HK1005709A1 - Improved stencil or mask for applying solder to circuit boards - Google Patents

Improved stencil or mask for applying solder to circuit boards

Info

Publication number
HK1005709A1
HK1005709A1 HK98104860A HK98104860A HK1005709A1 HK 1005709 A1 HK1005709 A1 HK 1005709A1 HK 98104860 A HK98104860 A HK 98104860A HK 98104860 A HK98104860 A HK 98104860A HK 1005709 A1 HK1005709 A1 HK 1005709A1
Authority
HK
Hong Kong
Prior art keywords
mask
circuit boards
applying solder
improved stencil
stencil
Prior art date
Application number
HK98104860A
Inventor
David Godfrey Williams
Original Assignee
Alpha Fry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd
Publication of HK1005709A1 publication Critical patent/HK1005709A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
HK98104860A 1993-04-03 1998-06-04 Improved stencil or mask for applying solder to circuit boards HK1005709A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9306971A GB2276589B (en) 1993-04-03 1993-04-03 Improved stencil or mask for applying solder to circuit boards

Publications (1)

Publication Number Publication Date
HK1005709A1 true HK1005709A1 (en) 1999-01-22

Family

ID=10733283

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98104860A HK1005709A1 (en) 1993-04-03 1998-06-04 Improved stencil or mask for applying solder to circuit boards

Country Status (2)

Country Link
GB (1) GB2276589B (en)
HK (1) HK1005709A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2291624A (en) * 1994-07-26 1996-01-31 Micro Metallic Ltd Improved stencil or mask
GB2303333B (en) * 1995-07-20 1998-09-23 David Godfrey Williams Improved apparatus for supporting and tensioning a stencil or mask for use in applying solder paste to circuit boards and a mounting support means therefor
EP0788876B1 (en) * 1996-01-24 1999-09-01 Fritz Borsi Kg Method of coating a transparent carrier plate and transparent carrier plate manufactured by said process, especially for display boxes
GB2317366B (en) * 1996-09-19 2000-09-20 David Godfrey Williams Improved stencil tensioning frame and stencil mounting/dismounting apparatus therefor
WO1999013695A1 (en) * 1997-09-11 1999-03-18 Micro Metallic Limited Improved stencil or mask for printing fluid material
GB2364961B (en) * 2001-08-10 2002-06-26 Tecan Components Ltd Stencil for use with stencil mounting frame
US6897164B2 (en) 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
US6821348B2 (en) 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
DE102004036662B3 (en) 2004-07-28 2006-05-04 Lpkf Laser & Electronics Ag Method for penetrating apertures in a stencil or mask
LT5825B (en) 2010-09-06 2012-04-25 Uab "Laser Stencil Europe", , Stencil for solder paste or glue application
TW201313489A (en) * 2011-09-16 2013-04-01 Askey Technology Jiangsu Ltd Stencil for coating solder paste on printed circuit board
WO2015101392A1 (en) * 2013-12-30 2015-07-09 Applied Materials Italia S.R.L. Stencil system, printing system, and method for printing a pattern of electrically conductive material
GB2588633B (en) * 2019-10-29 2023-11-22 Tannlin Tech Limited Precision cut printing screen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668028A (en) * 1970-06-10 1972-06-06 Du Pont Method of making printing masks with high energy beams
GB2264460B (en) * 1992-06-03 1994-02-16 David Godfrey Williams Improved stencil or mask for applying solder to circuit boards and support frame
GB9220700D0 (en) * 1992-10-01 1992-11-11 Cane Paul A screen printing stencil

Also Published As

Publication number Publication date
GB2276589B (en) 1996-07-31
GB2276589A (en) 1994-10-05
GB9306971D0 (en) 1993-05-26

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090403