DE29508865U1 - Control device for the presence of solder paste when it is applied to reflow solderable circuit boards - Google Patents

Control device for the presence of solder paste when it is applied to reflow solderable circuit boards

Info

Publication number
DE29508865U1
DE29508865U1 DE29508865U DE29508865U DE29508865U1 DE 29508865 U1 DE29508865 U1 DE 29508865U1 DE 29508865 U DE29508865 U DE 29508865U DE 29508865 U DE29508865 U DE 29508865U DE 29508865 U1 DE29508865 U1 DE 29508865U1
Authority
DE
Germany
Prior art keywords
control device
circuit boards
solder paste
reflow solderable
solderable circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29508865U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE29508865U priority Critical patent/DE29508865U1/en
Publication of DE29508865U1 publication Critical patent/DE29508865U1/en
Priority to PCT/DE1996/000925 priority patent/WO1996038253A1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0804—Machines for printing sheets
    • B41F15/0813—Machines for printing sheets with flat screens
    • B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
DE29508865U 1995-05-29 1995-05-29 Control device for the presence of solder paste when it is applied to reflow solderable circuit boards Expired - Lifetime DE29508865U1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE29508865U DE29508865U1 (en) 1995-05-29 1995-05-29 Control device for the presence of solder paste when it is applied to reflow solderable circuit boards
PCT/DE1996/000925 WO1996038253A1 (en) 1995-05-29 1996-05-28 Device for checking the presence of soldering paste during application to printed circuit boards which can be reflow-soldered

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29508865U DE29508865U1 (en) 1995-05-29 1995-05-29 Control device for the presence of solder paste when it is applied to reflow solderable circuit boards

Publications (1)

Publication Number Publication Date
DE29508865U1 true DE29508865U1 (en) 1995-08-03

Family

ID=8008692

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29508865U Expired - Lifetime DE29508865U1 (en) 1995-05-29 1995-05-29 Control device for the presence of solder paste when it is applied to reflow solderable circuit boards

Country Status (2)

Country Link
DE (1) DE29508865U1 (en)
WO (1) WO1996038253A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2347021B (en) * 1998-12-01 2003-07-09 Dovatron Res & Dev Ltd A circuit board manufacturing apparatus
JP4643719B2 (en) * 2009-02-09 2011-03-02 ヤマハ発動機株式会社 Solder supply apparatus, printing apparatus and printing method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3570741A (en) * 1968-07-16 1971-03-16 Western Electric Co Level control system for liquid solder
JPS63312838A (en) * 1987-06-16 1988-12-21 Cmk Corp Method and apparatus for preventing lack of ink in printing step
DE3827473A1 (en) * 1987-09-09 1989-03-30 Siemens Ag CIRCUIT BOARD TO EQUIP WITH SMD BLOCKS
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
US4889273A (en) * 1988-06-16 1989-12-26 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
JPH0237964A (en) * 1988-07-27 1990-02-07 Mitsubishi Electric Corp Automatic soldering level adjusting device
GB2257386B (en) * 1991-06-24 1995-07-05 Tani Denki Kogyo Kk Screen printing apparatus
US5201452A (en) * 1992-07-24 1993-04-13 Matsushita Electric Industrial Co., Ltd. Screen printing apparatus

Also Published As

Publication number Publication date
WO1996038253A1 (en) 1996-12-05

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19950914

R156 Lapse of ip right after 3 years

Effective date: 19990302