DE2964124D1 - Producing printed circuits by soldering metal powder images - Google Patents
Producing printed circuits by soldering metal powder imagesInfo
- Publication number
- DE2964124D1 DE2964124D1 DE7979100263T DE2964124T DE2964124D1 DE 2964124 D1 DE2964124 D1 DE 2964124D1 DE 7979100263 T DE7979100263 T DE 7979100263T DE 2964124 T DE2964124 T DE 2964124T DE 2964124 D1 DE2964124 D1 DE 2964124D1
- Authority
- DE
- Germany
- Prior art keywords
- metal powder
- printed circuits
- producing printed
- powder images
- soldering metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US87435278A | 1978-02-01 | 1978-02-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2964124D1 true DE2964124D1 (en) | 1983-01-05 |
Family
ID=25363559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE7979100263T Expired DE2964124D1 (en) | 1978-02-01 | 1979-01-30 | Producing printed circuits by soldering metal powder images |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0003363B1 (pt) |
JP (1) | JPS54113861A (pt) |
BR (1) | BR7900603A (pt) |
CA (1) | CA1134053A (pt) |
DE (1) | DE2964124D1 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5912775A (ja) * | 1982-07-14 | 1984-01-23 | Matsushita Electric Ind Co Ltd | 霧化ポンプユニツト |
CA1257401A (en) * | 1986-09-03 | 1989-07-11 | Stanley D. Entwistle | Multi-point solder paste application |
GB2305018A (en) * | 1995-08-23 | 1997-03-26 | Brian Hallett | Printed circuit boards having circuitry on an insulating sheet |
JPH0985489A (ja) * | 1995-09-20 | 1997-03-31 | Sony Corp | はんだ及びはんだ付け法 |
DE10109087A1 (de) * | 2001-02-24 | 2002-10-24 | Leoni Bordnetz Sys Gmbh & Co | Verfahren zum Herstellen eines Formbauteils mit einer integrierten Leiterbahn |
DE102006033055A1 (de) * | 2006-07-14 | 2008-01-17 | Man Roland Druckmaschinen Ag | Elektrisch leitfähige Strukturen |
DE102007027473A1 (de) | 2007-06-14 | 2008-12-18 | Manroland Ag | Drucktechnisch hergestellte funktionale Komponenten |
US11799183B2 (en) * | 2019-07-17 | 2023-10-24 | Xerox Corporation | System, apparatus, and method for producing printed electrically conductive lines |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL278021A (pt) * | 1961-05-04 | |||
US3506482A (en) * | 1967-04-25 | 1970-04-14 | Matsushita Electric Ind Co Ltd | Method of making printed circuits |
DE2309712A1 (de) * | 1973-02-27 | 1974-08-29 | Nitto Electric Ind Co | Verfahren zur herstellung von abbildungen |
-
1979
- 1979-01-30 DE DE7979100263T patent/DE2964124D1/de not_active Expired
- 1979-01-30 EP EP19790100263 patent/EP0003363B1/en not_active Expired
- 1979-01-31 BR BR7900603A patent/BR7900603A/pt unknown
- 1979-01-31 CA CA320,647A patent/CA1134053A/en not_active Expired
- 1979-02-01 JP JP1134079A patent/JPS54113861A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS54113861A (en) | 1979-09-05 |
CA1134053A (en) | 1982-10-19 |
EP0003363B1 (en) | 1982-12-01 |
EP0003363A1 (en) | 1979-08-08 |
BR7900603A (pt) | 1979-08-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |