DE2652951A1 - Circuit component mounting and contact - uses small circuit board to support component with contact pads soldered to main circuit board conductors - Google Patents

Circuit component mounting and contact - uses small circuit board to support component with contact pads soldered to main circuit board conductors

Info

Publication number
DE2652951A1
DE2652951A1 DE19762652951 DE2652951A DE2652951A1 DE 2652951 A1 DE2652951 A1 DE 2652951A1 DE 19762652951 DE19762652951 DE 19762652951 DE 2652951 A DE2652951 A DE 2652951A DE 2652951 A1 DE2652951 A1 DE 2652951A1
Authority
DE
Germany
Prior art keywords
circuit board
connection points
circuit arrangement
contact
conductor track
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762652951
Other languages
German (de)
Inventor
Heinz Pudelko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mannesmann VDO AG
Original Assignee
Mannesmann VDO AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mannesmann VDO AG filed Critical Mannesmann VDO AG
Priority to DE19762652951 priority Critical patent/DE2652951A1/en
Priority to JP13980677A priority patent/JPS5365974A/en
Publication of DE2652951A1 publication Critical patent/DE2652951A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The mounting and contacting assembly, for mounting components onto a flexible circuit board, consists of small support boards (1) for each component (2).. The component is connected electrically to contact pads (4) and mechanically to the small board. The small board's contact pads solder onto the conducting paths of the much larger circuit board (7).

Description

Schaltunosanordnung mit einer Leiterplatte Circuit arrangement with a printed circuit board

und darauf anceordneten Bauelementen Die Erfindung bezieht sich auf eine Schaltungsanordnung mit einer Leiterbahnen tragenden, insbesondere flexiblen Leiterplatte und darauf angeordneten, mit den Leiterbahnen elektrisch verbundenen diskreten Bauelementen, wie Widerstände, Kondensatoren oder andere Zwei- oder ehrpole. and components arranged thereon. The invention relates to a circuit arrangement with a conductor carrying, in particular flexible Printed circuit board and arranged thereon, electrically connected to the conductor tracks discrete components such as resistors, capacitors or other two or more poles.

Bei bekannten Schaltungsanordnungen dieser Gattung werden die mit Anschlußdrähten versehenen Widerstände, Kondensatoren und andere Zwei- oder t4ehrpole-an die flexible Leiterplatte gekrampt..Eine-derartige elektrische Verbindung und Festlegung der Zwei- und Mehrpole besitzt zwar eine hohe Sicherheit gegen ein unbeabsichtigtes Lösen, ist jedoch recht aufwendig und teuer. Zudem werden besondere Krampwerkzeuge benötigt. Ein Anlöten der Anschlußdrshte mit dem Lötkolhen oder in einem Tauchbad verbietet sich andererseits wegen der großen Temperaturempfindlichkeit der flexiblen Leiterplatte.In known circuit arrangements of this type with Connecting wires provided with resistors, capacitors and other two or more pole-an Krampt the flexible circuit board. Such an electrical connection and fixing the two-pole and multi-pole has a high level of security against unintentional Solving, however, is quite complex and expensive. There are also special cramping tools needed. Soldering the connection wires with a soldering iron or in an immersion bath on the other hand, because of the high temperature sensitivity, the flexible ones are not recommended Circuit board.

Aufgabe der Erfindung ist es, die elektrische Verbindung und Festlegung der Bauelemente mit bzw. auf der Leiterplatte zu vereinfachen und zu verbessern.The object of the invention is the electrical connection and fixing to simplify and improve the components with or on the circuit board.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß jedes Bauelement aus einem flächigen Trägerkörper besteht, auf dem zwischen zwei flächigen Anschlußstellen der elektrische Zwei-oder Mehrpol angeordnet ist, und der Trägerkörper mit seinen Anschlußstellen auf den Leiterbahnenden aufliegt und mit diesan elektrisch verbunden ist.This object is achieved according to the invention in that each component consists of a flat support body on which between two flat connection points the electric two-or Multipole is arranged, and the carrier body rests with its connection points on the conductor track ends and with diesan electrically connected is.

Durch den Übergang von im allgemeinen zylindrischen Bauelementen mit Anschlußdrähten zu einem flächigen Anschlußkörper mit flächigen Anschlußstellen ergibt sich die Möglichkeit einer Krampenfreien Festlegung und elektrischen Verbindung mit der Leiterplatte. Gemaß einer Ausführungsform der Erfindung wird zur elektrischen Verbindung der Anschlußstellen jedes Trägerkürpers mit den Leiterbahnenden ein leitfähiger Kleber vorgesehen. Gemäß einer anderen Ausführungsform sind die AnschluS-stellen jedes Trägerkörpers mit einer Verzinnung versehen und mit den Leiterbahnenden verlötet. An und ür sich scheidet, wie oben erwähnt, ein Verlöten der Zwei- oder ltehrpole mit der Leiterplatte wegen deren Temperaturempfindlichkeit aus; durch die flchige Ausbildung der Anschluß stellen tritt jedoch eine wesentlich bessere Wärmeverteilung an der Verbindungsstelle auf, so daß ein Lötvorgang üher eine indirekte Erwärmung - Erwärmung der Trägerkörperrückseite beispielsweise mit einem Stempel -durchgeführt werden kann. Es hat sich gezeigt, daß unabhängig davon, ob die Anschlußstellen auf dem Trägerkörper mit den Leiterbahnenden verlötet oder verklebt sind, die Verbindung hinsichtlich ihrer Sicherheit gegen ein unbeabsichtigtes Lösen den bekennten Krampverbindungen gleichwertig ist.Through the transition from generally cylindrical components with Connecting wires to a flat connection body with flat connection points there is the possibility of a staple-free fixing and electrical connection with the circuit board. According to one embodiment of the invention, the electrical Connection of the connection points of each support body with the conductor track ends is a conductive one Glue provided. According to another embodiment, the connection points are each support body provided with a tin coating and soldered to the conductor track ends. In and of itself, as mentioned above, soldering the two-pole or two-pole soldering is different with the circuit board because of its temperature sensitivity; through the flat However, the formation of the connection results in a much better heat distribution at the connection point, so that a soldering process is indirect heating - The back of the carrier body is heated, for example with a stamp can be. It has been shown that regardless of whether the connection points are on the carrier body are soldered or glued to the conductor track ends, the connection in terms of their security against unintentional loosening the confessed Krampverbindungen is equivalent.

Als zweckmäßig hat es sich erwiesen, zwischen den Leiterbahnenden das Leiterplattenmaterial zu entfernen. Auf diese Leise wird die Flexibilität der flexiblen Leiterplatte an der Stelle des aufgebrachten Trägerkörpers verbessert. Eine weitere Erhöhung der Flexibilität kann dadurch erreicht werden, daß auch seitlich der Leiterbahnenden das Leiterplattenmaterial entfernt wird.It has proven to be useful between the conductor track ends remove the circuit board material. In this way the flexibility of the flexible printed circuit board at the point of the applied carrier body improved. Another increase flexibility can be achieved by that the circuit board material is also removed from the side of the conductor track ends.

Die Erfindung sei anhand der Zeichnung, die in zum Teil schematischer Darstellung ein Ausführungsbeispiel enthâlt, , näher erlautet. Es zeigen Figur 1 eine Aufsicht auf ein Bauelement mit einer Widerstandsbahn Figur 2 einen Querschnitt durch das Bauelement gemäß Figur 1 entlang der Linie II-II Figur 3 eine Aufsicht auf einen Teil einer Leiterplatte mit darauf angeordnetem Bauelement und Figur 4 einen Querschnitt durch die achaltungsanordnung gemäB Figur 3 entlang-der Linie IV-IV.The invention is based on the drawing, which is in part schematic Representation of an embodiment contains,, explained in more detail. It shows Figure 1 a plan view of a component with a resistance track; FIG. 2 shows a cross section through the component according to Figure 1 along the line II-II Figure 3 is a plan view on a part of a printed circuit board with a component arranged thereon and FIG. 4 a cross section through the circuit arrangement according to FIG. 3 along the line IV-IV.

Wie aus den Figuren 1 und 2 ersichtlich ist, besteht das Bauelement aus einem flächigen Trägerkörper 1 aus Keramik, auf den eine Widerstandsbahn 2 sowie zwei Anschlußstellen 3 und 4 aufgedruckt sind. Die Anschlußstellen bestehen aus einer Zinndruckpaste.As can be seen from Figures 1 and 2, the component consists from a flat carrier body 1 made of ceramic, on which a resistance track 2 and two connection points 3 and 4 are printed. The connection points consist of a tin printing paste.

Die Festlegung und elektrische Verbindung des Trägerkörpers 1 bzw. des auf ihm befindlichen Widerstandes 2 mit den Leiterbahnen 5 und 6 auf einer flexiblen Leiterplatte 7 erfolgt durch Anläten der Anschlußstellen 3 und 4 an die Enden der Leiterbahnen 5 und 6 durch eine indirekte Erw rmuns der beiden Anschlußstellen 3 und 4. Zu diesem Zweck wird an den Leiterbahnenden die Deckfolie 8 entfernt.The definition and electrical connection of the carrier body 1 or of the resistor 2 located on it with the conductor tracks 5 and 6 on a flexible Circuit board 7 takes place through Attachments to connection points 3 and 4 to the ends of the conductor tracks 5 and 6 by indirect heating of the two Connection points 3 and 4. For this purpose, the cover foil is attached to the conductor track ends 8 removed.

Zur Erzielung einer hohen Flexibilitüt an der Befestigungsstelle des Trägerkörpers 1 ist das Leiterplattenmaterial sowohl seitlich der Leiterbehnenenden als auch zwischen den Leiterhahnenden entfernt.To achieve a high degree of flexibility at the attachment point of the Carrier body 1 is the printed circuit board material both on the side of the Leiterbehnenenden as well as between the ends of the ladder tap.

Claims (6)

Fatentansprüche Schaltungsanordnung mit einer Leiterbahnen tragenden, insbesondere flexiblen LeitErplattE und darauf angeordneten, mit den Leiterbahnen elektrisch verhundenen diskreten Bauelementen, wie Widerstände, hondensatoren oder andere Zwei- oder Mehrpole, dadurch gekennzeichnet, daß jedes Gauelement aus einem flächigen Trägerk@rper (1) hesteht, auf dem zwischen zwei flächigen Anschlußstellen (3, 4) dar elektrische Zwei- oder Mehrpol (2) angeordnet ist, und der Trägerkörper (1) mit seinen Anschluastellen (3, 4) auf den Leiterbahnenden (5, 6) aufliegt und mit diesen elektrisch verwunden ist. Fatent claims circuit arrangement with a strip conductor carrying, in particular flexible conductor plate and arranged thereon with the conductor tracks electrically connected discrete components, such as resistors, capacitors or other two or more poles, characterized in that each Gauelement consists of one flat support body (1) is standing on which between two flat connection points (3, 4) the electrical two-pole or multi-pole (2) is arranged, and the carrier body (1) rests with its connection points (3, 4) on the conductor track ends (5, 6) and is electrically wound with these. 2. Schaltungsanordnuno nach Anspruch 1, dadurch gekennzeichnet, daß die Anschlußstellen (3, 4) jedes Trägarkërpers (1) mit einer Verzinnung versehen sind und mit den Leiterbahnenden verlötet sind.2. Circuit arrangement according to claim 1, characterized in that the connection points (3, 4) of each support body (1) are tinned are and are soldered to the conductor track ends. 3. Schaltungsanordnung nach Anspruch 2, dadurch gekennzeichnet, daß die Anschlußstellen (3, 4) mit einer Zinndruckpasta überzogen sind.3. Circuit arrangement according to claim 2, characterized in that the connection points (3, 4) are coated with a tin printing paste. 4. Schaltungsanordnung nach Anspruch 1, dadurch gakennzeichnet, daß zur elektrischEn Verbindung der Anschlußstellen (3, 4) jedes Trägarkürpers (1) mit den Leiterbahnenden (5, S) ein leitfähiger Kleber vorgeschen ist.4. Circuit arrangement according to claim 1, characterized in that for the electrical connection of the connection points (3, 4) of each support body (1) with a conductive adhesive is provided in front of the conductor track ends (5, S). 5. Schaltungsanordnung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß zwischen den Leiterbahnenden (5,6) das Leiterplattenmaterial entfernt ist.5. Circuit arrangement according to one of claims 1 to 4, characterized in that that the circuit board material is removed between the conductor track ends (5,6). 6. Schaltungsanordnung nach Anspruch 5, dadurch gekennzeichnet, daß seitlich der Leiterbahnenden (5, 6) das Leiterplattenmaterial entfernt ist.6. Circuit arrangement according to claim 5, characterized in that the printed circuit board material has been removed from the side of the conductor track ends (5, 6).
DE19762652951 1976-11-22 1976-11-22 Circuit component mounting and contact - uses small circuit board to support component with contact pads soldered to main circuit board conductors Withdrawn DE2652951A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19762652951 DE2652951A1 (en) 1976-11-22 1976-11-22 Circuit component mounting and contact - uses small circuit board to support component with contact pads soldered to main circuit board conductors
JP13980677A JPS5365974A (en) 1976-11-22 1977-11-21 Circuit device having printed wiring board provided with parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762652951 DE2652951A1 (en) 1976-11-22 1976-11-22 Circuit component mounting and contact - uses small circuit board to support component with contact pads soldered to main circuit board conductors

Publications (1)

Publication Number Publication Date
DE2652951A1 true DE2652951A1 (en) 1978-05-24

Family

ID=5993667

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762652951 Withdrawn DE2652951A1 (en) 1976-11-22 1976-11-22 Circuit component mounting and contact - uses small circuit board to support component with contact pads soldered to main circuit board conductors

Country Status (2)

Country Link
JP (1) JPS5365974A (en)
DE (1) DE2652951A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905657A1 (en) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible supporting film

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62194693A (en) * 1986-02-12 1987-08-27 信越ポリマ−株式会社 Electronic parts
JPS62194692A (en) * 1986-02-14 1987-08-27 信越ポリマ−株式会社 Electronic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905657A1 (en) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible supporting film

Also Published As

Publication number Publication date
JPS5365974A (en) 1978-06-12

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