DE29804466U1 - Apply solder paste to a circuit board - Google Patents

Apply solder paste to a circuit board

Info

Publication number
DE29804466U1
DE29804466U1 DE29804466U DE29804466U DE29804466U1 DE 29804466 U1 DE29804466 U1 DE 29804466U1 DE 29804466 U DE29804466 U DE 29804466U DE 29804466 U DE29804466 U DE 29804466U DE 29804466 U1 DE29804466 U1 DE 29804466U1
Authority
DE
Germany
Prior art keywords
circuit board
solder paste
apply solder
apply
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29804466U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE29804466U priority Critical patent/DE29804466U1/en
Publication of DE29804466U1 publication Critical patent/DE29804466U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
DE29804466U 1998-03-12 1998-03-12 Apply solder paste to a circuit board Expired - Lifetime DE29804466U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29804466U DE29804466U1 (en) 1998-03-12 1998-03-12 Apply solder paste to a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29804466U DE29804466U1 (en) 1998-03-12 1998-03-12 Apply solder paste to a circuit board

Publications (1)

Publication Number Publication Date
DE29804466U1 true DE29804466U1 (en) 1998-07-30

Family

ID=8054067

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29804466U Expired - Lifetime DE29804466U1 (en) 1998-03-12 1998-03-12 Apply solder paste to a circuit board

Country Status (1)

Country Link
DE (1) DE29804466U1 (en)

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19980910

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20010710

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20040602

R158 Lapse of ip right after 8 years

Effective date: 20061003