DE2710684A1 - Circuit bread-board construction using flexible plate - has components mounted and coupled by jamming wires into matrix of holes - Google Patents

Circuit bread-board construction using flexible plate - has components mounted and coupled by jamming wires into matrix of holes

Info

Publication number
DE2710684A1
DE2710684A1 DE19772710684 DE2710684A DE2710684A1 DE 2710684 A1 DE2710684 A1 DE 2710684A1 DE 19772710684 DE19772710684 DE 19772710684 DE 2710684 A DE2710684 A DE 2710684A DE 2710684 A1 DE2710684 A1 DE 2710684A1
Authority
DE
Germany
Prior art keywords
base plate
components
holes
wires
wire ends
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19772710684
Other languages
German (de)
Inventor
Peter Kammermeier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19772710684 priority Critical patent/DE2710684A1/en
Publication of DE2710684A1 publication Critical patent/DE2710684A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H05K7/08—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses on perforated boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A plate produced in a flexible synthetic plastics material is used to provide a simple and low cost method of 'bread-boarding' electric circuits. The plate has a matrix of holes of a diameter corresponding to the minimum wire size likely be encountered. A variety of components (6, 7, 8) may be mounted by pressing the wires into the holes. Interconnections are readily made by forcing two or more wires into the same hole. The flexibility of the plastics material enables wires of slightly greater diameter than the unstressed holes to be jammed in. The thickness of the plate is comparable with the size of the electronic components installed.

Description

Grundplatte zum lötlos en Aufbau elektrischer Base plate for solderless construction of electrical

und elektronischer Schaltungen Die Erfindung betrifft eine Grundplatte, auf der durch einfaches einstecken von elektrischen und elektronischen Bauteilen sowie Verbndungsleitungen, eine beliebige Schaltung, lötlos aufgebaut werden kann. Wobei die Grundplatte, mit in einem Raster angeordneten Ausnehmungen versehen ist. and electronic circuits The invention relates to a base plate, by simply plugging in electrical and electronic components as well as connecting lines, any circuit, can be set up without soldering. The base plate is provided with recesses arranged in a grid.

Die Grundplatte besteht aus einem elastischen, nicht elektrisch leitendem Material. Die Ausnehmungen sind somit dehnbar und erlauben das (eusetzen) einstecken von mehreren Drahtenden elektronischer Bauteile in eine Ausnehmung.The base plate consists of an elastic, non-electrically conductive one Material. The recesses are thus stretchable and allow you to plug in from several wire ends of electronic components into a recess.

Infolge des Gurnnieffektes des Materials, aus dem die Grundplatte besteht, werden die Drahtenden aneinander gepreßt und kontaktieren.As a result of the Gurnnieffektes of the material from which the base plate exists, the wire ends are pressed together and make contact.

Aufbau oder Universalplatten für elektronische Schaltungen sind in unterschiedlicher Ausführung, zu Spielzeug Lehr-, und Versuchszwecken bekannt und werden in großer Anzahl verwendet.Construction or universal plates for electronic circuits are in different designs, known for toys, teaching and experimental purposes are used in large numbers.

Ein wesentliches Merkmal all dieser Grundplatten, sind Kontaktteile aus leitendem Material, die dazu dienen, die in die Ausnehmungen (Buchsen) eingesteckten Drahtenden der Bauteile festzuhalten, zu verbunden, oder auch um Ausnehmungen untereinander zu verbinden.An essential feature of all these base plates are contact parts Made of conductive material, which are used to insert the recesses (sockets) To hold wire ends of the components to be connected, or to recesses among themselves connect to.

Diese Grundplatten sind in ihrem Aufbau technisch kompliziert und teuer.These base plates are technically complex and in their construction expensive.

Aufgabe der Erfindung ist daher eine Grundplatte zum lötlosen Aufbau elektronischer Schaltungen zu schaffen, die äusserst einfach in ihrer Ausgestaltung und damit preisgänstig herzustellen ist und mittels der auf einfache Weise und in kurzerZeit mit handelsüblichen Bauteilen jede beliebige Schaltung aufzubauen ist, ohne daß dazu besondere Kontaktteile, Federn, Verbindungen oder ähnliche Bauteile aus elektrisch leitendem oder einem anderen zusätzlich in die Grundplatte ein, an oder aufzubringendem Material notwendig sind.The object of the invention is therefore a base plate for a solderless construction to create electronic circuits that are extremely simple in their design and is thus inexpensive to manufacture and by means of the easy way and in any circuit can be set up in a short time with commercially available components, without the need for special contact parts, springs, connections or similar components from electrically conductive or another one in addition to the base plate or material to be applied are necessary.

Die Erfindung erreicht dies dadurch, daß in eine aus flexiblen oder gunwniartigem Material bestehende Platte, in einem Raster angeordnete Ausnehmungen eingearbeitet sind, die in ihrem Durchmesser so bemessen sind, daß 2 oder mehrere Drahtenden, auch unterschiedlicher Durc#s ser ,# von handelsüblichen Bauteilen, durch die Elastizität des Materials der Grundplatte, in einer Ausnehmung gesteckt werden können.The invention achieves this in that in one of flexible or Gunwni-like material plate, recesses arranged in a grid are incorporated, which are dimensioned in their diameter so that 2 or more Wire ends, also with different diameters, # from commercially available components, due to the elasticity of the material of the base plate, inserted in a recess can be.

Infolge des Guninieffektes werden diese Drahtenden aneinander gepreßt und kontaktieren..As a result of the Gunini effect, these wire ends are pressed against one another and contact ..

Auf diese Weise läßt sich Bauteil an Bauteil stecken und elektrisch verbinden, ohne daß zusätzliche Verbindungselemente nötig sind.In this way, component to component can be plugged in and electrically connect without the need for additional fasteners.

Durch einfaches ziehen der Bauteile und Verbindungsleitungen ~die Verbindungsleitungen werden benötigt wenn sich in der Schaltung größere Abstände zwischen den Bauteilen ergeben, läßt sich jede Schaltung rasch und problemlos verdndern, beziehungsweise kann die Grundplatte für neue Schaltungen wieder verwendet werden. - - Weitere Einzelheiten der gemäß der Erfindung ausgebildeten Grundplatte zum Iötlosen Aufbau elelctronischer Schaltungen, sind dem in der Zeichnung dargestellten Ausftirungsbeispiel, das nachfolgend im einzelnen erläutert wird, zu entnehmen. Hierbei zeigt Fig. 1 die Grundplatte in der Draufsicht (Vorderansicht) mit einigen aufgesteckten Bauteilen.By simply pulling the components and connecting lines ~ die Connection lines are required if there are larger distances in the circuit between the components, each circuit can be changed quickly and easily, or the base plate can be used again for new circuits. - - Further details of the base plate designed according to the invention for the construction of electronic circuits without soldering, are the ones shown in the drawing Ausftirungsbeispiel, which is explained in detail below, can be found. Here, Fig. 1 shows the base plate in plan view (front view) with some plugged-on components.

Fig. 2 einen Schnitt nach der Linie A-A der Fig. 1 Fig. 3 einen Sektor X, im Schnitt Fig. 2 Die in den Fig. 1 bis 3 im einzelnen dargestellten Grundplatte 1, aus elektr.Fig. 2 shows a section along the line A-A of Fig. 1 Fig. 3 shows a sector X, in section FIG. 2 The base plate shown in detail in FIGS. 1 to 3 1, from electr.

nichtleitendem elastischem Material, beispielsweise Gummi oder Polyurethan, zum lötlosen Aufbau elektronischer Schaltungen, ist mit in einem Raster 4, angeordneten Ausnehmungen 2, versehen, in die Beispielsweise die Bauteile 6,7,8, eingesteckt sind.non-conductive elastic material, for example rubber or polyurethane, for the solderless construction of electronic circuits, is arranged in a grid 4 Recesses 2, into which, for example, the components 6,7,8 are inserted are.

Die Ausnehlngen2, sind im Durchmesser 5, so gehalten, daß zwei oder mehrere Drahtenden 3, von Bauteilen 6,7,8, auch unterschiedlicher Durchmesser 9,10, einzustecken sind und infolge der Elastizität der Grundplatte 1, kontaktierend aneinander gepreßt werden.The Ausnehlngen2, are in diameter 5, so held that two or several wire ends 3, of components 6,7,8, also different diameters 9,10, are to be inserted and due to the elasticity of the base plate 1, contacting each other be pressed.

Die Dicke 11, der Grundplatte 1, ist so gehalten, daß die Drahtenden 3, der Bauteile 6,7,8, ausreichend ltntaktflächen erhalten.The thickness 11, the base plate 1, is held so that the wire ends 3, of the components 6, 7, 8, sufficient contact areas have been preserved.

L e e r s e i t eL e r s e i t e

Claims (5)

Patentanspru~che ldplatte zum lötlosen Aufbau elektrischer/elektronischer Schaltungen insbesondere für Spielzeug, Lehr- und Versuchszwecken. Patent claim disk for the solderless construction of electrical / electronic Circuits, in particular for toys, teaching and experimental purposes. Wobei die Grundplatte 1, mit in einem Raster 4, angeordnete Ausnehmungen 2 aufweist, in die handelsübliche elektrische/elektronische Bauteile 6,7,8 mit ihren Drahtenden 3 eingesetzt oder eingesteckt werden können und dabei eine leitende (elektr.) Verbindung erhalten, ohne daß Kontaktteile, Federn, Buchsen, Verbindungen oder ähnliche Bauteile auas elektrisch leitendem oder einem anderen zusätzlich in die Grundplatte 1 ein, auf oder anzubringendes Material,notwendig sind. Whereby the base plate 1, with recesses arranged in a grid 4 2, in the commercial electrical / electronic components 6,7,8 with their Wire ends 3 can be inserted or plugged in and a conductive (electr.) Connection obtained without contact parts, springs, sockets, connections or the like Components auas electrically conductive or another additional one in the base plate 1 a material to be affixed to or on are necessary. 2 Grundplatte nach Anspruch 1 dadurch gekennzeichnet, daß die Grundplatte 1 aus einem elastischen, nicht leitendem Material besteht, daß es erlaubt, in eine Ausnehmung 2,mehrere Drahtenden 3,von Bauteilen 6,7,8, auch unterschiedlicher Durchmesser 9,10, einzusetzen, oder einzustecken.2 base plate according to claim 1, characterized in that the base plate 1 consists of an elastic, non-conductive material that allows it to be in a Recess 2, several wire ends 3, of components 6,7,8, also of different diameters 9,10, to insert, or to pocket. 3 Grundplatte nach Anspruch 1-2, dadurch gekennzeichnet, daß die Ausnehmungen 2, in Durchmesser 5, so gehalten sind, daß 2 oder mehrere Drahtenden 3, von Bauteilen 6,7,8, auch unterschiedlicher Durchmesser 9,10, einzustecken sind und infolge der elastizität der Grundplatte 1, kontaktierend aneinander gepreßt werden.3 base plate according to claim 1-2, characterized in that the recesses 2, in diameter 5, are held so that 2 or more wire ends 3, of components 6,7,8, also different diameters 9,10, are to be inserted and as a result of the elasticity of the base plate 1, are pressed against one another in a contacting manner. 4 Grundplatte nach Anspruch 1-3, dadurch gekennzeichnet, daß die Ausnehmungen 2, in einem Raster 4, angeordnet sind, das es erlaubt alle handelsüblichen Bauteile ohne weitere Hilfsmittel zu stecken.4 base plate according to claims 1-3, characterized in that the recesses 2, are arranged in a grid 4, which allows all commercially available components without any further aids to be stuck. 5 Grundplatte nach Anspruch 1-4, dadurch gekennzeichnet, daß die Dicke 11, der Grundplatte 1, so gehalten ist, daß die Drahtenden 3, der Bauteile 6,7,8, ausreichend Kontaktfläche erhalten.5 base plate according to claim 1-4, characterized in that the thickness 11, the base plate 1, is held so that the wire ends 3, the components 6,7,8, get sufficient contact surface.
DE19772710684 1977-03-11 1977-03-11 Circuit bread-board construction using flexible plate - has components mounted and coupled by jamming wires into matrix of holes Withdrawn DE2710684A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772710684 DE2710684A1 (en) 1977-03-11 1977-03-11 Circuit bread-board construction using flexible plate - has components mounted and coupled by jamming wires into matrix of holes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772710684 DE2710684A1 (en) 1977-03-11 1977-03-11 Circuit bread-board construction using flexible plate - has components mounted and coupled by jamming wires into matrix of holes

Publications (1)

Publication Number Publication Date
DE2710684A1 true DE2710684A1 (en) 1978-09-14

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ID=6003394

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DE19772710684 Withdrawn DE2710684A1 (en) 1977-03-11 1977-03-11 Circuit bread-board construction using flexible plate - has components mounted and coupled by jamming wires into matrix of holes

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DE (1) DE2710684A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0236830A2 (en) * 1986-03-07 1987-09-16 Circuitgraph, S.L. Base plate for electrical current circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0236830A2 (en) * 1986-03-07 1987-09-16 Circuitgraph, S.L. Base plate for electrical current circuits
EP0236830A3 (en) * 1986-03-07 1988-09-14 Circuitgraph, S.L. Base plate for electrical current circuits

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