DE2862050D1 - Solid-state means carrier, its manufacture and its use in a fluid cooling system of such means - Google Patents

Solid-state means carrier, its manufacture and its use in a fluid cooling system of such means

Info

Publication number
DE2862050D1
DE2862050D1 DE7878430019T DE2862050T DE2862050D1 DE 2862050 D1 DE2862050 D1 DE 2862050D1 DE 7878430019 T DE7878430019 T DE 7878430019T DE 2862050 T DE2862050 T DE 2862050T DE 2862050 D1 DE2862050 D1 DE 2862050D1
Authority
DE
Germany
Prior art keywords
manufacture
solid
cooling system
fluid cooling
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE7878430019T
Other languages
English (en)
Inventor
Kenneth Selig Sachar
Victor Joseph Silvestri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE2862050D1 publication Critical patent/DE2862050D1/de
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE7878430019T 1977-12-19 1978-11-17 Solid-state means carrier, its manufacture and its use in a fluid cooling system of such means Expired DE2862050D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86193177A 1977-12-19 1977-12-19

Publications (1)

Publication Number Publication Date
DE2862050D1 true DE2862050D1 (en) 1982-11-11

Family

ID=25337139

Family Applications (1)

Application Number Title Priority Date Filing Date
DE7878430019T Expired DE2862050D1 (en) 1977-12-19 1978-11-17 Solid-state means carrier, its manufacture and its use in a fluid cooling system of such means

Country Status (3)

Country Link
EP (1) EP0002996B1 (de)
JP (1) JPS5487959A (de)
DE (1) DE2862050D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56113996A (en) * 1980-02-08 1981-09-08 Anan Kogyo Koutou Senmon Gatsukouchiyou Boiling heat conduction structure with angular groove
ES8507731A1 (es) * 1983-03-24 1985-09-01 Uop Inc Un dispositivo de cinta de superficie de ebullicion nucleada mejorada
JPS60140609A (ja) * 1983-12-27 1985-07-25 シャープ株式会社 透湿性導電膜の製造方法
EP0209630B1 (de) * 1985-07-18 1990-07-11 International Business Machines Corporation Wärmeübertragungselement und seine Verwendung in einer Schaltungspackung
FR2945337B1 (fr) * 2009-05-06 2012-05-25 Commissariat Energie Atomique Dispositif d'echange thermique a coefficient d'echange thermique augmente et procede de realisation d'un tel dispositif
US11201103B2 (en) 2019-05-31 2021-12-14 Microsoft Technology Licensing, Llc Vapor chamber on heat-generating component
JP2023127432A (ja) * 2022-03-01 2023-09-13 国立大学法人九州大学 冷却器及び冷却装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH207351A (de) * 1937-11-19 1939-10-31 Berghaus Bernhard Verfahren zur Erzeugung festhaftender Metallüberzüge auf metallischen Gegenständen.
CA970910A (en) * 1971-06-21 1975-07-15 Universal Oil Products Company Porous boiling surface and method of application
DE2441613C2 (de) * 1974-08-30 1986-01-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung
JPS5325379B2 (de) * 1974-10-21 1978-07-26
JPS5240859A (en) * 1975-09-27 1977-03-30 Mitsubishi Electric Corp Heat discharging body
US4047198A (en) * 1976-04-19 1977-09-06 Hughes Aircraft Company Transistor cooling by heat pipes having a wick of dielectric powder

Also Published As

Publication number Publication date
JPS5487959A (en) 1979-07-12
EP0002996A1 (de) 1979-07-11
EP0002996B1 (de) 1982-09-29

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee