DE29719749U1 - Device for separating printed circuit boards - Google Patents
Device for separating printed circuit boardsInfo
- Publication number
- DE29719749U1 DE29719749U1 DE29719749U DE29719749U DE29719749U1 DE 29719749 U1 DE29719749 U1 DE 29719749U1 DE 29719749 U DE29719749 U DE 29719749U DE 29719749 U DE29719749 U DE 29719749U DE 29719749 U1 DE29719749 U1 DE 29719749U1
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- knife
- circuit boards
- separating
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
- B26D1/06—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
- B26D1/065—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates for thin material, e.g. for sheets, strips or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/386—Draw punches, i.e. punch and die assembled on opposite sides of a workpiece via a connecting member passing through an aperture in the workpiece
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
Description
Be s ehreibung Be s very vouch
Vorrichtung zum Trennen von LeiterplattennutzenDevice for separating printed circuit boards
Beim Herstellen von Leiterplatten ist es üblich, eine Mehrzahl von Leiterplatten vorerst einstückig, als sogenannten Leiterplattennutzen, zu fertigen. Vor oder auch nach dem Bestücken mit elektronischen Bauelementen werden die einzelnen Leiterplatten dann von einander getrennt. Dazu sind unterschiedliche Trennverfahren bekannt. Die erfindungsgemäße Einrichtung betrifft eine Technologie, bei der die einzelnen Leiterplatten mittels durchgehender Nuten aufgeteilt sind und nur durch kurze VerbindungsStege zusammengehalten werden. Zum Vereinzeln der Leiterplatten ist es erforderlich, die Verbindungsstege zwischen den Leiterplatten rückstandsfrei und schonend abzutrennen. Dazu sind Vorrichtungen bekannt, welche vorzugsweise pneumatisch angetriebene und vertikal in Matrizen bewegbare, hakenförmige Trennmesser aufweisen.When manufacturing circuit boards, it is usual to initially manufacture a number of circuit boards in one piece, as a so-called circuit board panel. Before or after the electronic components are fitted, the individual circuit boards are then separated from one another. Various separation methods are known for this. The device according to the invention relates to a technology in which the individual circuit boards are divided by means of continuous grooves and are only held together by short connecting webs. In order to separate the circuit boards, it is necessary to separate the connecting webs between the circuit boards gently and without leaving any residue. Devices are known for this purpose, which preferably have hook-shaped separating blades that are pneumatically driven and can be moved vertically in matrices.
Eine derartige Vorrichtung ist unter anderem in den Unterlagen des Gebrauchsmusters DE 297 07 050.9 beschrieben. Zum Trennen wird ein Leiterplattennutzen so von oben auf die Matrize aufgelegt, daß das Trennmesser durch eine Nut ragt. Dabei wird der Leiterplattennutzen mit dem zu entfernenden Verbindungssteg gegen das hakenförmige Trennmesser geschoben. Durch die Abwärtsbewegung des Trennmessers wird der Verbindungssteg durch den hakenförmigen Teil des Trennmessers sauber herausgeschnitten.Such a device is described, among other things, in the documents of the utility model DE 297 07 050.9. For separation, a circuit board blank is placed on the die from above so that the separating knife protrudes through a groove. In this process, the circuit board blank with the connecting web to be removed is pushed against the hook-shaped separating knife. The downward movement of the separating knife causes the connecting web to be cleanly cut out by the hook-shaped part of the separating knife.
Wenn ein aus nebeneinander angeordneten Leiterplatten bestehender Leiterplattennutzen getrennt werden soll, kann der Leiterplattennutzen gleich so auf die Matrize aufgelegt werden, daß das Trennmesser durch eine Nut ragt, dies erleichtert am Beginn zwar das Ausrichten des Leiterplattennutzens, jedoch muß zum Entfernen aller in einer Linie liegenden Verbindungsstege der Leiterplattennutzen noch einmal abgehoben, gedreht und erneut aufgelegt werden. Dies wirkt sich sehrIf a circuit board panel consisting of circuit boards arranged next to each other is to be separated, the circuit board panel can be placed on the die so that the separating knife protrudes through a groove. This makes it easier to align the circuit board panel at the beginning, but in order to remove all connecting bridges lying in a line, the circuit board panel must be lifted off again, turned and placed again. This has a very
nachteilig auf die erreichbare Arbeitsproduktivität aus. Auch sind Leiterplattennutzen so aufgeteilt, daß jede einzelne Leiterplatte rundherum mit Nuten versehen ist. Aus Gründen der Bearbeitungsstabilität befinden sich dann oftmals Verbindungsstege sehr nahe an den Ecken der Leiterplatten, so daß das Trennmesser nicht in den von der Ecke ausgehenden Schlitz paßt. Auch in diesen Fällen muß dann der Leiterplattennutzen mehrmals zusätzlich abgehoben und gedreht werden.has a negative impact on the achievable work productivity. Circuit board panels are also divided in such a way that each individual circuit board has grooves all around it. For reasons of processing stability, connecting bridges are often located very close to the corners of the circuit boards, so that the separating knife does not fit into the slot starting from the corner. In these cases, too, the circuit board panel must be lifted and rotated several times.
Es ist daher Aufgabe der Erfindung, eine Vorrichtung zum Trennen von Leiterplattennutzen der oben beschriebenen Art zu schaffen, mit der eine Steigerung der Produktivität erreicht werden kann.It is therefore an object of the invention to provide a device for separating printed circuit board panels of the type described above, with which an increase in productivity can be achieved.
Diese Aufgabe wird durch eine Vorrichtung mit den im Schutzanspruch genannten Merkmalen gelöst.This object is achieved by a device having the features mentioned in the protection claim.
Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß zum Abtrennen von in einer Linie angeordneten VerbindungsStegen der Leiterplattennutzen nicht mehr gedreht werden muß.The advantages achieved with the invention are in particular that the printed circuit board panel no longer has to be rotated in order to separate connecting webs arranged in a line.
Ein Ausführungsbeispiel der Erfindung ist in den Zeichnungen dargestellt und wird im folgenden näher beschrieben. 25An embodiment of the invention is shown in the drawings and is described in more detail below. 25
Es zeigenShow it
Fig. 1 ein TrennmesserFig. 1 a cutting knife
Fig. 2 u. 3 eine Vorrichtung mit jeweils unterschiedlichFig. 2 and 3 a device with different
aufgeteilten Leiterplattennutzendivided PCB panel
Eine erfindungsgemäße Vorrichtung 1 besteht aus einem den pneumatischen Antrieb aufnehmenden Unterteil 2 und einem Oberteil 3. Im Inneren des Oberteils 3 ist das Trennmesser 4 mit seinem Messerschaft 5 am Kolben eines Pneumatikzylinders verschraubt. Am oberen Ende des Messerschaftes 5 sind zweiA device 1 according to the invention consists of a lower part 2 that accommodates the pneumatic drive and an upper part 3. Inside the upper part 3, the cutting knife 4 is screwed with its knife shaft 5 to the piston of a pneumatic cylinder. At the upper end of the knife shaft 5, two
entgegengesetzt gerichtete Messerhaken 6; 7 ausgebildet (Fig. 1). Das Trennmesser 4 ragt durch eine Öffnung im Oberteil 3 und durch den Spalt der Matrize 8.oppositely directed knife hooks 6; 7 are formed (Fig. 1). The separating knife 4 protrudes through an opening in the upper part 3 and through the gap of the die 8.
In Fig. 2 ist eine Trennvorrichtung mit einem erfindungsgemäß ausgebildeten Trennmesser 4 und aufgelegtem Leiterplattennutzen 9 dargestellt, bei dem die Leiterplatten 13 nur durch parallele Nuten 11 aufgeteilt sind. Zum Vereinzeln der Leiterplatten 13 eines Leiterplattennutzens 9 wird dieser so auf die Matrize 8 aufgelegt, daß das Trennmesser 4 durch eine Nut 11 ragt. Der jeweilige Verbindungssteg 12 wird gegen den Messerschaft 5 des Trennmessers 4 geschoben. Durch Einschalten des Pneumatikantriebes bewegt sich das Trennmesser 4 nach unten und trennt wahlweise mit seinen Messerhaken 6 oder 7 die Verbindungsstege 12 ab. Zum Abtrennen aller in einer Linie angeordneten Verbindungsstege 12 braucht der Leiterplattenutzen 9 somit nicht mehr abgehoben, gedreht und erneut aufgelegt zu werden.Fig. 2 shows a separating device with a separating knife 4 designed according to the invention and a printed circuit board blank 9 placed on it, in which the printed circuit boards 13 are only divided by parallel grooves 11. To separate the printed circuit boards 13 of a printed circuit board blank 9, this is placed on the die 8 in such a way that the separating knife 4 protrudes through a groove 11. The respective connecting web 12 is pushed against the knife shaft 5 of the separating knife 4. By switching on the pneumatic drive, the separating knife 4 moves downwards and optionally separates the connecting webs 12 with its knife hooks 6 or 7. To separate all the connecting webs 12 arranged in a line, the printed circuit board blank 9 no longer needs to be lifted, turned and placed on again.
In Fig. 3 ist ein Leiterplattennutzen 10 aufgelegt, bei dem die Leiterplatten 13 rundherum durch Nuten 11 aufgeteilt sind. Einzelne Verbindungs stege 12 sind sehr dicht an den Leiterplattenecken angeordnet. Auch ein herkömmliches Trennmesser, welches nur einen Messerhaken aufweist, würde nicht in die zur Leiterplattenecke führende Nut 11 passen, so daß der Leiterplattennutzen 10 auch in diesem Fall abgehoben, gedreht und erneut aufgelegt werden müßte. Durch wahlweises Trennen mit den Messerhaken 6 oder 7 ist dies ebenfalls nicht mehr notwendig.In Fig. 3, a printed circuit board panel 10 is laid out, in which the printed circuit boards 13 are divided all around by grooves 11. Individual connecting webs 12 are arranged very close to the corners of the printed circuit board. Even a conventional separating knife, which only has one knife hook, would not fit into the groove 11 leading to the corner of the printed circuit board, so that in this case too, the printed circuit board panel 10 would have to be lifted off, turned and placed back on. By optionally separating with the knife hooks 6 or 7, this is also no longer necessary.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29719749U DE29719749U1 (en) | 1997-11-07 | 1997-11-07 | Device for separating printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29719749U DE29719749U1 (en) | 1997-11-07 | 1997-11-07 | Device for separating printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
DE29719749U1 true DE29719749U1 (en) | 1998-01-15 |
Family
ID=8048285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE29719749U Expired - Lifetime DE29719749U1 (en) | 1997-11-07 | 1997-11-07 | Device for separating printed circuit boards |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE29719749U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103317555A (en) * | 2012-03-22 | 2013-09-25 | 宏启胜精密电子(秦皇岛)有限公司 | Punching mold and punching method |
-
1997
- 1997-11-07 DE DE29719749U patent/DE29719749U1/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103317555A (en) * | 2012-03-22 | 2013-09-25 | 宏启胜精密电子(秦皇岛)有限公司 | Punching mold and punching method |
CN103317555B (en) * | 2012-03-22 | 2015-07-01 | 宏启胜精密电子(秦皇岛)有限公司 | Punching mold and punching method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 19980226 |
|
R156 | Lapse of ip right after 3 years |
Effective date: 20010801 |