DE2952790A1 - Transistor mounting and contact device - uses insulating base with looped wires inserted through slots in transistor baseplate before adding springs - Google Patents
Transistor mounting and contact device - uses insulating base with looped wires inserted through slots in transistor baseplate before adding springsInfo
- Publication number
- DE2952790A1 DE2952790A1 DE19792952790 DE2952790A DE2952790A1 DE 2952790 A1 DE2952790 A1 DE 2952790A1 DE 19792952790 DE19792952790 DE 19792952790 DE 2952790 A DE2952790 A DE 2952790A DE 2952790 A1 DE2952790 A1 DE 2952790A1
- Authority
- DE
- Germany
- Prior art keywords
- transistor
- parts
- slots
- lower parts
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
Description
Transistor-Befestigungsteil fur Transistoren, Transistor mounting part for transistors,
die mittels Druckfederkletmnen befestigt werden. which are attached by means of compression spring clips.
Gegenstand der Erfindung ist ein Befestigungs-Unterteil rur Baukasten-Transistoren, die eine Grundplatte mit Durchgangschlitzen aufweisen und von Draht-Schlaufen und DrucKtederrs gehalten werden, indem die Anschluj3-Drahtenden durch die Schlaufen-Enden hindurchgeführt werden. Hierdurch wird vermieden, daß durch schräg oder verdreht sitzende Drahtshlaufen die Montage der Transistoren sehr erschwert wird. Dieses Befestigwigs-Unterteil wird auch von unten in die mit Quadrat-Abstand gelochte Montageplatte aus Isoliermaterial eingesetzt.The subject of the invention is a mounting base for modular transistors, which have a base plate with through slots and wire loops and Pressure springs are held in place by pulling the connecting wire ends through the loop ends be passed through. This avoids being skewed or twisted Sitting wire loops make the assembly of the transistors very difficult. This The lower part of the fastening wig is also inserted from below into the mounting plate, which is perforated with a square spacing made of insulating material.
Dieses Transistor-Befestigwjgsteil ist in Figur 1 und k dargestellt. Figur 1 stellt die Draufsicht dar urld Figur a die Ansicht in Richtung A. Figur 3 stellt den Schnitt B-B durch die Anschlufßdräbte des Transistors 1 dar und Figur 4 die Seitenansicht des Transistors. Die zugehörigen Druckfedern sind nicht dargestellt.This transistor fastening part is shown in FIGS. 1 and k. FIG. 1 shows the top view and FIG. A the view in the direction A. FIG 3 shows the section B-B through the connecting wires of the transistor 1 and FIG 4 shows the side view of the transistor. The associated compression springs are not shown.
Teil 1 ist der Transistor und Teil 2 seine Grundplatte, die in ähnlicher Ausfuhrurig bexannt ist und mit Durcng#'iigschlitzen a für die Drahtschlaufen 3 des Unterteils 4 versehen ist, wie die aus Kupferblech oder einem sonstigen Stromleitungsmetall bestehenden Leitungsstücke 5 bis Y, die fest auf der Oberseite der Grundplatte 2 angeordnet sind.Part 1 is the transistor and part 2 is its baseplate, which is similar The design is marked and with continuous slits a for the wire loops 3 of the lower part 4 is provided, such as that made of sheet copper or some other power line metal existing line pieces 5 to Y, which are firmly attached to the top of the base plate 2 are arranged.
Das auch aus Isoliermaterial wie das Teil 2 bestehende Teil 8 ist mit den Stahldraht-Schlaufen 3a, 3b, 3c und 3d versehen, die in diesem Teil d einen ausreichenden Festsitz haben müssen. Im einfachsten Fall ist das Teil 8 auch mit Schlitzen a versehen, in welche die Stahldraht-Sc hlaufen 5 von unten eingestecKt werden. Bei der Ausführung B dieses Unterteiles 4 sind die Stahldraht-Schlaufen 3 im Bereich ihrer Befestigungsenden vollstandig vom Material des Teiles 8 umgeben. Die Ausfuhrung C dieses Verbundteiles 8-3a-5b-§c-3d hat auch von unten eingesteckte Drahtschlaufen 3 und ein zusätzliches Abdeckplättchen aus Kunststoff an der Unterseite, das aufgeklebt oder auf ahliliche Weise an Teil 8 befestigt ist.The part 8 is also made of insulating material like part 2 provided with the steel wire loops 3a, 3b, 3c and 3d, which in this part d a must be sufficiently tight. In the simplest case, part 8 is also included Provided slots a into which the steel wire loops 5 are inserted from below will. In the case of version B of this lower part 4, the steel wire loops are 3 in the area their fastening ends completely from the material of the Part 8 surrounded. The execution C of this composite part 8-3a-5b-§c-3d also has from Wire loops 3 inserted at the bottom and an additional cover plate made of plastic on the underside, which is glued on or attached to part 8 in a similar manner.
Wie bei einzeln eingesetzten Stahldraht-Schlaufen kommt die Befestigung des Transistors auch dadurch zustande, daß die nicht dargestellten Druckfedern die Grundplatte 2 des Transistors gegen die quer eingesteckten Anschluß-Drahtenden drücken, womit gleichzeitig auch die Zuleitungen angeschlossen sind. Der besondere Vorteil eines auf diese Weise befestigten Transistors besteht darin, daß nicht nur eine einzelne Zuleitung sehr leicht an- und abzuklemmen ist, sondern daß die ganze Montage eines derartigen Transistors sehr leicht zu machen ist.As with individually used steel wire loops, the fastening comes of the transistor is also due to the fact that the compression springs, not shown, the Press the base plate 2 of the transistor against the transversely inserted connection wire ends, with which the supply lines are connected at the same time. The special advantage of a transistor attached in this way is that not just one individual supply line is very easy to connect and disconnect, but that the whole assembly such a transistor is very easy to make.
Damit das Unterteil 4 (Verbundteil 8-3a-3b-3c-3d) beim Aufsetzten des Transistors nicht nach unten weggedrückt wird, ist es vorteilhaft, das Teil 4 so zu dimensionieren, d seine Unterfläche mit der Auflageebene (Stellebene) bündig ist. Aus diesem Grund kann das Teil 4 zusätzlich mit Fui3-ansätzen versehen werden. Die Befestiguiigs-Unterteile 4 (Verbundteile 8-3a-3b-3c-3d) werden von unten, das heißt, in der umgedrehten Montageplatte von oben an den entsprechenden Stellen eingesetzt und dann eine Montage-Hilfsplatte als Herausfall-Sicherung darübergelegt und dann in zusammengehaltener Stellung wieder umgedreht und auf der Tischfläche abgesetzt. Sobald die Transistoren montiert sind, halton auch die Unterteile 4 (Verbundteile 8-3a-3b-3c-3d) von selbst.So that the lower part 4 (composite part 8-3a-3b-3c-3d) when put on of the transistor is not pushed downwards, it is advantageous to use the part 4 to be dimensioned in such a way that its lower surface is flush with the support plane (positioning plane) is. For this reason, part 4 can also be provided with Fui3 attachments. The fastening lower parts 4 (composite parts 8-3a-3b-3c-3d) are from below, the that is, inserted into the upturned mounting plate from above at the appropriate points and then a mounting auxiliary plate placed over it to prevent it from falling out, and then turned back in a held position and placed on the table surface. As soon as the transistors are mounted, the lower parts 4 (composite parts 8-3a-3b-3c-3d) by itself.
Falls mit irgendwelchen Mitteln zwischen den nicht åargestellten Druckfedern und der zugehörigen Stahldrahtschlaufe 3a oder 3b oder 3c oder 3d ein ausreichend guter Kontakt zu erzielen ist, können die Teile 5 bis 7 bei einer entsDre-henden Sonderausführung auf der Unterseite von Teil 2 angeordnet werden.If by any means between the compression springs not shown and the associated steel wire loop 3a or 3b or 3c or 3d is sufficient If good contact is to be achieved, parts 5 to 7 can be rotated with one another Special design can be arranged on the underside of part 2.
L e e r s e i t eL e r s e i t e
Claims (3)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792952790 DE2952790A1 (en) | 1979-12-31 | 1979-12-31 | Transistor mounting and contact device - uses insulating base with looped wires inserted through slots in transistor baseplate before adding springs |
DE19803000115 DE3000115A1 (en) | 1979-12-31 | 1980-01-03 | Transistor connection forming device - has locking clips and springs fitted over strips inserted through slots in transistor carrier plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792952790 DE2952790A1 (en) | 1979-12-31 | 1979-12-31 | Transistor mounting and contact device - uses insulating base with looped wires inserted through slots in transistor baseplate before adding springs |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2952790A1 true DE2952790A1 (en) | 1981-07-02 |
Family
ID=6089904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19792952790 Withdrawn DE2952790A1 (en) | 1979-12-31 | 1979-12-31 | Transistor mounting and contact device - uses insulating base with looped wires inserted through slots in transistor baseplate before adding springs |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE2952790A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19519271A1 (en) * | 1995-05-22 | 1996-11-28 | Deutsche Telephonwerk Kabel | Spring contact blade e.g. for printed circuit boards of keyboards and loudspeakers |
-
1979
- 1979-12-31 DE DE19792952790 patent/DE2952790A1/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19519271A1 (en) * | 1995-05-22 | 1996-11-28 | Deutsche Telephonwerk Kabel | Spring contact blade e.g. for printed circuit boards of keyboards and loudspeakers |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8139 | Disposal/non-payment of the annual fee |