DE2635934A1 - METHOD OF TREATMENT PINS FOR PLUGS TO BE INSERTED INTO PRINTED CIRCUITS - Google Patents

METHOD OF TREATMENT PINS FOR PLUGS TO BE INSERTED INTO PRINTED CIRCUITS

Info

Publication number
DE2635934A1
DE2635934A1 DE19762635934 DE2635934A DE2635934A1 DE 2635934 A1 DE2635934 A1 DE 2635934A1 DE 19762635934 DE19762635934 DE 19762635934 DE 2635934 A DE2635934 A DE 2635934A DE 2635934 A1 DE2635934 A1 DE 2635934A1
Authority
DE
Germany
Prior art keywords
contact
bath
contact pin
soldering
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19762635934
Other languages
German (de)
Inventor
Maurice Villain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METALLO STE FSE
Francaise Metallo Ste SA
Original Assignee
METALLO STE FSE
Francaise Metallo Ste SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METALLO STE FSE, Francaise Metallo Ste SA filed Critical METALLO STE FSE
Publication of DE2635934A1 publication Critical patent/DE2635934A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Description

PATENTANWÄLTEPATENT LAWYERS

DIETRICH LEWINSKY HEINZ-JOACHIM HUBER REINER PRIETSCH MÜNCHEN 21 GOTTHARDSTR. 8t DIETRICH LEWINSKY HEINZ-JOACHIM HUBER REINER PRIETSCH MUNICH 21 GOTTHARDSTR. 8t

10. August 1976August 10, 1976

9055-IV/Hg Societe Franeaise hETALLO, Rue de Rennes 149, Paris (Prankreich)9055-IV / Hg Societe Franeaise hETALLO, Rue de Rennes 149, Paris (France)

Verfahren zur Behandlung der Kontaktstifte von in gedruckte Schaltungen einzulötenden SteckernProcess for the treatment of the contact pins of connectors to be soldered into printed circuits

Priorität vom 11. August 1975Priority of August 11, 1975

aus der französischen Gebrauchsmusteranmeldungfrom the French utility model application

75 2491675 24916

Die Erfindung betrifft ein Verfahren zur Behandlung der Kontaktstifte eines durch Badlötung auf einer gedruckten Schaltung zu befestigenden Steckerteiles. Solche Steckerteile, häufig auch als Miniaturstecker bezeichnet, sind beispielsweise in der Fernsehgerät et echnik recht häufig. Die Kontaktstifte sind auf der gedruckten Schaltung gewöhnlich durch Bad- oder Tauchlöten befestigt . Damit jedoch beim Einführen eines Kontaktstiftes in die zugehörige Buchse diese letztere sich nicht über ihre Elastizitätsgrenze hinaus verformt, ist es unerläßlich, daß das Lötmetall nicht auf dem oder den Teilen des Kontaktstiftes haften bleibt, die zur Herstellung des elektrischen Kontaktes mit diesen Buchsen bestimmt sind.The invention relates to a method for treating the contact pins a plug part to be attached to a printed circuit by bath soldering. Such connector parts, too, often referred to as miniature plugs, are for example in the television set et echnik quite often. The contact pins are usually attached to the printed circuit board by dip or dip soldering . However, when inserting a contact pin into the associated bushing this latter does not exceed its elastic limit deformed in addition, it is essential that the solder does not adhere to the part or parts of the contact pin remains necessary for making electrical contact with them Sockets are intended.

Der Erfindung liegt die Aufgabe zugrunde, ein einfaches und oekonomisches Verfahren zur Behandlung solcher Kontaktstifte zu schaffen, das es erlaubt, die Kontaktstifte durch Bad- oder Tauchlöten auf einer gedruckten Schaltung zu befestigen, ohneThe invention is based on the object of a simple and economical To create a method for the treatment of such contact pins that allows the contact pins by bath or Dip soldering to attach to a printed circuit without

709807/0801709807/0801

ORIGINAL !Μ8ΡΕ€Τ£ί> ORIGINAL ! Μ8ΡΕ € Τ £ ί>

daß dabei die Dicke des zur Kontaktgabe dienenden Teiles des Kontaktstiftes zunimmt oder sich dort ein Überschuß an Lötmetall ansammelt.that in the process the thickness of the part of the contact pin used for making contact increases or there is an excess of solder accumulates.

Hierzu wählt man für die Herstellung der Kontaktstifte ein Metall, das sich ohne Schutzüberzug rasch oxydiert und demzufolge das Anhaften des Lötmetalls nicht zuläßt. Aluminium oder seine Legierungen können mit Vorteil verwendet werden.For this purpose, a metal is selected for the manufacture of the contact pins, which oxidizes quickly without a protective coating and consequently does not allow the solder to adhere. Aluminum or his Alloys can be used to advantage.

Gemäß der Erfindung besteht das Verfahren darin, daß die gesamte Oberfläche jedes Kontaktstiftes mit einem elektrolytisch aufgebrachten überzug aus einem Metall wie etwa Zinn versehen wird, und daß dann in einem ehemischen Beizbad diejenigen Oberflächenteile jedes Kontaktstiffees, die später den Kontakt mit den entsprechenden Buchsen herstellen sollen3 abgebeizt werden, so daß nach dem Einsetzen des Steckerteiles in die Karte mit der gedruckten Schaltung beim Bad- oder Tauch-löten das Anhaften des Lötmetalls an diesen Oberflächenteilen vermieden wird.According to the invention, the method consists in that the entire surface of each contact pin is provided with an electrolytically applied coating of a metal such as tin, and that then in a former pickling bath those surface parts of each contact pin which are later to make contact with the corresponding sockets 3 are stripped off, so that after the insertion of the plug part into the card with the printed circuit during bath or dip soldering, the adherence of the solder to these surface parts is avoided.

Auf diese Weise wird erreicht, daß das Lötmetall nur an dem vorverzinnten Teil haften bleibt, daß also die Verformung oder Zerstörung der Buchsenteile durch eine Zunahme der Dicke des Kontaktstiftes in seinem kontaktgebenden Teil durch Anhaften des Lötmetalls vermieden wird.In this way it is achieved that the solder only to the pre-tinned Part remains, so that the deformation or destruction of the socket parts by an increase in the thickness of the contact pin is avoided in its contact-making part by adherence of the solder.

Dieses Verfahren muß zwangsläufig dann angewendet werden, wenn der elektrische Kontakt auf der Seite der gedruckten Schaltungskarte hergestellt werden soll, die der Bad- oder Tauchlötung unterzogen wird. Das Verfahren kann auch in dem Fall angewendet werden, wo der elektrische Kontakt auf der der Schwall- oder Tauchlötung nicht unterzogenen Seite der Schaltungskarte vorgesehen ist, da die Dickenzunahme durch den elektrolytisch aufgebrachten überzug nicht so groß ist, daß die Buchse verformt werden könnte. Wenn dies jedoch zweckmäßig erscheint, kann man auch beide Enden des Kontaktstiftes abbeizen.This procedure must necessarily be used when the electrical contact is to be made on the side of the printed circuit board that is to be used for bath or dip soldering is subjected. The method can also be used in the case where the electrical contact is on that of the surge or Dip soldering is not provided on the side of the circuit board which is not subjected to the increase in thickness due to the electrolytically applied coating is not so large that the socket could be deformed. However, if this seems appropriate, you can too Pickle off both ends of the contact pin.

- 3 709807/0881 - 3 709807/0881

Das Verfahren wird nachfolgend anhand der Zeichnung erläutert, in der die verschiedenen Behandlungsstufen veranschaulicht sind.The method is explained below with reference to the drawing, in which the various stages of treatment are illustrated.

Figur 1 zeigt einen fertig- bearbeiteten Kontaktstift 1.FIG. 1 shows a completely machined contact pin 1.

Figur 2 zeigt denselben Kontaktstift nach dem Aufbringen eines elektrolytischen Überzugs 2.Figure 2 shows the same contact pin after applying one electrolytic plating 2.

Figur 3 zeigt eine Anzahl von Kontaktstiften 2, die über eineFigure 3 shows a number of contact pins 2, which have a

Isolierstoffplatte 3> in die sie in bekannter Weise eingepreßt sind, verbunden sind.Isolierstoffplatte 3> in which they in a known manner are pressed in, are connected.

Figur 1J zeigt eine Seitenansicht der Anordnung nach Figur 3·FIG. 1 J shows a side view of the arrangement according to FIG.

Figur 5 zeigt entsprechend der Figur 4 den Kontaktstift 2 nach dem Abbeizen des Teiles a, so daß nur noch die Teile b und c mit dem elektrolytischen Niederschlag überzogen sind.FIG. 5 shows the contact pin 2 according to FIG the pickling of part a, so that only parts b and c with the electrolytic precipitate are coated.

In Figur 6 ist der Kontaktstift 2 nach seinem Einsetzen in eine gedruckte Schaltung 4 wiedergegeben. Die Leiterbahnen sind mit 5 bezeichnet, die Lötstellen zur Befestigung des Kontaktstiftes auf der gedruckten Schaltung sind mit 6 bezeichnet. Beim Durchgang durch das Bad haftet das Lötmetall nur auf dem Teil b, nicht aber auf dem Teil a.In FIG. 6, the contact pin 2 is shown after it has been inserted into a printed circuit 4. The conductor tracks are denoted by 5, the soldering points for fastening the contact pin on the printed circuit are denoted by 6. When passing through the bath, the solder adheres only to part b, but not to part a.

Sofern für zweckmäßig erachtet, kann natürlich auch der Teil c in der gleichen Weise abgebeizt werden wie der Teil a, so wie dies in Figur 6 dargestellt ist.If deemed appropriate, part c can of course also be stripped in the same way as part a, as well as this is shown in FIG.

Das beschriebene Behandlungsverfahren läßt sich in industriellem Maßstab in einfacher Weise und zu äußerst geringen Kosten durchführen. The treatment process described can be carried out on an industrial scale in a simple manner and at extremely low cost.

Die Kontaktstifte werden nach dem in bekannter Weise durchgeführten elektrolytischen Verzinnen in eine Isolierstoffplatte derart eingepreßt, daß sie ein Steckerteil mit einer nahezu beliebigenThe contact pins are carried out in a known manner electrolytic tin-plating pressed into an insulating plate in such a way that it is a plug part with almost any

709807/0861 " k ' 709807/0861 ' k '

-H--H-

Zahl von Kontaktstiften bilden. Nach ihrer Montage auf der Trägerplatte werden die Kontaktstifte dann auf einer Transportvorrichtung angeordnet } um in einem chemischen Bad auf die gewünschte Höhe abgebeizt zu werden. Soweit notwendig, kann dieselbe Beizbehandlung sowohl am einen wie am anderen Ende der Kontaktstifte durchgeführt werden.Form number of contact pins. After its mounting on the carrier plate the contact pins are then placed on a transport device} to be pickled in a chemical bath to the desired height. If necessary, the same pickling treatment can be carried out on one end of the contact pin as well as on the other.

709807/0861709807/0861

Claims (1)

PATENTANWÄLTEPATENT LAWYERS DIETRICH LEWINSKY H£SNZ-3OACHIM HUBER
REiNER PRSETSCH MÜNCHEN 21 GOTTHARDSTR. 81 DIETRICH LEWINSKY H £ SNZ-3OACHIM HUBER
REiNER PRSETSCH MUNICH 21 GOTTHARDSTR. 81 Dociete Frangaise MSTALLO 10. August 1976Dociete Fr angaise MSTALLO August 10, 1976 ■■ |055-IV/Ilg■■ | 055-IV / Ilg Patentanspruch:Claim: Verfahren zur Behandlung der Kontaktstifte eines durch Badlötung auf einer gedruckten Schaltung zu befestigenden Steckerteiles, dadurch gekennzeichnet, daß die gesamte Oberfläche jedes Kontaktstiftes mit ein ei;: elektrolytisch aufgebrachten überzug aus einem !■'!etall wie etwa Zinn versehen wird, und daß dann in einem chemischen Beizbad diejenisen Oberflächenteile jedes Kontaktstiftes, ciie später den Eontakt rrdt den entsprechenden Buchsen herstellen sollen, abgebeizt werden, so daß nach dem Einsetzen des Steckerteiles in die Karte mit der gedruckten Schaltung beim Bad- oder Tauchlöten das Anhaften des Lötmetalls an diesen Oberflächenteilen vermieden wird.A method for treating the contact pins of a plug part to be attached to a printed circuit by bath soldering, characterized in that the entire surface of each contact pin is provided with an electrolytically applied coating of a metal such as tin, and then in In a chemical pickling bath, the surface parts of each contact pin, which are later to establish the contact with the corresponding sockets, are stripped off, so that after the plug part has been inserted into the card with the printed circuit during bath or dip soldering, the soldering metal is prevented from sticking to these surface parts . 709 807/0861709 807/0861
DE19762635934 1975-08-11 1976-08-10 METHOD OF TREATMENT PINS FOR PLUGS TO BE INSERTED INTO PRINTED CIRCUITS Pending DE2635934A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7524916A FR2321233A7 (en) 1975-08-11 1975-08-11 Soldering system which prevents excess solder at contact - is used in solder bath dipping processes and involves use of tinned and etched aluminium pins

Publications (1)

Publication Number Publication Date
DE2635934A1 true DE2635934A1 (en) 1977-02-17

Family

ID=9158963

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762635934 Pending DE2635934A1 (en) 1975-08-11 1976-08-10 METHOD OF TREATMENT PINS FOR PLUGS TO BE INSERTED INTO PRINTED CIRCUITS

Country Status (2)

Country Link
DE (1) DE2635934A1 (en)
FR (1) FR2321233A7 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2519201A1 (en) * 1981-12-28 1983-07-01 Labinal PROCESS FOR THE TREATMENT OF SURFACES OF ELECTRICALLY CONNECTED ORGANS
DE102017212964A1 (en) * 2017-07-27 2019-01-31 Osram Gmbh LIGHTING DEVICE AND HEADLIGHTS

Also Published As

Publication number Publication date
FR2321233A7 (en) 1977-03-11

Similar Documents

Publication Publication Date Title
EP0004899B1 (en) Process for forming electrically conducting and oscillation-free connections between printed circuits on the back surfaces of circuit plates and spring contacts of strips with spring contacts, as well as a suitable strip with spring contacts
DE1615691A1 (en) Multiple connector and process for its manufacture
DE1933229A1 (en) Connector for a flat conductor ribbon
DE3436119C2 (en) Contact spring element for contacting printed circuit boards
EP0211357B1 (en) Process for installing a contact device on a circuit board.
DE2855838A1 (en) CARRIER STRIP FOR ROUND CONNECTOR PINS AND METHOD FOR MANUFACTURING CARRIER STRIPS
DE60128537T2 (en) ASSEMBLY TO CONNECT AT LEAST TWO PRINTED CIRCUITS
DE2444699A1 (en) CONNECTING PART FOR A SMALL UNIT DESIGNED IN THICK FILM TECHNOLOGY
DE2543421A1 (en) CIRCUIT BOARD PIN
DE2937883C2 (en) Terminal pin for solderless connection techniques
DE2348630B2 (en) Device for protecting MOS components against damage caused by electrostatic charges
EP0966061B1 (en) Method for the electrical and mechanical connection of electrically conductive parts and device for carrying out this method
DE2635934A1 (en) METHOD OF TREATMENT PINS FOR PLUGS TO BE INSERTED INTO PRINTED CIRCUITS
DE3444667C2 (en) Contact bridge for printed circuit boards arranged on the same level in electrical and electronic devices and systems
DE1916554A1 (en) Semiconductor device and method for its manufacture
DE2448296A1 (en) Leads for electronic components fitting on circuit board - consist of a tinned wire or metal strip with solder bead exceed hole internal diameter
EP0030024A2 (en) Method of applying and securing current-supply wires to electrical components
DE2713972C3 (en) Electrical component with stops to limit the depth of insertion of its connecting wires
EP0768815A1 (en) Process for manufacturing electrical circuits having a circuit board
DE1068326B (en)
DE3231165C2 (en) One-piece clamping element for soldering, screwing and stripping-free connection of electrical conductors
DE2432132A1 (en) Plug connector spring contact assembly - uses contact springs holding metal web with metal strip for each contact spreading
DE1187282B (en) Circuit board with laminated conductor tracks and circuit components connected in an electrically conductive manner using the dip soldering process
DE2652951A1 (en) Circuit component mounting and contact - uses small circuit board to support component with contact pads soldered to main circuit board conductors
DE3406184A1 (en) Connector for insulated electrical leads

Legal Events

Date Code Title Description
OHJ Non-payment of the annual fee