DE2937886C2 - - Google Patents

Info

Publication number
DE2937886C2
DE2937886C2 DE2937886A DE2937886A DE2937886C2 DE 2937886 C2 DE2937886 C2 DE 2937886C2 DE 2937886 A DE2937886 A DE 2937886A DE 2937886 A DE2937886 A DE 2937886A DE 2937886 C2 DE2937886 C2 DE 2937886C2
Authority
DE
Germany
Prior art keywords
cover layer
circuit board
printed circuit
adhesive
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2937886A
Other languages
German (de)
English (en)
Other versions
DE2937886A1 (de
Inventor
Mitsuo Chigasaki Kanagawa Jp Ohsawa
Masato Kamakura Kanagawa Jp Yamamura
Toshio Tokio/Tokyo Jp Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE2937886A1 publication Critical patent/DE2937886A1/de
Application granted granted Critical
Publication of DE2937886C2 publication Critical patent/DE2937886C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE19792937886 1978-09-21 1979-09-19 Leiterplatte fuer gedruckte schaltung Granted DE2937886A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978129884U JPS5726379Y2 (US06589383-20030708-C00041.png) 1978-09-21 1978-09-21

Publications (2)

Publication Number Publication Date
DE2937886A1 DE2937886A1 (de) 1980-04-03
DE2937886C2 true DE2937886C2 (US06589383-20030708-C00041.png) 1988-06-01

Family

ID=15020709

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19792937886 Granted DE2937886A1 (de) 1978-09-21 1979-09-19 Leiterplatte fuer gedruckte schaltung

Country Status (9)

Country Link
US (1) US4326239A (US06589383-20030708-C00041.png)
JP (1) JPS5726379Y2 (US06589383-20030708-C00041.png)
CA (1) CA1130012A (US06589383-20030708-C00041.png)
DE (1) DE2937886A1 (US06589383-20030708-C00041.png)
GB (1) GB2032190B (US06589383-20030708-C00041.png)
HK (1) HK57484A (US06589383-20030708-C00041.png)
NL (1) NL7907015A (US06589383-20030708-C00041.png)
PH (1) PH18592A (US06589383-20030708-C00041.png)
SG (1) SG14684G (US06589383-20030708-C00041.png)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489365A (en) * 1982-09-17 1984-12-18 Burroughs Corporation Universal leadless chip carrier mounting pad
GB2147148A (en) * 1983-09-27 1985-05-01 John Patrick Burke Electronic circuit assembly
DE3414552A1 (de) * 1984-04-17 1985-10-17 geb. Baur Christine 8042 Oberschleißheim Irnstetter Verfahren und vorrichtung zur montage anschlussleiterloser elektrischer bauelemente
US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
DE3619212A1 (de) * 1986-06-07 1987-12-10 Philips Patentverwaltung Passives elektrisches bauelement
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
CA1278876C (en) * 1986-12-25 1991-01-08 Sho Masujima Adhesive mounted electronic circuit element
GB2211667A (en) * 1986-12-29 1989-07-05 Motorola Inc Method for inspecting printed circuit boards for missing or misplaced components
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
JPS6419587U (US06589383-20030708-C00041.png) * 1987-07-27 1989-01-31
US4869671A (en) * 1988-02-22 1989-09-26 Instrument Specialties Co., Inc. Electrical connector for printed circuit board
US4859808A (en) * 1988-06-28 1989-08-22 Delco Electronics Corporation Electrical conductor having unique solder dam configuration
US4893216A (en) * 1988-08-09 1990-01-09 Northern Telecom Limited Circuit board and method of soldering
US5726861A (en) * 1995-01-03 1998-03-10 Ostrem; Fred E. Surface mount component height control
US5835006A (en) * 1996-05-22 1998-11-10 Moorola, Inc. Vibrator assembly
US6060169A (en) 1997-11-24 2000-05-09 International Business Machines Corporation Coating Material and method for providing asset protection
US6190759B1 (en) 1998-02-18 2001-02-20 International Business Machines Corporation High optical contrast resin composition and electronic package utilizing same
US20070289129A1 (en) * 2004-08-06 2007-12-20 Wing Kenneth E Selective Encapsulation of Electronic Components
JP2019165043A (ja) * 2018-03-19 2019-09-26 日立オートモティブシステムズ株式会社 電子回路装置および回路基板の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2804607A (en) * 1954-07-02 1957-08-27 Jr George S Nalle Dispatcher's board with movable facing sections
DE1882564U (de) * 1963-02-21 1963-11-14 Philips Patentverwaltung Isolierplatte mit flaechenhaften leitungszuegen.
US3296360A (en) * 1965-01-04 1967-01-03 Gen Electric Electrical isolation means for components on a printed circuit board
US3410949A (en) * 1967-10-16 1968-11-12 Tischler Morris Plastic embedded color-coded printed circuit
DE1937009A1 (de) * 1969-07-21 1971-01-28 Siemens Ag Kontaktfreie UEberkreuzung von Leitbahnen
US3621116A (en) * 1969-12-29 1971-11-16 Bertram C Adams Printed circuit board
US3917984A (en) * 1974-10-01 1975-11-04 Microsystems Int Ltd Printed circuit board for mounting and connecting a plurality of semiconductor devices
US3955023A (en) * 1974-11-01 1976-05-04 Texas Instruments Incorporated Black dielectric mask on white substrate
US3989338A (en) * 1974-11-08 1976-11-02 Gosser Robert B Push-pin assembly method and construction
JPS5617991Y2 (US06589383-20030708-C00041.png) * 1975-10-15 1981-04-27
JPS568216Y2 (US06589383-20030708-C00041.png) * 1976-06-18 1981-02-23
US4164778A (en) * 1976-07-20 1979-08-14 Matsushita Electric Industrial Co., Ltd. Printed circuit board
US4130722A (en) * 1977-01-10 1978-12-19 Globe-Union Inc. Thick-film circuit module including a monolithic ceramic cross-over device

Also Published As

Publication number Publication date
SG14684G (en) 1985-02-15
NL7907015A (nl) 1980-03-25
PH18592A (en) 1985-08-12
US4326239A (en) 1982-04-20
HK57484A (en) 1984-08-03
DE2937886A1 (de) 1980-04-03
CA1130012A (en) 1982-08-17
GB2032190B (en) 1983-03-23
JPS5726379Y2 (US06589383-20030708-C00041.png) 1982-06-08
GB2032190A (en) 1980-04-30
JPS5547733U (US06589383-20030708-C00041.png) 1980-03-28

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: H05K 3/32

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee