DE2602953A1 - Semiautomatic soldering of contacts onto wire - using jig which immerses tip of contact in solder bath - Google Patents

Abstract

The contacts and the lead ends are aligned on a rotary or swivel jig immersing the assembly in a solder bath for a selected time, and then removing the assembly from the bath. The solder bath is pref. temp. controlled and kept at a constant height; and the assemblies are pref. automatically coated with flux directly before entering the solder bath. On leaving the bath the soldered parts are automatically ejected from the jig. Two alternative jigs may be used, one using a rotating wheel and the other a plate swivelling in steps of 180 degrees to immerse the tips of the contacts in the bath. Used e.g. to solder contacts to flexible wires in electric circuits for motor vehicles. A simple and reliable process and device eliminating faulty joints.

Description

Method and device for partially automated

Soldering of plug contact parts to flexible Leitunssenden The invention relates to a method according to the preamble of claim 1.

For use in vehicle electrics, it is necessary to use more and Produce multiple plug connections. For this purpose, contact parts, in particular Round sleeves or

Round pins connected to cable ends. In addition to the electrically less high-quality solderless crimp or screw connection is the connection between Contact part and cable end by soldering.

With such soldered connections it is particularly important to be cold; respectively. to avoid poorly executed soldering points, as foil electrical contacts in the Motor vehicle exposed to high currents and frequent vibrations with strong oxidation are.

Since pickling is used exclusively for wiring in motor vehicle construction and their soldering with the contacts is much more difficult than with solid conductors, must so far for better handling and faster and safer soldering of the Strand these to be tinned at the tips before soldering.

The strands tinned in this way are made according to a known method stretched to several lines in a clamping device, whereupon the Hang the plug-in contacts on the tips and add them using a welding device soldered by solder wire. It has been shown in practice that it is only with particular care, the contact parts hanging loosely on the cable tips succeed to hold so still that their position on the tip of the conductor does not change.

The soldering time is determined by the staff as it is automatic Time control because of the different size connection cross-sections and the used high temperatures is not possible. It also affects the process flow disturbing noticeable that after soldering the contact parts because of the high temperature need to cool down for several seconds before they are removed from the soldering device can be.

@ arüber in addition, the soldering chamber must be used in the previously known Verfahrun of the contact part completely sealed from the actual subsequent electrical contact areas be separated, since the solder runs into the plug-in chamber of the contacts and closes Malfunctions. For the reason, the contact parts are in the. Rule so far Made of solid brass and therefore more expensive than faded contacts for the solderless connection technology.

The invention is based on the object of simplifying the soldering process to bring about an economical production of the soldered connections with constant Good quality of the L-itstelle, especially jammed while avoiding cold soldering points At the same time, the effort and time required for soldering should be reduced.

This task is carried out for a method of the type mentioned at the beginning the invention according to the characterizing part of claim 1 solved.

In the method according to the invention, the otherwise necessary is not necessary Tinning the wire tips. In addition, the actual soldering process in its quality can no longer be influenced by the operating personnel. The quality the soldering is always consistently good, cold soldering joints do not occur.

The manufacturing time is also longer than that of the method outlined at the beginning significantly reduced. It is now only very much higher than the production time a solder-free connection contact. Also are the amount of work and the demands on the operating personnel are now lower. Finally you can structurally simpler sleeves or rolled sheet metal parts instead of solid parts Quality and time losses are processed.

Advantageous embodiments of the method according to the invention are described in claims 2 to 4.

In a further development of the invention, the patent claims 5 and 9 devices for carrying out the claimed method according to the invention at.

Refinements of the two aforementioned devices in further development of the subject matter of the invention are described in the remaining subclaims.

Two embodiments for devices according to the invention are shown in the drawing. The process will be explained in more detail below using them will. FIG. 1 shows a contact part in connection with a line end, FIGS. 2 and 3 show a soldering device using a rotatable wheel and FIG 4a, 4b a soldering device using and 5 a reversible plate.

In the figure 1, a contact part 6 is shown in the form of a round sleeve, the one with a line end 11 at its head part connected is. These Connection is to be made by soldering, in particular dip soldering with the schematic shown in FIG indicated device take place.

This device has a wheel 2 rotatable about a fixed axis 13 on. The wheel 2 is on its counterpart with a measuring device 5 for the contact parts 6 Scope provided. The Aufsarmeeinrichtuben are formed here by pins on the the contact parts 6 are clipped on. At the same time, the end of the line is 11 in the correct position on the wheel 2 by means of a belt 3 placed around the periphery of the wheel held to the contact part for the soldering. The preferably in the one in the drawing figure 2 upper half plugged-on contact parts 6 and cable ends 11 are when rotated of the wheel 2 as a result of the drive 1 initially with a flux, which is through a Feed pipe 8 is passed, wetted and then with further rotation of the wheel 2 immersed in a solder bath 4. The solder bath 4 is temperature controlled and is in his Surface height always kept constant.

By the rotation of the wheel 2, its axis 13 opposite the surface of the solder bath 4 is inclined from the vertical by a certain angle the line end 11 (which consists of a stranded wire) and the contact part in hanging Position moved by the tin bath. The round sleeve plunges diagonally (at an angle smaller than 900) in the solder bath to a Damage to the conductor insulation to avoid by the hot sdd.

Due to the capillary effect, the required soldering temperature is reached the liquid solder is drawn into the open soldering head of the contact part and thus the Wire securely soldered to the contact. By the solder bath temperature, the immersion depth of the contact part and immersion time, the soldering process is set so that with certainty cold soldering points can be avoided and damage to the conductor insulation or

the refined surface of the contact does not take place.

After passing through the li5tbad 4, this arrives at the end of the service 11 now soldered contact part 6 to a throw * device 7 through which the soldered Parts are automatically stripped from the wheel.

Figure 3 illustrates the arrangement of the Fluf'mittelzufhrung 8 and the Drop device 7.

Should multiple cores in a contact element or small units with several individual wires, which are connected by means of a previously applied protective insulation are held together, are soldered with contact parts, takes place preferably an insert 12 shown in Figures 4a, b and 5 use.

For this purpose, the contact parts 6 are attached to the turning plate 12 Receiving devices - here receiving pins - inserted and correctly positioned For soldering, the line ends are clamped onto the turning plate 12 by means of a spring 10.

The number of contact parts applied in one clamping process and cable ends can be chosen depending on the intended use; will. The assembled Contact parts 6 and line ends 11 are in the area of their connection shortly before the soldering wetted with a flux, whereupon the insert 12 to 1800 is pivoted. The insert 12 lies on a support pin 9, the is timed.

The height of the support pin determines the immersion depth of the to be soldered Parts in the solder bath 4. Preferably, the contact parts 6 should also be used in this device Do not immerse in the solder at right angles but at an angle to the surface of the solder bath, to send the conductor insulation of the line 11 outside of the soldering area to damage.

After a preselected time, the time-controlled support pin 9 lifts the Turning plate 12, so that the soldering process is thereby automatically ended. The insert 12 is then swiveled back into the starting position and the soldered parts are by the ejection device 7 recognizable in FIG. 5 automatically from the turning plate 12 lifted so that the device is immediately available for new loading.

7 pages description 11 claims 3 sheet drawing with 6 characters

Claims (11)

P a t e n t a n s p r ü c h e 1. Process for partially automated @ nsoldering of contact parts at the ends of the line n e t that first the contact parts and cable ends in a position suitable for soldering be applied to each other on a rotatable or pivotable TrafJ element that then the support element is rotated or pivoted in such a way that the to be soldered Dip each part with the contact part upside down in a solder bath and there one selectable time remains @ and that finally the support element is turned back or - is swiveled and the soldered arrows are then removed. 2. Verfanren according to claim 1, d a d u r c h g e k e n n z e i c h N e t that the solder bath temperature geste @@ rt and with its surface @ to a constant @@@ is held. 3. The method according to any one of claims 1 or 2, d a d u r c h g e k e n n -z e i c h n e t that immediately before the threshing or swinging of the to A flux is automatically applied to the parts to be soldered in the solder bath will. 4. The method according to any one of claims 1 to 3, d a d u r c h g e k e n n -z e i c h n e t that as a result of the reverse rotation or pivoting the soldered files are automatically thrown from the support element. 5. Device for performing the method according to one of the claims 1 to 4, g e k e n n n z e i c h n e t d u r c h a rotatable around a remote axis Wheel (2), which has a receiving device (5) for the contact parts (6) and associated therewith Has clamping devices (3, 10) for the conductor ends (11). 6. Apparatus according to claim 5, d a d u r c h g e k e n n z e i c N e t that the receptions for the contact parts (6) as pins (5) or Bon stanchions and the jigs for the conductor ends (11) as belts (3) or Springs (10) are formed. 7. Device according to one of claims 5 or 6, d a d u r c h g It is not noted that the wheel (2) with its axis against the surface the solder bath (4) is inclined. 8. Device according to one of claims 5 to 7, d a d u r c h g e it is not possible for the wheel (2) to rotate at an adjustable speed is driven. 9. Device for performing the method according to one of the claims 1 to 4, g e k e n n n z e i c h n e t d u r c h one around an axis. Turning plate (12) pivotable parallel to the surface of the solder bath, the receiving devices in the form of bores or 5 pins (5) for the contact parts (6) and belts (3) or pads (10) for the conductor ends (11), and by a support pin (9) is held in the solder layer. 10. The device according to claim 9, d a d u r c h g e k e n n z e i c h n e t that the contact part (6) is received in such a way by the turning plate (12), that it dips obliquely into the solder bath (4). 11. Device according to one of claims 9 or 10, d a d u r c h it is not noted that the support pin (9) is timed to move the insert (12) lifts out of the soldering layer.