DE1187282B - Circuit board with laminated conductor tracks and circuit components connected in an electrically conductive manner using the dip soldering process - Google Patents
Circuit board with laminated conductor tracks and circuit components connected in an electrically conductive manner using the dip soldering processInfo
- Publication number
- DE1187282B DE1187282B DEN25102A DEN0025102A DE1187282B DE 1187282 B DE1187282 B DE 1187282B DE N25102 A DEN25102 A DE N25102A DE N0025102 A DEN0025102 A DE N0025102A DE 1187282 B DE1187282 B DE 1187282B
- Authority
- DE
- Germany
- Prior art keywords
- conductor tracks
- circuit board
- electrically conductive
- dip soldering
- components connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Schaltungsplatte mit aufkaschierten Leiterbahnen und im Tauchlötverfahren elektrisch leitend verbundenen Schaltungsbauteilen Die Erfindung bezieht sich auf eine Schaltungsplatte mit aufkaschierten Leiterbahnen und mit diesen im Tauchlötverfahren elektrisch leitend verbundenen Schaltungsbauteilen.Circuit board with laminated conductor tracks and in dip soldering process electrically conductively connected circuit components The invention relates to a circuit board with laminated conductor tracks and with these in the dip soldering process electrically conductively connected circuit components.
Bei bekannten Schaltungsplatten mit aufkaschierten oder gedruckten Leiterbahnen biegt man die Anschlußdrahtenden der eingesteckten Bauteile vor dem Löten nicht mehr um, weil Biegevorgänge und die dazu notwendigen Werkzeuge eingespart werden sollen. Beim Tauchlöten einer in dieser Art bestückten Platine wird dann aber das Zinn des Lötbades durch Oberflächenspannung von den durch die Einstecklöcher hindurchragenden Drahtenden abgezogen, so daß .sie nur von einer relativ dünnen Zinnschicht gehalten werden. Beim weiteren Handhaben einer solchen Platine während des Einbaues brechen dann sehr leicht Bauteile ganz oder teilweise aus der Platine heraus, so daß elektrische Verbindungen unbemerkt unterbrochen werden oder einzelne Bauteile ganz aus der Platine herausfallen können. Man ist darum oft wieder dazu übergegangen, die Anschlußenden der eingesteckten Bauteile umzubiegen.In known circuit boards with laminated or printed Conductor tracks are bent before the connecting wire ends of the inserted components No more soldering, because bending processes and the necessary tools are saved should be. When immersion soldering a board assembled in this way is then but the tin of the solder bath by surface tension from the through the insertion holes peeled off protruding wire ends, so that .sie only from a relatively thin one Tin layer are kept. When further handling such a board during During installation, components then break completely or partially out of the board very easily out, so that electrical connections are interrupted or individual connections unnoticed Components can fall out of the board completely. That's why you're often there again passed over to bend the connection ends of the inserted components.
Um Lötzinn einzusparen, ist es bekannt, alle Stellen der Leiterbahnen, an denen keine Lötverbindungen herzustellen sind, mit einem sogenannten Anti-Lötlack zu überziehen. Der Nachteil dieses Verfahrens besteht jedoch darin, daß nun die dünne Kupferfolie der Leiterbahnen nicht mehr durch eine Schicht Lötzinn verstärkt wird. Da diese dünnen Leiterfolien aber mitunter Haarrisse bekommen, wird an einer solchen, von außen her nicht erkennbaren Stelle die elektrische Verbindung unterbrochen, und die ganze Platine fällt aus.In order to save solder, it is known to remove all points of the conductor tracks, at which no soldered connections have to be made, with a so-called anti-solder lacquer to cover. The disadvantage of this method, however, is that now the thin copper foil of the conductor tracks is no longer reinforced by a layer of solder will. However, since these thin conductor foils sometimes get hairline cracks, one such, from the outside not recognizable point the electrical connection is interrupted, and the whole board fails.
Der Erfindung liegt die Aufgabe zugrunde, den Aufwand für das Umbiegen der durchgesteckten Anschlußenden der Bauteile zu vermeiden und dennoch dafür zu sorgen, daß beim Tauchlöten genügend Zinn an die Lötstellen heranfließt, damit die Bauteile fest und elektrisch gut leitend mit den Leiterbahnen verbunden werden. Außerdem sollen die Leiterbahnen durch eine Zinnauflage verstärkt werden.The invention is based on the task of bending over to avoid the plugged-through connection ends of the components and yet to do so ensure that enough tin flows up to the soldering points during dip soldering so that the Components are connected to the conductor tracks firmly and with good electrical conductivity. In addition, the conductor tracks should be reinforced by a tin coating.
Das wird erfindungsgemäß dadurch erreicht, daß im Abstand rings um die Einstecklöcher zur Aufnahme der Bauteilanschlüsse eine kleine Fläche mit Anti-Lötlack vorgesehen ist. Dabei ist dann als zweckmäßige Weiterbildung der Erfindung die Anti-Lötlackfläche als aufgedruckte Ringfläche ausgebildet.This is achieved according to the invention in that at a distance all around the insertion holes for receiving the component connections cover a small area with anti-solder varnish is provided. The anti-soldering lacquer surface is then an expedient further development of the invention designed as a printed ring surface.
Der Vorteil der Erfindung ist darin zu sehen, daß durch die kleine, um das herausstehende Anschlußende herumliegende Anti-Lötlackfläche das Zinn beim Tauchlöten daran gehindert wird, seitlich von den mit den Leiterbahnen zu verlötenden Anschlußenden wegzufließen. Vielmehr drängt der Anti-Löt Lackring das Zinn an dieser Stelle zu einem Tropfen um das herausstehende Anschlußende zusammen und sichert so nicht nur die elektrisch einwandfreie Lötverbindung, sondern auch eine mechanisch feste Verbindung. Ferner werden dadurch, daß nur jeweils ein kleiner Teil der Leiterbahnen mit Anti-Lötlack bedeckt ist, die übrigen freien Leiterbahnen beim Tauchlöten mit einer Zinnschicht überzogen, so daß ein wirksamer Schutz gegen Haarrißbildung in den Leiterfolien vorhanden ist.The advantage of the invention is to be seen in the fact that the small, the anti-soldering lacquer surface lying around the protruding connection end Dip soldering is prevented from being laterally of the to be soldered with the conductor tracks Flow away connecting ends. Rather, the anti-solder lacquer ring pushes the tin against it Gather into a drop around the protruding connector end and secure So not only the electrically flawless solder connection, but also a mechanical one stable connection. Furthermore, the fact that only a small part of the conductor tracks is covered with anti-solder varnish, the remaining free conductor tracks with dip soldering coated with a tin layer, so that an effective protection against hairline cracking in the conductor foils is present.
Nachstehend ist die Erfindung an Hand der Zeichnung näher beschrieben. Es zeigt F i g. 1 schematisch und im Schnitt die Lötstelle eines Anschlußdrahtes 2 von einem Bauteil 1, hier beispielsweise eines Widerstandes, in bekannter Ausführung. Mit 3 ist der Platinenausschnitt bezeichnet und mit 4 die Leiterbahn, mit der der Anschlußdraht 2 verlötet werden soll. Da sich beim dargestellten Beispiel einer an sich bekannten Tauchlötung das Zinn 5 entlang der Leiterbahn 4 verteilen kann, wird es durch die Oberflächenspannung vom Anschlußende 2 abgezogen. Es entsteht dadurch nur eine dünne und empfindliche Lötstelle 5 a, die leicht ausbrechen kann. In den F i g. 2 und 3 ist dagegen eine Lötstelle gemäß der Erfindung dargestellt. Hier ist rings um das Anschlußdrahtende 2 in gewissem Abstand eine Ringfläche 6 aus sogenanntem Lötstopplack aufgedruckt. Wie dargestellt, kann nun beim Tauchlöten das Zinn nicht mehr vom Anschlußdrahtende ablaufen. Es bildet sich dort eine Zinnlinse 7, über die das Bauteil 1 sowohl elektrisch als auch mechanisch sicher mit der Leiterbahn 4 verbunden ist.The invention is described in more detail below with reference to the drawing. It shows F i g. 1 schematically and in section the soldering point of a connecting wire 2 of a component 1, here for example a resistor, in a known design. The circuit board cutout is denoted by 3 and the conductor track with which the connecting wire 2 is to be soldered is denoted by 4. Since in the illustrated example of a known dip soldering the tin 5 can be distributed along the conductor track 4, it is drawn off from the connection end 2 by the surface tension. Characterized it is formed only a thin and delicate solder 5 a, which can easily break. In the F i g. 2 and 3, on the other hand, show a solder joint according to the invention. Here an annular surface 6 made of so-called solder resist is printed around the connecting wire end 2 at a certain distance. As shown, the tin can no longer run off the end of the connecting wire during dip soldering. A tin lens 7 is formed there, via which the component 1 is securely connected to the conductor track 4 both electrically and mechanically.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEN25102A DE1187282B (en) | 1964-06-12 | 1964-06-12 | Circuit board with laminated conductor tracks and circuit components connected in an electrically conductive manner using the dip soldering process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEN25102A DE1187282B (en) | 1964-06-12 | 1964-06-12 | Circuit board with laminated conductor tracks and circuit components connected in an electrically conductive manner using the dip soldering process |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1187282B true DE1187282B (en) | 1965-02-18 |
Family
ID=7343298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEN25102A Pending DE1187282B (en) | 1964-06-12 | 1964-06-12 | Circuit board with laminated conductor tracks and circuit components connected in an electrically conductive manner using the dip soldering process |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1187282B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0239158A2 (en) * | 1986-03-25 | 1987-09-30 | Koninklijke Philips Electronics N.V. | Circuit board for printed circuits, and method of making such a board |
US4767892A (en) * | 1986-05-16 | 1988-08-30 | Alpine Electronics Inc. | Printed-wiring board |
-
1964
- 1964-06-12 DE DEN25102A patent/DE1187282B/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0239158A2 (en) * | 1986-03-25 | 1987-09-30 | Koninklijke Philips Electronics N.V. | Circuit board for printed circuits, and method of making such a board |
US4766268A (en) * | 1986-03-25 | 1988-08-23 | U.S. Philips Corporation | Board for printed circuits and processes for manufacturing such printed boards |
EP0239158A3 (en) * | 1986-03-25 | 1989-01-11 | N.V. Philips' Gloeilampenfabrieken | Circuit board for printed circuits, and method of making such a board |
US4767892A (en) * | 1986-05-16 | 1988-08-30 | Alpine Electronics Inc. | Printed-wiring board |
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