DE29517980U1 - Soldering device for connectors - Google Patents
Soldering device for connectorsInfo
- Publication number
- DE29517980U1 DE29517980U1 DE29517980U DE29517980U DE29517980U1 DE 29517980 U1 DE29517980 U1 DE 29517980U1 DE 29517980 U DE29517980 U DE 29517980U DE 29517980 U DE29517980 U DE 29517980U DE 29517980 U1 DE29517980 U1 DE 29517980U1
- Authority
- DE
- Germany
- Prior art keywords
- connector
- circuit board
- generic term
- connectors
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 4
- 238000011161 development Methods 0.000 claims 1
- 230000018109 developmental process Effects 0.000 claims 1
- 235000000396 iron Nutrition 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/03—Soldering irons; Bits electrically heated
- B23K3/0338—Constructional features of electric soldering irons
- B23K3/0353—Heating elements or heating element housings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
BeschreibungDescription
Titel&igr;Title&igr;
Stand der Technik:State of the art:
ProblemiProblems
Erfindung:Invention:
Vorteilhafte Wirkungen:Beneficial Effects:
Vorrichtung zum Löten von Steckverbindern an Leiterplatten.Device for soldering connectors to circuit boards.
Zum Löten von Steckverbindern an Leiterplatten gibt, es eine Reihe von Standardverfahren, z.B. nach vorangegangenem Lotpastendruck einen Reflow-Prozeß durchzuführen. Insbesondere beim 2-seitigen Löten gibt es hier Probleme, die vor allem beim Bearbeiten kleiner Stückzahlen wirtschaftlich schwer zu lösen sind. Dies bezieht sich insbesondere auf Steckverbinder nach dem PCMCIA-Standard (PC-Cards), die an eine Leiterplatte gelötet werden sollen, die in SMD-Technologie bestückt ist und nur sehr geringe Zinnmengen aufweist. In Verbindung mit Steckverbindern, die im Kontaktbereich ein Lotdepot aufweisen, ist das Löten mittels hot bars ebenso möglich wie das Löten mittels Bügel.There are a number of standard methods for soldering connectors to circuit boards, e.g. carrying out a reflow process after printing the solder paste. There are problems with 2-sided soldering in particular, which are difficult to solve economically, especially when processing small quantities. This particularly applies to connectors according to the PCMCIA standard (PC cards) that are to be soldered to a circuit board that is assembled using SMD technology and has only very small amounts of tin. In conjunction with connectors that have a solder deposit in the contact area, soldering using hot bars is just as possible as soldering using brackets.
Der In Anspruch 1 angegebenen Erfindung liegt das Problem zugrunde, eine Vorrichtung zu schaffen, die mit einem Minimum am Aktuatoren (manuell, maschinell) die erforderlichen ProzeßschritteThe invention specified in claim 1 is based on the problem of creating a device that carries out the required process steps with a minimum of actuators (manual, mechanical).
- L\agebestimmung,- location determination,
- mechanisches Fügen,- mechanical joining,
- Löten mit definiertem Temperatur-Zeitprofil (ümpulsheizung), - Soldering with defined temperature-time profile (pulse heating),
- Dsgefixierung der Fügepartner bis zum Ende der AXJbhühlphase- Fixing of the joining partners until the end of the AXJbhool phase
ausführt.executes.
Diese wird mit den Maßnahmen des Anspruchs 1 his 4 gelöst.This is solved with the measures of claims 1 to 4.
Mitz der Erfindung wird im angegebenen Anwendungsfall erreicht, daß das mechanische Fügen undt Löten von Steckverbindern mit nur 2 Bewegungen se&r effektiv und sicher ausgeführt werden kann: With the invention, in the specified application, it is achieved that the mechanical joining and soldering of connectors can be carried out very effectively and safely with only 2 movements:
- !linearbewegung (7) des auf einem Shuttle !befindlichen Steckverbinders vor die Leiterplatte, ' - !linear movement (7) of the connector on a shuttle !in front of the circuit board, '
- R&tation (8) mittels Handhebel oder anderer SJktuatoren zur Realisierung von Lage fixierung, mechanischem Fügen, Löten und Fixieren bis zum Ende der Abkühlphase. - R&tation (8) by means of hand lever or other actuators to realize position fixation, mechanical joining, soldering and fixing until the end of the cooling phase.
Darstellung der ErfindungDescription of the invention
Ein Ausführungsbeispiel der Erfindung wird anhand Figur 1 gezeigt, die wesentlichen Funktionselemente sind in der zugehörigen Legende benannt.An embodiment of the invention is shown in Figure 1 ; the essential functional elements are named in the associated legend.
Das Prinzip der Fügebewegung ist in den Figuren 2 und 3 dargestellt; Figur 2 zeigt die prinzipiellen Bewegungsabläufe von Steckverbinder zu Leiterplatte, in Figur 3 ist der Bewegungsablauf der weiteren Funktionselemente ersichtlich.The principle of the joining movement is shown in Figures 2 and 3; Figure 2 shows the basic movement sequences from the connector to the circuit board, and Figure 3 shows the movement sequence of the other functional elements.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29517980U DE29517980U1 (en) | 1995-11-14 | 1995-11-14 | Soldering device for connectors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29517980U DE29517980U1 (en) | 1995-11-14 | 1995-11-14 | Soldering device for connectors |
Publications (1)
Publication Number | Publication Date |
---|---|
DE29517980U1 true DE29517980U1 (en) | 1996-04-18 |
Family
ID=8015375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE29517980U Expired - Lifetime DE29517980U1 (en) | 1995-11-14 | 1995-11-14 | Soldering device for connectors |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE29517980U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112743178A (en) * | 2020-11-26 | 2021-05-04 | 江西宁鸿电子技术有限公司 | Full-automatic dip soldering machine |
-
1995
- 1995-11-14 DE DE29517980U patent/DE29517980U1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112743178A (en) * | 2020-11-26 | 2021-05-04 | 江西宁鸿电子技术有限公司 | Full-automatic dip soldering machine |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R086 | Non-binding declaration of licensing interest | ||
R207 | Utility model specification |
Effective date: 19960530 |
|
R156 | Lapse of ip right after 3 years |
Effective date: 19990901 |