DE29509412U1 - Squeegee for applying solder paste to printed circuit boards - Google Patents

Squeegee for applying solder paste to printed circuit boards

Info

Publication number
DE29509412U1
DE29509412U1 DE29509412U DE29509412U DE29509412U1 DE 29509412 U1 DE29509412 U1 DE 29509412U1 DE 29509412 U DE29509412 U DE 29509412U DE 29509412 U DE29509412 U DE 29509412U DE 29509412 U1 DE29509412 U1 DE 29509412U1
Authority
DE
Germany
Prior art keywords
squeegee
printed circuit
circuit boards
solder paste
applying solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29509412U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE29509412U priority Critical patent/DE29509412U1/en
Publication of DE29509412U1 publication Critical patent/DE29509412U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/44Squeegees or doctors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139Blade or squeegee, e.g. for screen printing or filling of holes
DE29509412U 1995-06-08 1995-06-08 Squeegee for applying solder paste to printed circuit boards Expired - Lifetime DE29509412U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29509412U DE29509412U1 (en) 1995-06-08 1995-06-08 Squeegee for applying solder paste to printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29509412U DE29509412U1 (en) 1995-06-08 1995-06-08 Squeegee for applying solder paste to printed circuit boards

Publications (1)

Publication Number Publication Date
DE29509412U1 true DE29509412U1 (en) 1995-11-09

Family

ID=8009091

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29509412U Expired - Lifetime DE29509412U1 (en) 1995-06-08 1995-06-08 Squeegee for applying solder paste to printed circuit boards

Country Status (1)

Country Link
DE (1) DE29509412U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10344454A1 (en) * 2003-09-25 2005-05-04 Muehlbauer Ag Adhesive application device for flexible tape-like substrates for microchip modules has straightedge elements for spreading adhesive fed to areas of surface that are moved parallel to surface above and/or below template type device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10344454A1 (en) * 2003-09-25 2005-05-04 Muehlbauer Ag Adhesive application device for flexible tape-like substrates for microchip modules has straightedge elements for spreading adhesive fed to areas of surface that are moved parallel to surface above and/or below template type device
DE10344454B4 (en) * 2003-09-25 2006-04-27 Mühlbauer Ag Adhesive applicator for flexible belt-like carrier substrates

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19951221

R150 Term of protection extended to 6 years

Effective date: 19981120

R151 Term of protection extended to 8 years

Effective date: 20020116

R158 Lapse of ip right after 8 years

Effective date: 20031231