DE2712521C2 - Verfahren zum Aufkitten von Scheiben - Google Patents
Verfahren zum Aufkitten von ScheibenInfo
- Publication number
- DE2712521C2 DE2712521C2 DE2712521A DE2712521A DE2712521C2 DE 2712521 C2 DE2712521 C2 DE 2712521C2 DE 2712521 A DE2712521 A DE 2712521A DE 2712521 A DE2712521 A DE 2712521A DE 2712521 C2 DE2712521 C2 DE 2712521C2
- Authority
- DE
- Germany
- Prior art keywords
- panes
- carrier plate
- membrane
- hood
- cementing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 12
- 239000012528 membrane Substances 0.000 claims description 26
- 239000004568 cement Substances 0.000 claims description 22
- 239000000126 substance Substances 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 11
- 238000005498 polishing Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2712521A DE2712521C2 (de) | 1977-03-22 | 1977-03-22 | Verfahren zum Aufkitten von Scheiben |
| GB4251/78A GB1554694A (en) | 1977-03-22 | 1978-02-02 | Cementing discs or the like to carrier plates |
| NL7801348A NL7801348A (nl) | 1977-03-22 | 1978-02-06 | Werkwijze voor het opbrengen door kitten van tot schijven verwerkte materialen. |
| IT48497/78A IT1102109B (it) | 1977-03-22 | 1978-03-20 | Procedimento ed apparecchiatura per attaccare con mastice lastre su un supporto in particolare per la levigatura |
| BE186160A BE865169A (fr) | 1977-03-22 | 1978-03-22 | Procede de collage au mastic de disques destines a etre polis |
| FR7808275A FR2384589A1 (fr) | 1977-03-22 | 1978-03-22 | Procede de collage au mastic de disques destines a etre polis |
| JP3283178A JPS53146572A (en) | 1977-03-22 | 1978-03-22 | Method of bonding disks |
| US06/073,415 US4283242A (en) | 1977-03-22 | 1979-09-07 | Process for cementing semiconductor discs onto a carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2712521A DE2712521C2 (de) | 1977-03-22 | 1977-03-22 | Verfahren zum Aufkitten von Scheiben |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2712521A1 DE2712521A1 (de) | 1978-09-28 |
| DE2712521C2 true DE2712521C2 (de) | 1987-03-05 |
Family
ID=6004323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2712521A Expired DE2712521C2 (de) | 1977-03-22 | 1977-03-22 | Verfahren zum Aufkitten von Scheiben |
Country Status (8)
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2809274A1 (de) * | 1978-03-03 | 1979-09-13 | Wacker Chemitronic | Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren |
| US4316757A (en) * | 1980-03-03 | 1982-02-23 | Monsanto Company | Method and apparatus for wax mounting of thin wafers for polishing |
| US4379018A (en) * | 1981-12-17 | 1983-04-05 | Planet Products Corporation | Heat transfer apparatus |
| US4530138A (en) * | 1982-09-30 | 1985-07-23 | Westinghouse Electric Corp. | Method of making a transducer assembly |
| US4466852A (en) * | 1983-10-27 | 1984-08-21 | At&T Technologies, Inc. | Method and apparatus for demounting wafers |
| JPS61159718A (ja) * | 1984-12-29 | 1986-07-19 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
| US4714511A (en) * | 1985-02-07 | 1987-12-22 | Fujitsu Limited | Method and apparatus for adhering a tape or sheet to a semiconductor wafer |
| GB8527708D0 (en) * | 1985-11-09 | 1985-12-11 | Old Acre Eng Co Ltd | Laminating press |
| US4934920A (en) * | 1987-06-17 | 1990-06-19 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for producing semiconductor device |
| JPH084105B2 (ja) * | 1987-06-19 | 1996-01-17 | 株式会社エンヤシステム | ウェハ接着方法 |
| US5217563A (en) * | 1988-12-01 | 1993-06-08 | Bayer Aktiengesellschaft | Apparatus for producing a deep-drawn formed plastic piece |
| JP2648638B2 (ja) * | 1990-11-30 | 1997-09-03 | 三菱マテリアル株式会社 | ウェーハの接着方法およびその装置 |
| US5236646A (en) * | 1991-02-28 | 1993-08-17 | The United States Of America As Represented By The Secretary Of The Navy | Process for preparing thermoplastic composites |
| US5116216A (en) * | 1991-02-28 | 1992-05-26 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus for preparing thermoplastic composites |
| JP2678161B2 (ja) * | 1991-10-30 | 1997-11-17 | 九州電子金属 株式会社 | 半導体ウエーハの真空貼着装置 |
| JPH0737768A (ja) * | 1992-11-26 | 1995-02-07 | Sumitomo Electric Ind Ltd | 半導体ウェハの補強方法及び補強された半導体ウェハ |
| US5300175A (en) * | 1993-01-04 | 1994-04-05 | Motorola, Inc. | Method for mounting a wafer to a submount |
| US5460773A (en) * | 1993-08-11 | 1995-10-24 | Fritz; Michael L. | Seal for blow down platen |
| US6017484A (en) * | 1997-01-21 | 2000-01-25 | Harold P. Hale | Method for manufacture of minimum porosity, wrinkle free composite parts |
| US6425812B1 (en) | 1997-04-08 | 2002-07-30 | Lam Research Corporation | Polishing head for chemical mechanical polishing using linear planarization technology |
| US6244946B1 (en) | 1997-04-08 | 2001-06-12 | Lam Research Corporation | Polishing head with removable subcarrier |
| US6336845B1 (en) | 1997-11-12 | 2002-01-08 | Lam Research Corporation | Method and apparatus for polishing semiconductor wafers |
| DE19756614A1 (de) * | 1997-12-18 | 1999-07-01 | Wacker Siltronic Halbleitermat | Verfahren zur Montage und Demontage einer Halbleiterscheibe, und Stoffmischung, die zur Durchführung des Verfahrens geeignet ist |
| JP3537688B2 (ja) * | 1998-11-24 | 2004-06-14 | 富士通株式会社 | 磁気ヘッドの加工方法 |
| US6431959B1 (en) | 1999-12-20 | 2002-08-13 | Lam Research Corporation | System and method of defect optimization for chemical mechanical planarization of polysilicon |
| US6666756B1 (en) | 2000-03-31 | 2003-12-23 | Lam Research Corporation | Wafer carrier head assembly |
| DE10048881A1 (de) * | 2000-09-29 | 2002-03-07 | Infineon Technologies Ag | Vorrichtung und Verfahren zum planen Verbinden zweier Wafer für ein Dünnschleifen und ein Trennen eines Produkt-Wafers |
| DE10054159A1 (de) * | 2000-11-02 | 2002-05-16 | Wacker Siltronic Halbleitermat | Verfahren zur Montage von Halbleiterscheiben |
| US7239902B2 (en) * | 2001-03-16 | 2007-07-03 | Nellor Puritan Bennett Incorporated | Device and method for monitoring body fluid and electrolyte disorders |
| DE102005006052A1 (de) * | 2004-12-21 | 2006-07-06 | Osram Opto Semiconductors Gmbh | Linse, Laseranordnung und Verfahren zur Herstellung einer Laseranordnung |
| JP5895676B2 (ja) * | 2012-04-09 | 2016-03-30 | 三菱電機株式会社 | 半導体装置の製造方法 |
| CN111038167B (zh) * | 2015-09-18 | 2022-03-29 | 本田技研工业株式会社 | 粘贴装置和粘贴方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB316134A (US20030199744A1-20031023-C00003.png) * | 1928-07-23 | 1930-10-06 | Paul Pick | |
| US3041800A (en) * | 1960-05-04 | 1962-07-03 | Roy O Heisel | Apparatus for shaping crystals |
| US3322598A (en) * | 1963-10-02 | 1967-05-30 | Alvin M Marks | Laminator for securing continuous flexible film to a base |
| US3405019A (en) * | 1965-07-30 | 1968-10-08 | Mc Donnell Douglas Corp | Vacuum bonding process |
| DE1577469A1 (de) * | 1966-05-24 | 1970-05-06 | Siemens Ag | Verfahren zum Herstellen von Halbleiterscheiben gleichmaessiger Dicke durch mechanische Oberflaechenbearbeitung |
| US3453783A (en) * | 1966-06-30 | 1969-07-08 | Texas Instruments Inc | Apparatus for holding silicon slices |
| US3453166A (en) * | 1966-10-11 | 1969-07-01 | Bell Telephone Labor Inc | Method and apparatus for bonding transducer elements |
| US3493451A (en) * | 1966-11-02 | 1970-02-03 | Boeing Co | Vacuum press and method of laminating therewith |
| US3475867A (en) * | 1966-12-20 | 1969-11-04 | Monsanto Co | Processing of semiconductor wafers |
| DE1652170B2 (de) * | 1967-03-03 | 1975-05-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum gleichzeitigen stirnseitigen Abarbeiten gleichdicker Werkstoffschichten an mehreren unterschiedlich dicken Halbleiterscheiben |
| US3492763A (en) * | 1967-09-18 | 1970-02-03 | Monsanto Co | Method and apparatus for mounting semiconductor slices |
| US3597081A (en) * | 1967-11-02 | 1971-08-03 | Continental Device Corp | Vacuum masking system and method |
| US3554834A (en) * | 1968-07-24 | 1971-01-12 | Corning Glass Works | Decal applying |
| US3681171A (en) * | 1968-08-23 | 1972-08-01 | Hitachi Ltd | Apparatus for producing a multilayer printed circuit plate assembly |
| JPS495570A (US20030199744A1-20031023-C00003.png) * | 1972-05-02 | 1974-01-18 | ||
| JPS4937278A (US20030199744A1-20031023-C00003.png) * | 1972-08-14 | 1974-04-06 | ||
| US3888053A (en) * | 1973-05-29 | 1975-06-10 | Rca Corp | Method of shaping semiconductor workpiece |
| US4104099A (en) * | 1977-01-27 | 1978-08-01 | International Telephone And Telegraph Corporation | Method and apparatus for lapping or polishing materials |
-
1977
- 1977-03-22 DE DE2712521A patent/DE2712521C2/de not_active Expired
-
1978
- 1978-02-02 GB GB4251/78A patent/GB1554694A/en not_active Expired
- 1978-02-06 NL NL7801348A patent/NL7801348A/xx not_active Application Discontinuation
- 1978-03-20 IT IT48497/78A patent/IT1102109B/it active
- 1978-03-22 BE BE186160A patent/BE865169A/xx not_active IP Right Cessation
- 1978-03-22 FR FR7808275A patent/FR2384589A1/fr active Granted
- 1978-03-22 JP JP3283178A patent/JPS53146572A/ja active Pending
-
1979
- 1979-09-07 US US06/073,415 patent/US4283242A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| BE865169A (fr) | 1978-09-22 |
| IT1102109B (it) | 1985-10-07 |
| JPS53146572A (en) | 1978-12-20 |
| IT7848497A0 (it) | 1978-03-20 |
| FR2384589B1 (US20030199744A1-20031023-C00003.png) | 1980-08-29 |
| GB1554694A (en) | 1979-10-24 |
| NL7801348A (nl) | 1978-09-26 |
| US4283242A (en) | 1981-08-11 |
| DE2712521A1 (de) | 1978-09-28 |
| FR2384589A1 (fr) | 1978-10-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |