DE29613231U1 - Shape memory alloy expansion pin for making solderless connections - Google Patents

Shape memory alloy expansion pin for making solderless connections

Info

Publication number
DE29613231U1
DE29613231U1 DE29613231U DE29613231U DE29613231U1 DE 29613231 U1 DE29613231 U1 DE 29613231U1 DE 29613231 U DE29613231 U DE 29613231U DE 29613231 U DE29613231 U DE 29613231U DE 29613231 U1 DE29613231 U1 DE 29613231U1
Authority
DE
Germany
Prior art keywords
section
contact pin
deformation
cross
shape memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29613231U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE29613231U priority Critical patent/DE29613231U1/en
Publication of DE29613231U1 publication Critical patent/DE29613231U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/01—Connections using shape memory materials, e.g. shape memory metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B2200/00—Constructional details of connections not covered for in other groups of this subclass
    • F16B2200/77—Use of a shape-memory material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0308—Shape memory alloy [SMA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)

Description

Ausdehnungsstifte aus Formgedächtiiislegierungeu zum Herstellen lötfreier VerbindungenExpansion pins made of shape memory alloy for creating solder-free connections

BeschreibungDescription

Die Erfindung betrifft einen Kontaktstift zum Hersteilen einer lötfreien Verbindung mit der metallisierten Bohrung mindestens einer Leiterplatte, wobei die leiterplattenseitige Kontaktzone des Stiftes nach dem Stecken verfbrmt wird und durch die Verformung der Kontakt zustande kommt. Hierbei erfolgt die Verformung in Form einer Ausdehnung in radialer Richtung und wird durch die Verwendung einer Formgedächtnislegierung ermöglicht.The invention relates to a contact pin for producing a solderless connection with the metallized hole of at least one circuit board, whereby the circuit board-side contact zone of the pin is deformed after insertion and the contact is established by the deformation. The deformation takes place in the form of an expansion in the radial direction and is made possible by the use of a shape memory alloy.

Diese Art des Kontaktstiftes wird im folgenden Ausdehnungsstift genannt. Üblich sind Kontaktsifte in Löttechnik und Einpreßtechnik. Jede der beiden Techniken weist Nachteile auf, die durch den Einsatz von Ausdehnungsstiften vermieden werden. So wird beispielsweise die Umweltbelastung durch den Einsatz von Lötanlagen vermieden. Gleichzeitig benötigt die Montage von Bauteilen mit Ausdehnungsstiften keine aufwendigen Einpreßwerkzeuge.This type of contact pin is referred to below as an expansion pin. Contact pins are commonly used in soldering and press-fit technology. Both of the two techniques have disadvantages that are avoided by using expansion pins. For example, the environmental impact of using soldering equipment is avoided. At the same time, the assembly of components with expansion pins does not require complex press-fit tools.

Fertigungstoleranzen der Kontaktstifte und der Leiterplatten können durch das Ausdehnungsverhalten kompensiert werden. Im Gegensatz zur Einpreßtechnik bieten Ausdehnungsstifte den Vorteil auch bei sehr kleinen Stiftdurchmessern verwendet werden zu können. Dies ist aufgrund der allgemeinen Tendenz zur Miniaturisierung von Bauelementen ein zukünftig wichtiger Vorteil. Desweiteren bieten Ausdehnungsstifte den Vorteil, durch Ihre Eigenschaft sich wiederholt in eine vorgegebene Gestalt rückverformen zu lassen, mehrfach eingesetzt werden zu können.Manufacturing tolerances of the contact pins and the circuit boards can be compensated by the expansion behavior. In contrast to press-fit technology, expansion pins offer the advantage of being able to be used even with very small pin diameters. Due to the general trend towards miniaturization of components, this is an important advantage in the future. Expansion pins also offer the advantage of being able to be reshaped into a given shape and used multiple times due to their ability to be repeatedly reshaped.

Ausfuhrungsbeispiele werden nachfolgend anhand von Zeichnungen näher erläutert. In den Zeichnungen steht "d" für den maximalen Querschnitt vor der Ausdehnung und "D" für den maximalen Querschnitt nach der Ausdehnung in der Leiterplatte. Es zeigt Fig. 1 einen Ausdehnungsstift mit vieleckigem Querschnitt in der Seitenansicht vor der Verformung gesteckt in die metallisierte Bohrung einer Leiterplatte.Examples of implementation are explained in more detail below using drawings. In the drawings, "d" stands for the maximum cross-section before expansion and "D" for the maximum cross-section after expansion in the circuit board. Fig. 1 shows an expansion pin with a polygonal cross-section in side view before deformation inserted into the metallized hole of a circuit board.

Fig. 2 den Querschnitt eines Ausdehnungsstift mit vieleckigem Querschnitt vor derFig. 2 shows the cross section of an expansion pin with polygonal cross section before

Verformung. ■Deformation. ■

Fig. 3 einen Ausdehnungsstift mit nahezu quadratischem Querschnitt als Schnittbild in der Seitenansicht, gesteckt in die metallisierte Bohrung einer Leiterplatte, der aus einem Stift mit vieleckigem Querschnitt (Fig. 1) durch Rückverformung erzeugt wurde.Fig. 3 shows an expansion pin with an almost square cross-section as a sectional view in the side view, inserted into the metallized hole of a circuit board, which was created from a pin with a polygonal cross-section (Fig. 1) by reshaping.

Fig. 4 den Querschnitt eines Ausdehnungsstiftes mit nahezu quadratischem Querschnitt, der aus einem Stift mit vieleckigem Querschnitt (Fig. 2) durch Rückverformung erzeugt wurde, wobei die Ecken des Stiftes Kontakt zur metallisierten Bohrung einer Leiterplatte aufweisen.Fig. 4 shows the cross-section of an expansion pin with an almost square cross-section, which was produced from a pin with a polygonal cross-section (Fig. 2) by reshaping, where the corners of the pin are in contact with the metallized hole of a circuit board.

Fig. 5 einen Ausdehnungsstift mit rundem Querschnitt in der Seitenansicht vor der Verformung, gesteckt in die metallisierte Bohrung einer Leiterplatte.Fig. 5 shows an expansion pin with a round cross-section in side view before deformation, inserted into the metallized hole of a circuit board.

Fig. 6 den Querschnitt eines Ausdehnungsstift mit rundem Querschnitt vor der Verformung.Fig. 6 shows the cross section of an expansion pin with round cross section before deformation.

Fig. 7 einen Ausdehnungsstift mit rundem Querschnitt in der Seitenansicht, gesteckt in die metallisierte Bohrung einer Leiterplatte, der aus einem Stift mit rundem Querschnitt geringeren Durchmessers (Fig. 5) durch Rückverformung erzeugt wurde.Fig. 7 shows a side view of an expansion pin with a round cross-section, inserted into the metallized hole of a circuit board, which was created from a pin with a round cross-section of smaller diameter (Fig. 5) by reshaping.

Fig. 8 den Querschnitt eines Ausdehnungsstiftes mit rundem Querschnitt, der aus einem Stift mit rundem Querschnitt geringeren Durchmessers (Fig. 6) durch Rückverformung erzeugt wurde, wobei die Seiten des Stiftes Kontakt zur metallisierten Bohrung einer Leiterplatte aufweisen.Fig. 8 shows the cross-section of an expansion pin with a round cross-section, which was produced from a pin with a round cross-section of smaller diameter (Fig. 6) by reshaping, with the sides of the pin in contact with the metallized hole of a printed circuit board.

Fig. 9 einen Ausdehnungsstift mit gestanztem Querschnitt in der Seitenansicht vor der Verformung gesteckt in der metallisierten Bohrung einer Leiterplatte.Fig. 9 shows an expansion pin with a punched cross-section in side view before deformation inserted into the metallized hole of a circuit board.

Fig. 10 den Querschnitt eines Ausdehnungsstift mit gestanztem Querschnitt vor der Verformung.Fig. 10 shows the cross section of an expansion pin with a punched cross section before deformation.

Fig. 11 einen Ausdehnungsstift mit gestanztem Querschnitt· als Schnittbild in der Seitenansicht, gesteckt in die metallisierte Bohrung einer Leiterplatte, wobei die Rückverformung aus einem Stift gemäß Fig. 1 eine Aufweitung des gestanzten Bereiches und ein Kontaktieren mit der metallisierten Bohrung verursacht hat.Fig. 11 shows an expansion pin with a punched cross-section as a sectional view in side view, inserted into the metallized hole of a circuit board, whereby the reshaping from a pin according to Fig. 1 has caused an expansion of the punched area and a contact with the metallized hole.

Fig. 12 den Querschnitt eines Ausdehnungsstiftes mit gestanztem Querschnitt, der aus einemFig. 12 shows the cross section of an expansion pin with a stamped cross section, which is made of a

Stift ebenfalls mit gestanztem Querschnittgemäß Fig. 10 durch Rückverformung erzeugtPin also with punched cross-section produced by reshaping as shown in Fig. 10

wurde, wobei die äußeren Ecken des Stiftes Kontakt zur metallisierten Bohrung einer Leiterplatte aufweisen.with the outer corners of the pin making contact with the metallized hole of a circuit board.

Martin Beißner . S. 1 vonMartin Beißner . Page 1 of

Claims (10)

AusdehnuQgsstifte aus Formgedachtnislegieningeii zum Hersteüea lctfreier Verbiädaigen AnsprücheExpansion pins made of shape memory alloys for the manufacture of lact-free joints 1. Kontaktstift zum Herstellen einer lötfreien Verbindung mit der metallisierten Bohrung (1) mindestens einer Leiterplatte (2), wobei die leiterpiattenseitige Kontaktzone des Stiftes einen Bereich aufweist, der den Kontakt zur Bohrungswandung herstellt, dadurch gekennzeichnet daß dieser Bereich nach dem Stecken des Stiftes in die Bohrung eine Verformung in Form einer Ausdehnung zu mindestens einer Seite oder über den gesamten Querschnitt in radialer Richtung erfahrt, wobei die beschriebene Ausdehnung durch die Verwendung einer Formgedächtnislegierung ermöglicht wird.1. Contact pin for establishing a solderless connection with the metallized hole (1) of at least one circuit board (2), the contact zone of the pin on the circuit board side having an area that establishes contact with the hole wall, characterized in that after the pin is inserted into the hole, this area undergoes a deformation in the form of an expansion to at least one side or over the entire cross section in the radial direction, the expansion described being made possible by the use of a shape memory alloy. 2. Kontaktstift nach Anspruch 1, dadurch gekennzeichnet, daß die beschriebene Formgedächtnislegierung ein martensitisches Umwandlungsverhalten aufweist.2. Contact pin according to claim 1, characterized in that the described shape memory alloy has a martensitic transformation behavior. 3. Kontaktstift nach Anspruch 2, dadurch gekennzeichnet, daß das beschriebene martensitische Umwandlungsverhalten durch Anlegen einer elektrischen Spannung verursacht wird.3. Contact pin according to claim 2, characterized in that the described martensitic transformation behavior is caused by applying an electrical voltage. 4. Kontaktstift nach Anspruch 2, dadurch gekennzeichnet, daß das beschriebene martensitische Umwandlungsverhalten durch Temperatureinfluß verursacht wird.4. Contact pin according to claim 2, characterized in that the described martensitic transformation behavior is caused by the influence of temperature. 5. Kontaktstift nach Anspruch 1, dadurch gekennzeichnet, daß die beschriebene Formgedächtnislegierung pseudoelastisches Verhalten aufweist.5. Contact pin according to claim 1, characterized in that the described shape memory alloy has pseudoelastic behavior. 6. Kontaktstift nach Anspruch 1, dadurch gekennzeichnet, daß die beschriebene ' Formgedächtnislegierung aus Elenenten wie Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al," Cu-Al-M, Cu-Au-Zn, Cu-SiC Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, M-Ti, M-Ti-x (wobei &khgr; ein drittes Element darstellt), Ti-Co-M, oder Ti-Cu-M besteht.6. Contact pin according to claim 1, characterized in that the described ' shape memory alloy consists of elements such as Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al," Cu-Al-M, Cu-Au-Zn, Cu-SiC Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, M-Ti, M-Ti-x (where x represents a third element), Ti-Co-M, or Ti-Cu-M. 7. Kontaktstift nach Anspruch 1, dadurch gekennzeichnet, daß der Kontaktstift vor der Verformung einen vieleckigen Querschnitt (3) aufweist, der nach der Verformung in einen nahezu quadratförmigen Querschnitt (4) übergeht, wodurch die Stiftdiagonale nach der Verformung (5) größer ist, als der maximale Durchmesser des Stiftes vor der Verfomung (6).7. Contact pin according to claim 1, characterized in that the contact pin has a polygonal cross-section (3) before deformation, which changes into an almost square cross-section (4) after deformation, whereby the pin diagonal after deformation (5) is larger than the maximum diameter of the pin before deformation (6). 8. Kontaktstift nach Anspruch 7, dadurch gekennzeichnet, daß die Anzahl der Ecken des vieleckigen Querschnitts gegen unendlich strebt, sodaß ein runder Querschnitt entsteht.8. Contact pin according to claim 7, characterized in that the number of corners of the polygonal cross-section tends towards infinity, so that a round cross-section is created. 9. Kontaktstift nach Anspruch 1, dadurch gekennzeichnet, daß der Kontaktstift vor der Verformung einen nahezu runden Querschnitt (7) aufweist, der nach der Verformung in einen ebenfalls runden Querschnitt (8) größeren Durchmessers (9) übergeht.9. Contact pin according to claim 1, characterized in that the contact pin has an almost round cross-section (7) before the deformation, which after the deformation changes into a likewise round cross-section (8) of larger diameter (9). 10. Kontaktstift nach Anspruch 1, dadurch gekennzeichnet, daß die Kontaktzone eine gestanzte Zone (10) aufweist, die den Querschnitt des Stiftes in mindestens zwei örtlich getrennte Bereiche (11) trennt, wobei der Abstand der Außenkanten in radialer Richtung der Bereiche zueinander vor der Verformung (12) kleiner ist als nach der Verformung (13).10. Contact pin according to claim 1, characterized in that the contact zone has a punched zone (10) which divides the cross section of the pin into at least two spatially separated regions (11), the distance of the outer edges in the radial direction of the regions from one another being smaller before the deformation (12) than after the deformation (13). Martin Beißner . - S. 2 vonMartin Beißner . - p. 2 of
DE29613231U 1996-07-31 1996-07-31 Shape memory alloy expansion pin for making solderless connections Expired - Lifetime DE29613231U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29613231U DE29613231U1 (en) 1996-07-31 1996-07-31 Shape memory alloy expansion pin for making solderless connections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29613231U DE29613231U1 (en) 1996-07-31 1996-07-31 Shape memory alloy expansion pin for making solderless connections

Publications (1)

Publication Number Publication Date
DE29613231U1 true DE29613231U1 (en) 1996-12-12

Family

ID=8027211

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29613231U Expired - Lifetime DE29613231U1 (en) 1996-07-31 1996-07-31 Shape memory alloy expansion pin for making solderless connections

Country Status (1)

Country Link
DE (1) DE29613231U1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10109222A1 (en) * 2001-02-26 2002-09-12 Siemens Ag Mounting element for connecting two objects
EP1720387A1 (en) * 2005-05-03 2006-11-08 Franz Broch High current terminal with press fit portion
EP2259380A1 (en) * 2009-06-02 2010-12-08 Robert Bosch GmbH Connection device and method for producing same
DE102014114416A1 (en) * 2014-10-04 2016-04-07 Eugen Forschner Gmbh Contacting device and method for making an electrical contact
CN107989863A (en) * 2017-11-22 2018-05-04 有研亿金新材料有限公司 A kind of self-inflated connector for fastening boards and its preparation and application
CN111609027A (en) * 2020-06-03 2020-09-01 西北工业大学 Bushing and method for compensating deviation of connecting hole of aircraft wall plate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10109222A1 (en) * 2001-02-26 2002-09-12 Siemens Ag Mounting element for connecting two objects
EP1720387A1 (en) * 2005-05-03 2006-11-08 Franz Broch High current terminal with press fit portion
EP2259380A1 (en) * 2009-06-02 2010-12-08 Robert Bosch GmbH Connection device and method for producing same
DE102014114416A1 (en) * 2014-10-04 2016-04-07 Eugen Forschner Gmbh Contacting device and method for making an electrical contact
CN107989863A (en) * 2017-11-22 2018-05-04 有研亿金新材料有限公司 A kind of self-inflated connector for fastening boards and its preparation and application
CN111609027A (en) * 2020-06-03 2020-09-01 西北工业大学 Bushing and method for compensating deviation of connecting hole of aircraft wall plate
CN111609027B (en) * 2020-06-03 2021-10-01 西北工业大学 Method for compensating deviation of connecting hole of aircraft wall plate

Similar Documents

Publication Publication Date Title
DE69530103T2 (en) CONNECTING ELEMENTS FOR MICROELECTRONIC COMPONENTS
DE69905337T2 (en) Electrical filter connector group with a contact and a filter circuit group
DE102015211002B4 (en) Connector with a connector housing and a connector terminal
WO2005107019A1 (en) Pin for the soldering-free electric connection to a printed circuit board, a pressing-in tool, in addition to a method for the production of a soldering-free electric connection
DE60309777T2 (en) Connection contact for printed circuit board
DE69113679T2 (en) Method and component for mounting components on a printed circuit board.
DE68923016T2 (en) Electrical tail pin with compliant part.
DE3884766T2 (en) Adaptation device for conversion.
DE102015102840A1 (en) Spring clip connector
DE3010876A1 (en) METHOD FOR PRODUCING A CIRCUIT BOARD
DE102004006575A1 (en) Power distributor for a motor vehicle
DE69602172T2 (en) PRESSURE PIN AND ELECTRONIC DEVICE THEREFORE
DE202010013758U1 (en) Einlötkontaktanordnung
DE29613231U1 (en) Shape memory alloy expansion pin for making solderless connections
EP3477781A1 (en) Socket connector for circuit boards
WO2001008267A1 (en) Contact element for press-fitting into a printed circuit board hole
DE1276159B (en) Stopper plate with an insulating base and process for its manufacture
DE102012201124A1 (en) Band-shaped contact element, in particular for high-voltage connectors
DE2840828A1 (en) CONNECTING ELEMENT FOR PRINTED CIRCUITS
DE10017239A1 (en) Tuner unit has pressure device on frame bearer that presses surface of protrusion, which is inserted into main card opening, with connection conductor image towards second conductor image
DE102004041169B3 (en) Earthing system for linking an earth connection on an electric circuit carrier (ECC) to an earth conductor (EC) has a connection structure to make an electric connection between the ECC and the EC
DE102007061910A1 (en) Plug-in connector for use on pressed screen for printed circuit board, has plug-in element, where connector is joined by press fit connection of rounded hole and element such that diagonal dimension of element is larger than hole diameter
DE102012224225A1 (en) Flexible insertion pin for producing electrical interconnection between component and circuit board, has deformation zone whose connecting edges and contact edges abut on inner periphery of hole when insertion pin is located in hole
DE102013201689A1 (en) Screen housing i.e. aggregate housing, for receiving drive of motor car, has contact bush pressed into aperture of housing and coated with material that is different from material of housing
DE2048900C3 (en) Method for manufacturing a fork contact spring

Legal Events

Date Code Title Description
R086 Non-binding declaration of licensing interest
R207 Utility model specification

Effective date: 19970130

R156 Lapse of ip right after 3 years

Effective date: 20000701