DE29509412U1 - Squeegee for applying solder paste to printed circuit boards - Google Patents
Squeegee for applying solder paste to printed circuit boardsInfo
- Publication number
- DE29509412U1 DE29509412U1 DE29509412U DE29509412U DE29509412U1 DE 29509412 U1 DE29509412 U1 DE 29509412U1 DE 29509412 U DE29509412 U DE 29509412U DE 29509412 U DE29509412 U DE 29509412U DE 29509412 U1 DE29509412 U1 DE 29509412U1
- Authority
- DE
- Germany
- Prior art keywords
- squeegee
- printed circuit
- circuit boards
- solder paste
- applying solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/44—Squeegees or doctors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29509412U DE29509412U1 (en) | 1995-06-08 | 1995-06-08 | Squeegee for applying solder paste to printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29509412U DE29509412U1 (en) | 1995-06-08 | 1995-06-08 | Squeegee for applying solder paste to printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
DE29509412U1 true DE29509412U1 (en) | 1995-11-09 |
Family
ID=8009091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE29509412U Expired - Lifetime DE29509412U1 (en) | 1995-06-08 | 1995-06-08 | Squeegee for applying solder paste to printed circuit boards |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE29509412U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10344454A1 (en) * | 2003-09-25 | 2005-05-04 | Muehlbauer Ag | Adhesive application device for flexible tape-like substrates for microchip modules has straightedge elements for spreading adhesive fed to areas of surface that are moved parallel to surface above and/or below template type device |
-
1995
- 1995-06-08 DE DE29509412U patent/DE29509412U1/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10344454A1 (en) * | 2003-09-25 | 2005-05-04 | Muehlbauer Ag | Adhesive application device for flexible tape-like substrates for microchip modules has straightedge elements for spreading adhesive fed to areas of surface that are moved parallel to surface above and/or below template type device |
DE10344454B4 (en) * | 2003-09-25 | 2006-04-27 | Mühlbauer Ag | Adhesive applicator for flexible belt-like carrier substrates |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 19951221 |
|
R150 | Term of protection extended to 6 years |
Effective date: 19981120 |
|
R151 | Term of protection extended to 8 years |
Effective date: 20020116 |
|
R158 | Lapse of ip right after 8 years |
Effective date: 20031231 |