition can be used. Vapor deposition is a preferred method by which

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Suitable specimens of components as shown in the figures have been manufactured. These procedures can discrete resistor patterns by suitable masking techniques or etching techniques shown in FIG result.

The line elements 14, 15, 16 and 17 can be used in the same way and manufactured by the same manufacturing method as the resistance elements 12 and 13. For the pipe elements however, copper is a preferred metal. The capacitor component 18 includes a pair of conductor elements in the form of the Electrodes 19 and 20 and a dielectric material 21 interposed. The electrodes 19 and 20 are conveniently manufactured in the same way as the conductor elements 14, 15, 16 and 17 and can be combined with the conductor elements 16 and 17. All of the exposed copper area can suitably tin plated to minimize corrosion. Alternatively, the electrodes 19 and 20 made of another highly conductive metal, such as aluminum or zinc.

The dielectric material 21 for the capacitor 18 can consist of a wide variety of known capacitor dielectrics and in the position shown in the form of strips or strips or with With the help of certain inclusion, extrusion or deposition processes. To get the maximum benefit To adopt the thin film circuit concept and obtain maximum capacitance, the dielectric material 21 be free of pinholes, have a very high dielectric constant and be very thin.

In a preferred practice of the invention, such a dielectric material as described is by ultra-violet photo surface polymerization of a gaseous Materials, for example ethylene, 2,4-hexadiene,

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1,5-hexadiene, methyl methacrylate, hexachlorobutadiene, tetrafluoroethylene, Trifluoromonochloroethylene, monofluorotrichloroethylene, Hexafluorobutadiene and acrylonitrile obtained. These materials and also methods and devices for their manufacture these materials as capacitor dielectrics are fully disclosed in U.S. U.S. Patent 3,372,672.

The resistors, conductors and capacitors and other passive components are suitably formed by metal vapor deposition obtain. These methods can be used in the correct order to produce a desired discrete pattern. In one form, however, it has been found useful in practicing the invention, the deposition processes with etching and masking processes to obtain the circuits with multiple components.

For example, a thin-film tape 11 is first coated with chromium, Copper and tin coated one after the other. The band 11 is then photographically etched in order, as shown for example in Fig. 1, to obtain the composite metals in a predetermined geometric shape as a circuit. A second selective photo-etching process removed the conductor material copper from resistors 11 and 12 to the required length of resistor to expose. Thereafter, by a suitable masking technique, the dielectric material 21 is covered by the in the aforementioned Registrations described procedure deposited. In order to obtain the counter electrode 17, the circuit is more suitable Masked manner and deposited the electrode 17 through the mask in a desired pattern.

The formation of an improved capacitor 18 is an important one Aspect of this invention. The aforementioned dielectric materials of the capacitor 18 become ultra-violet -Fhotopolymerization received and are contiguous

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Films that are free of pinholes and are down to 50 8 thick. They result in very much as an impact large capacitance on a small area of the tape. These films also provide passivation of the resistors and the isolation of the crossing points of conductors. It is a desirable aspect of the method of the invention that the mating of the conductor 19 with the dielectric 21 need not be exact, since the dielectric 21 and the Conductors 19 can be applied in a larger pattern without adverse effects, so that sufficient space remains, in which the more precise electrode 20 can be attached.

It has been found that circuits and components manufactured as described above on a flexible carrier, can be subjected to severe bending and twisting loads without significant adverse effects on the electrical or physical function. In addition to these above properties, it has been found that these tapes are continuous Manufacturing processes can go through to produce the required circuit, the process also may involve bending the tape.

A typical circuit including capacitors, resistors and interconnecting circuitry can be fabricated on a tape substrate in a series of sequential steps based on a continuous process or a continuous series process. The necessary steps for a practical embodiment of the invention are shown in the figures ). 1 and 2 and contain steps 1-11, which are briefly described in addition below.

Step 1 involves the deposition or formation of an appropriate one Resistance metal, such as chromium, on a flexible tape or carrier 11, e.g. a mylar film of less than about 0.25 mm (0.010 inch) thick.

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Step 2 involves the formation or deposition of a Layer of a highly conductive metal such as gold, aluminum or copper, over the chromium layer of process step 1. If copper is used, another layer of tin can be deposited on top of it.

Step 3 involves the deposition or formation of one by exposure hardenable layer (resist coating) on the tape 11 and the fixing of the same by heating (baking).

In step Ί the belt 11 is through a suitable Mask subjected to an Ultra-Viole.tt exposure to fix a desired shift pattern.

In step 5, the belt 11 is subjected to a developer process, to wash off the unfused photo layer.

In the rubble 6, the strip 11 is subjected to etching processes, one after the other remove unwanted metals such as copper and chromium.

In method step 7, the resistance patterns on the strip 11 are again ultra-violet light with the aid of a suitable mask exposed to remove the fixation of the photo layer thereon.

In step 8, the belt 11 is subjected to a developing and washing stage in order to remove the photosensitive layer, which covers the resistance pattern.

In step 9, the tape 11 is subjected to an etching process in order to remove the copper from the resistor pattern.

Step 10 involves the deposition or formation of a dielectric Layer over the capacitor pattern by masking

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process, preferably the ultra-violet photopolymerization process, as described above is used.

Method step 11 comprises the deposition of the upper capacitor electrode by suitable masking methods.

The listed process steps 1-11 can be modified, combined and exchanged for one another, as shown in the applications mentioned is described to the desired

^ Get results. Steps 1-11 can be used as a subtractive process, in which undesired parts are etched away in order to keep the circuit intact. An additive process is a process in which only the specific circuit and its defined components are immediate be added on the carrier. In the practice of this invention are either additive or subtractive Procedure applicable. It is a feature of the present invention that stages 1-11 are performed on one carrier a plastic belt on a continuous or fasb continuous or large series basis can be used to obtain numerous circuits and components for this purpose. One however, such treatment excludes the need for devices

W for handling the tape useful in the continuous aspect of making hybrid tape circuits. However, it has been found that a reel circuit imaging transfer device and ultra-violet continuous photopolymerization, particularly when combined, provide a high degree of continuity in the practice of this invention for making hybrid ribbon circuits. This apparatus or system is best described in the context of one of the full procedures below.

In practicing the invention, the process steps 1 and 2 suitably combined in one stage

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and carried out in a plant. Alternatively, you can use the metal coated tapes, which are well known in the art known processes are precoated, can be obtained from the trade. A tape emerging from the metallization process or a tape from a supply roll is fed continuously into a tank of station 3, where it is coated with a photolayer material (resist material) is coated by spraying and heated to fix a desired pattern.

The station 3 can represent the end of a series process and the tape 11 in wound form is in the station 4 for ultra-violet exposure of a pattern on the photosensitive Movie entered. An exemplary embodiment of the Station 4 is shown in FIG.

The metallized tape 11 from station 2 is unexposed with a photosensitive layer is coated and passed through an arrangement 22 for a photolithographic process, as in FIG Fig. 3 shown. The photolithographic assembly 22 includes a large wheel assembly 23 driven by a drive wheel 24 and is guided by a pair of idler wheels 25 and 26. The belt 11 goes around the idler 25 and over the periphery of a support surface 27 on the roller 23 and around the spool 26 out of the arrangement. The supporting surface 27 of the roller 23 comprises a plurality of facets or flat surfaces 28, each of which has a mask, for example a glass mask , may contain, in the latter case the emulsion side the same is in intimate contact with the belt 11 running over it. Each of these masks closes a multitude circuit diagrams applied to it.

In the center of the roller 23 is an ultra-violet light source arranged, which is provided with a suitable reflector 29. The light source 28 can preferably be an ultra-violet lamp

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of the type Hanovia 189 A, 1200 watts and the speed of the belt 11 and the roller 23 should be controlled so that an exposure time of about 2 minutes is obtained. With this one Operation, the masks are exposed to the light of the lamps, so that certain areas or circuits or outlines of components be fixed on the belt 11. The glass masks of FIG. 3 can be replaced by treadmill masks known per se be, for example a plastic band mask, a metal band mask or other forms of band masks which can run under the ρ band 11 around the bearing surface 27 of the roller 23. In this context it may be desirable to provide an airtight lining in combination with the roller 23, so that the belt 11 and the masks can be brought into close contact with each other by means of vacuum pressure or air pressure.

A number of devices can be used to achieve the To bring the band 11 exactly into the rope position on the roller 23. For example, an arrangement can be used to set up the belt an optical index can be applied, or a suitable pin wheel drive can be used, as described in the FiIm- and projection technology is known. With a pin wheel arrangement. engage suitable pin gear teeth 30 on roller 23 in suitable ones openings 31 (not shown) in the belt 11 and are in engagement with teeth 30 'on wheel 2Ί. These pin gear teeth can can also be used on idler wheels 25 and 26. It is an important aspect of this invention that the exposure process accurately and simultaneously applicable to a number of circuits. Accordingly, the system and the process, Ren according to Fig. 3 these two goals in an advantageous manner, especially when the roller 23 has a radius of about 1.5 m (5 feet) or more.

The process steps 5-11 remaining after exposure can also be combined in a suitable manner, to make one or more additional stations. the

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The individual processes carried out are essentially known Standard process with the exception of the formation of a dielectric through ultra-violet irradiation. The ultra-violet photopolymerization or deposition on a continuous flexible support in a continuous manner is another consideration this invention and an arrangement therefor is shown in Pig. 4 pictured.

In Pig. 4, the vacuum structure 32 closes the vacuum chambers 33 and 34 which are connected to each other by the pipe part 35. The flexible tape 11 is taken from a supply roll 36 in the chamber 33 unwound, passes through the pipe part 35 and is wound on the take-up reel 37 in the chamber 34.

In the pipe part 35, the flexible tape 11 is fixed by a series of masks 38, which have the desired pattern release the tape 11, exposed to ultra-violet irradiation. Immediately above the masks 38 there is a row of ultra-violet lamps 39, which in combination with a Reflector 40 give the desired exposure tune. With a practical Embodiment of the invention, the tube part 35 contains a series of transverse openings, which quartz tubes for receiving of lamps 39 included. The mask assembly in the tubular portion 35 can include masks, which either in contact with the band 11 st, ehen or, have no contact with the band. In addition, the mask arrangement can also be a treadmill mask. A previously known submethod which is applied to this portion of the invention which involves the deposition of a dielectric film can be adapted is disclosed in U.S. U.S. Patent 3,372 disclosed and claimed;

Because of the high temperatures occurring in the exposure part of the tube 35, the thin ribbon 11 must be properly cooled. One such cooling device is in Pig. 4 in the form of a cooling block 42 is provided. The cooling block 42 is a metal block with

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suitable openings for the passage of a coolant. the Cooling can be further promoted by the fact that one for better dissipation of the heat to the block 42 on the lower surface of the belt 11 has a metallized layer.

For the device according to claim 4, other devices can be promising be applied. For example, the tape 11 and a suitable mask tape can pass through a bend device at the same time (curved shoe device) are moved where they are effective in contact with each other or without contact with each other be brought into their mutual position. This manifold arrangement provides power handling, promotes the use of Air pressure or vacuum to keep the ligaments in good contact, and also provides an extended channel for the correct exposure time.

The invention is particularly well adaptable to the continuous deposition of multiple capacitors on an extended Piece of flexible tape. Such multiple capacitors can be used in a number of different electrical circuits Generation of the desired capacity can be assigned. An example of such a multi-capacitor circuit is shown in FIG Fig. 5 shown.

Fig. 5 shows a band of multiple capacitors arranged in series 43. The capacitor band 43 comprises a band 11, such as in connection with FIGS. 1-M. This tape 11 can, for example, Kapton in a thickness of approximately 0.025 mm (0.001 inch). The tape 43 includes a first layer 44 from a conductive strip, for example made of copper, the is applied to the tape 11 with the aid of the devices and methods described above. The strip-shaped copper coating 44 serves as or as a collecting electrode for the capacitor. The copper strip 44 is then with a Layer 21 of dielectric material, similar to the material

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-.17 -

of Fig. 1, which is the dielectric for the capacitor holding, over the dielectric 21 is a series of nested conductors 45 and 46 deposited. The conductors 45 and 46 have approximately the same capacitor area and cooperate with the dielectric material 21 and the common electrode 44 to provide a predetermined capacitance. For example, conductor 45 serves as a capacitor electrode opposite conductor 44 to define a capacitor and the conductor 46 serves as the other capacitor electrode opposite the conductor 44. At the same time, the conductors 45 and 46 separated by the dielectric 21 also form a capacitor. A large number of capacitors of relatively large area can be obtained on a single tape by doing so as desired, makes the band circuit 43 of extended length and connects the connections 47, 48 and 49. Furthermore, a wide band or sheet can contain a large number of series capacitor assemblies according to FIG. which can be used as a whole or separated into individual strips. As shown, a single strip may have conductors appropriately divided along the longitudinal axis in predetermined spaces so that one can access a few strips of capacitor blocks and the blocks can be connected to each other. The circuits of the figure, as well as other circuits described, can be provided with a protective layer of dielectric material over the conductors 45 and 46 and the tape circuit can be obtained in rolled up or otherwise curved shapes. A number of circuits 43 can be connected to one another in a suitable manner in that the connections 4?, 4? and 49 with Tin can be coated so that a solder joint can be easily made. * Similar circuits can be connected to each other with one circuit facing down or reversed, their respective tin-plated junctions engaged and a soldered connection is made by supplying heat.

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The capacitors of FIG. 5 can also take other forms. A modification is shown in FIG. This can be used as a Lateral arrangement 50 of capacitors are referred to. In assembly 50, capacitor electrodes 45 and 46 are like this arranged so that their connections 47 and 48 lie directly opposite one another along the longitudinal edge of the belt 11. The dielectric material 21 covers the electrodes 45 and 46 and over A conductor 44 is applied to the dielectric material 21. If desired, another dielectric layer can be overlaid of electrode 44 and the tape can be obtained in the form of a roll. The lateral assembly 50 provides an excellent means of selectively combining capacities, for example by using a sliding or moving Overall conductor contact with a large number of connections 47 and 48 has.

A number of different electrical circuits can include one or more ribbon capacitor type capacitors Use 43 and 50. At the same time, a number of connection points 47, 48 and 49 can be connected to one another in order to to obtain an increased capacitance for a given electrical circuit or the electrical circuit itself can be with can be equipped with a variety of capacitor connections. Multiple connections, as the connections 47, 48, 49 can be connected to one another by mechanical means or by extending the connecting lines 47, 48, 49. These extensions can then in a predetermined manner mechanically interrupted by punching, tearing or slitting the extensions in order to obtain predetermined blocks of capacitors /. The capacitor bands 43 and 50 can be longitudinal Their length can be completely separated or only the conductor tracks can be separated so that the tape 43 May receive interconnects from more than one circuit or act in more than one circuit. In this connection, the electrode 44 can also be subdivided in a suitable manner.

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According to the invention, capacitors were made which Areas of multiple of 6 cm (several square inches) covered and had operating voltages close to 30 V. In addition to this, there are operating loads of 1000 V per approximately

0.025 mm (mil) Dielectric to about 1.5 cm ^(1/1 I square inch) and 800 V per about 0.025 mm (mil) over an area of about

ο
6 cm (1 square inch) and 600 V per about 0.025 mm (mil) across

2
an area of about 2.5 cm (4.0 square inches) is possible. As another example, band circuits such as that shown in Figure 1 have been used successfully in broadcast circuits where the capacitors range from 5000 to 20,000 picofarads (pf) and at voltages of 5.0 volts at 166,000 picofarads per about 6 cm (square inch) of the active area worked. These capacitors contained conductors from 5,000 to 10,000 8 thick and conductors from 500 to 5,000 8 thick.

Capacitors made in accordance with the invention were also subjected to rigorous flexural tests. Unencapsulated capacitors with aluminum base electrodes, hexachloro © butadiene dielectric, and gold top electrodes on a Mylar substrate about 0.05 mm (0.002 inch) thick were placed around rollers with diameters between about 6 mm (0.25 inch) ) and 10 cm (4.0 in) wrapped. A series of tests on these capacitors showed a maximum change in capacitance of less than about 0.625 % and the leakage factor was essentially unaffected and remained in the range of 0.007 to 0.0085

Multiple resistance circuits can also be implemented by the invention can be obtained. For example, Fig. 7 shows a resistance band 51. It comprises a band 11 on which a large number of Resistors were applied, as they are described in connection with FIG. In FIk. 7, the belt 11 can be used first be coated with a resistive layer of a metal such as chrome and then with a copper layer. One suitable development of a photoelectric layer and etching

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proceed as before in connection with Pig. I described, form the indicated resistance pattern, ie the resistance strips 52 and their conductors 5 ^ and 53 on the strip 11. Resistive tape 51 of Figure 7 may also have a dielectric material suitably deposited thereover, for example by ultra-violet deposition, and used for protective purposes. In one form of the invention, the resistor pattern may include multiple rows of resistors of the shape shown on a sheet carrier which is then slit to provide individual rows of resistance bands.

A number of resistors and circuits including resistors such as those shown in Figures 1, 5 and 6 have been made in accordance with the present invention. For example, resistors have been evaporated from thin strips of chrome onto synthetic resin films about 0.025 to 0.075 mm (0.001 to 0.003 inches) thick made of Kapton and Mylar. The thickness of the chrome layer was on the order of several hundred eight and the widths of the conductors varied from about 0.13 to 0.4 mm (0.005 to 0.0015 inches). The Aufdampftemperaturen used were l6o ° C, 200 ⁰ C and 300 ⁰ C.

These resistors were tested by periodic temperature change exposed between -8l ° C and + 125 ° C with little meaningful effects. The resistors were also subjected to bending tests including bends in a radius of about 6 mm to 50 mm (0.25 to 2 inches). During these exams the resistors experienced an average resistance change of less than about 2.2 f.

The flexible resistance band can undergo a considerable bend and can be rolled into a roll, for example. It may be desirable on the bottom of the band II an additionally applied metal layer on

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To have resistance band 51, which serves as a heat sink and as a heat conductor. In this case, the tape 11 is wound so that that the resistors are on the outside of the coil. The short-circuiting of the resistors is given by the Coating with a thin dielectric coating over the resistors is prevented.

The winding shape of the resistors (or capacitors) is shown in FIG. In FIG. 8, the winding 5 ^ of capacitors or resistors (or both) is inserted into a metal cup 55 and suitably sealed therein. The cup 55 can have a metal spindle in the cup or in the roller 5 ^ which is in contact with the cup for improved heat conduction. A metal lid can be used to close the can, as is currently done on various commercial capacitors. A number of other suitable housing forms are available, particularly for capacitor windings, and can be used successfully with regard to the impregnation of the capacitor windings 5 * 1.

To facilitate the connections between the capacitors on flexible tape, the resistors on flexible tape, to other components such as silicon integrated circuits (SIC), which are sometimes referred to as monolithic microcircuitry, an interconnection member can be used. One such interconnection device, referred to as a hybrid ribbon interconnector (HTI), is shown in FIG. 9 and denoted by the numeral 56. In FIG. 9, a carrier tape 11 contains an applied pattern including a number of tapered connecting arms 57 * which drive all conductor parts by separating and etching processes, as previously described, are obtained. Each conductor part gradually changes from a very narrow conductor part 58 at the free central part 59 to a larger conductor surface 60 at the outermost ends, which coincide with the strip edges

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can. Many variations of these patterns, known as fan patterns, may suitably be used in the invention,

There are a number of advantages for an HTI on a flexible carrier. The monolithic circuit on a semiconductor plate, which is to be housed in the open central part is usually inflexible compared to the belt 11. Accordingly, the belt 11 or the hybrid belt interconnector Easily adapt (HTI) to the inflexible plate to establish the connection. This connection consists in attaching the numerous and very narrow end portions of the conductors 58 with corresponding very narrow connecting portions on the SIC plate 55.

The SIC wafers are usually popular because of their small size and fragility Nature of the plate so connected to an HTI that the plate with the populated surface facing up in a solid And the HTI is engaged and appropriately connected. The operating staff leads this alignment is usually done using mirrors as it works from the back of the HTI. In the In the present invention, the transparency of the tape provides a more precise direct view of alignment.

In this regard, the ends 60 of the copper conductors can be plated with tin and the leads of the SIC die can be plated with gold . If they are pressed together at a temperature above 280 ° C, a eutectic with 80 % gold and 20 % tin is formed as a bonding agent. The > invention therefore provides the combination of a SIC die firmly attached to an HTI and that item is then easily attached to other forms of tape circuitry. An example can be such a circuit as shown in Flg. 1, suitably tin-coated conductors l4 and ^11f have a spacing which corresponds to the spacing of a pair of conductors on the HTI nut of FIG.

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it's correct. The two bands can then be in surface contact be brought so that the areas coated with tin are in direct contact. At the back of the straps heat is added and the tinned areas melt and create a solder-like connection. The flexible HTI delivers an advantageous means of connecting the SIC to other areas or circuits that require substantial flexibility of the HTI.

The HTI of Figure 9 can be fabricated in multiple forms on a longer tape or on a sheet. Individual HTIs are then severed as needed. Furthermore, the sheet or strip shape of the HTI can be an active element, for example have a SIC that has been previously associated with each HTI. In this way, a unique supply of active Elements.

An active element, such as a SIC plate, can be connected in a suitable manner with an intermediate frame part. The frame part is then inserted into an opening 59 and connected to conductors 58.

The hybrid ribbon interconnect (HTI) of Figure 9, when it includes an active element and is connected to the ribbon circuit 10 of the Figure, provides a complete ribbon circuit with active and passive elements. However, the HTI of FIG. 9 can also be an integral part of the circuit of FIG. I be. For example, a continuation of the band circuit 10 of FIG. 1 can show conductor strips 14 and I ¹ I *, both of which represent two conductors 57 according to FIG. The connection to an active element such as a SIC die then completes the circuit. Individual HTIs according to FIG. 9 have been connected to circuits according to FIG. 1 in such a way that the tin-coated conductors are brought into surface contact and contact heat is supplied to one of the rear sides of the parts in order to cause the solder to flow.

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If the HTI is an integral * part or an extension of the Circuit according to FIG. 1, then other circuits or sub-circuits on extension parts or Areas of the tape 11 for connection to the HTI are deposited. In this regard, the circuit of Figs have separate and discrete elements connected therewith or such active elements in the form of deposited in thin-film technology Elements. A number of circuits or subcircuits along with their active components can be based on can be obtained electrically connected to one another in a single band.

While the present invention has been described with reference to particular embodiments thereof, it should be understood numerous modifications are possible for those skilled in the art without departing from the scope of the technical teaching of the invention,

009827/1330

Claims (32)

- 25 claims Thin-film tape circuit, characterized in that it is a thin, freely flexible Ribbon (11) of extended length and at least one capacitor element (18) on the ribbon (11), said capacitor element (18) a first flexible thin metal layer electrode (19) applied to the tape (11), one on the first Metal film deposited and also together with the layer (19) flexible dielectric material, a second, on the dielectric material (21) deposited electrode (20) in the form of a thin metal film, which therewith is flexible, and contains electrical conductor tracks (16, 17) for the capacitor (18). 2. circuit tape according to claim 1, characterized that the tape (11) is a synthetic resin. 3. circuit tape according to claim 2, characterized that on the tape a resistance element (12, 13) deposited in the form of a thin flexible metal strip is and is connected to the conductor tracks (14, 15, 16). 4. circuit tape according to claim 2, characterized that the dielectric material (21) is a polymer photopolymerized by ultra-violet radiation of a monomeric gas 1st. 5. circuit tape according to claim 4, characterized that on the thin flexible tape (11) a hybrid tape interconnection part (HTI pattern) is applied is for connection to at least one of the capacitors or resistors. 009827/1330 6. circuit tape according to claim 4, characterized in that a plurality of the thin-film tape circuits is present on the tape. 7. circuit tape according to claim 5, characterized in that an active one with the HTI Circuit element is connected. 8. circuit tape according to claim 7, characterized in that the active element is an element is in the form of a semiconductor die. 9. A band capacitor, characterized that it comprises the combination of the following elements: a thin flexible expanded carrier tape (11), a Series of discrete pairs of spaced apart lower capacitor electrodes (45, 46) in the form of a thin metal layer deposited along the belt and being flexible with the tape, a thin continuous flexible dielectric film (21) extending along the Tape is deposited over the metal layer, a capacitor electrode (44) in the form of a thin top metal layer overlying the dielectric layer along the Tape and deposited over a plurality of discrete pairs of electrode layers and electrical connection devices (47, 48) for the capacitor electrodes. 10. ribbon capacitor according to claim 9, characterized in that the row of electrodes (45, 46) is distributed individually over the longitudinal axis of the belt. 11. band capacitor according to claim 10, characterized that the row of electrodes (45, 46) is laterally nested one inside the other. 009827/1330 12. Ribbon capacitor according to claim 11, characterized in that the electrical connection devices ( ¹ I ?, 48) for each pair of the discrete electrodes are provided on opposite sides of the ribbon (11) and opposite to one another. 13. band capacitor according to claim 12, characterized in that the thin upper metallic Electrode layer (44) is continuous along the belt. I ¹ *. Ribbon capacitor according to Claim 12, characterized in that a thin dielectric layer covers the upper electrode (45, 46). 15 · band capacitor according to claim 14, characterized that the tape (11) is a synthetic resin material and the dielectric (21) polymer photopolymerized by ultra-violet radiation of a gaseous monomer. 16. band capacitor, characterized that it comprises the combination of the following parts: a thin flexible tape carrier (11), a lower capacitor electrode (44) in the form of a thin metal layer that is applied to the tape and is flexible with the tape, a thin flexible dielectric layer (21) deposited over the lower capacitor electrode, a pair of axially extending, discrete upper capacitor electrode layers (45, 46) on the thin dielectric layer (21) / 18f that they lie individually side by side in the longitudinal direction, this pair of upper electrodes (45, 46) has transversely extending, nested parts and the transversely protruding parts as an electrode are interconnected and the others take turns 00982 7/1330 protruding parts than the other electrode are connected to each other, as well as electrical connection means (47, 1J9) for the electrodes. 17. Band capacitor according to claim 16, characterized in that the code " rejects that the pair of upper electrodes are covered by another thin flexible dielectric layer (21) is covered. 18. Band capacitor according to claim 17, characterized in that g · e that the electrodes are divided along their length. 19. Ribbon capacitor according to claim 16, characterized that the electrical connections are in a spaced arrangement at one end of the tape available. 20. ribbon capacitor according to claim 17> characterized that both dielectric materials (21) by photopolymerization of a gaseous Monomers are applied with ultra-violet radiation and the tape (11) is a thin synthetic resin. 21. Thin, freely flexible, transparent tape made of synthetic synthetic resin, characterized in that it contains a plurality of discrete conductive parts (57) which are applied to one side of the tape and which radiate outward from a defined central region (59), a platelet with a semiconductor integrated circuit and a plurality of contact parts which are arranged at intervals and the central parts (58) of the above conductive parts corre Chen, wherein the plate is arranged in the central region that the contact parts and the central parts 009827/1330 (58) are in surface contact with each other and the middle parts of the conductors and contacts with a metallic Lanyards are connected to each other. 22. Thin, freely flexible tape made of synthetic resin with an extended length, characterized by the combination of the following features: on the tape are a variety of HTI circuits in the form applied by thin metal films designed to be flexible with the belt (11), each of the A plurality of circuits radiating outward from a central region (59) Has ladder arms (57) and the arms have a greater width dimension at their outer end than at their inner end End and the inner ends of the arms define an area of predetermined size of a semiconductor die, the inner ends have a predetermined spacing from one another so that they are made with predetermined contacts collapse on the platelet and create an area of metallic material on the outer ends of the arms Creation of a metallic connection. 23 · System for exposure of a flexible tape carrier part for Ultra-violet irradiation for the purpose of exposing one on it located photosensitive layer, thereby characterized by having a rotatable drum structure (22), devices (24, 25, 26) around a thin belt (11) coated with photosensitive layer continuously around the circumference of the drum (22) to guide, devices (30, 30 ') for maintaining a precise mutual position between the rotatable drum (22) and the belt (11), so that a predetermined part of the belt exactly with a predetermined part of the drum (22) coincides, a mask device on the drum (22), 009827/1330 an ultra-violet lamp device (28, 29) so arranged are that they apply ultra-violet light through the masks to develop the photoelectric layer give the tape, and control devices for controlling the rotation of the drum for the purpose of a predetermined exposure of the tape owns. 24. Plant according to claim 23, characterized in that the mask is a part of the drum (22) is. 25. Plant according to claim 24, characterized that the mask is a treadmill mask which, together with the belt (22), over the drum structure (22) is running. 26. Plant according to claim 25, characterized in that the ultra-violet light source (28) is arranged in the interior of the drum (22). 27 · System for exposing a thin strip of synthetic resin for the purpose of ultra-violet irradiation for exposing a pattern on a photoelectric layer of the strip, characterized in that it has a rotatable drum (22) set up for rotary movements, a drive device (24) for feeding of the belt (11) to this drum along the periphery of the same and away from the drum (22), a mechanical device (30, 30 ', 3D connected to the drive device (24), the belt, (11) and the drum ( 22) cooperates to keep the tape in '. to get an accurate position relative to the drum, a \ source (28) for Ültra-violet radiation in the drum, a \ plurality of ultra-violet light transmitting masks that define a part of the periphery of the drum and 009827/1330 1 9 ΰ 2 6 9 O are inserted between the tape and the light source, so that a variety of circuit patterns through Ultra-violet radiation can be exposed on the tape. 28. Plant for the continuous photopolymerization of a gaseous Monomers by ultra-violet radiation on a moving film made of a synthetic resin, characterized by the combination of the following features: a first vacuum chamber (33), a supply roll (36) of synthetic film tape (11) in this chamber, a second vacuum chamber (3 ¹ O, a connecting device (35) which connects these two chambers (33, 3 ¹ O to one another, a Take-up roll (37) for the tape made of synthetic plastic in the second chamber (3 ¹ O, a device for continuously feeding the film made of synthetic resin from the supply roll (36) through the connecting line (35) to the take-up roll (37), a supply device for feeding a gaseous monomer into the connecting line (35)> a source (39) of ultra-violet radiation in this line, a mask (38) in the connecting line, which is in one with the band (11) made of synthetic plastic predetermined relationship and is arranged so that the ultra-violet light is let through the mask and the monomeric gas photopolymerized on the plastic tape (11) and cooling devices n (^ 2) that are in contact with the tape. 29. Plant according to claim 28, characterized in that the mask (38) is in contact with the band (11). 009827/1330 30. Integrated circuit, characterized by the combination of the following features: a first circuit on a thin flexible tape made of synthetic material, conductor tracks made of a thin metallic Film on this circuit, a second circuit on a thin flexible tape made of a synthetic Synthetic resin, conductor tracks on this second circuit made of a thin metallic film, their geometric arrangement with that of the first circuit, the circuits with their surfaces facing each other are that the ends of the traces on each circuit are in contact with each other and these ends through a metallic material are firmly connected. 31. Integrated circuit according to claim 30, characterized characterized in that the second circuit is a hybrid ribbon interconnect (56) (HTI). 32. Integrated circuit according to claim 31 »thereby characterized in that the first circuit is an HTI. 009827/1330 Si L e r s e ί t e