DE2556239A1 - Kuehleinrichtung zur fluessigkeitskuehlung fuer ein elektrisches bauteil - Google Patents

Kuehleinrichtung zur fluessigkeitskuehlung fuer ein elektrisches bauteil

Info

Publication number
DE2556239A1
DE2556239A1 DE19752556239 DE2556239A DE2556239A1 DE 2556239 A1 DE2556239 A1 DE 2556239A1 DE 19752556239 DE19752556239 DE 19752556239 DE 2556239 A DE2556239 A DE 2556239A DE 2556239 A1 DE2556239 A1 DE 2556239A1
Authority
DE
Germany
Prior art keywords
cooling device
cooling
component
clamp
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19752556239
Other languages
German (de)
English (en)
Inventor
Manfred Dipl Ing Lodahl
Juergen Ing Grad Zeis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19752556239 priority Critical patent/DE2556239A1/de
Priority to FR7637495A priority patent/FR2335050A1/fr
Publication of DE2556239A1 publication Critical patent/DE2556239A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19752556239 1975-12-13 1975-12-13 Kuehleinrichtung zur fluessigkeitskuehlung fuer ein elektrisches bauteil Pending DE2556239A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19752556239 DE2556239A1 (de) 1975-12-13 1975-12-13 Kuehleinrichtung zur fluessigkeitskuehlung fuer ein elektrisches bauteil
FR7637495A FR2335050A1 (fr) 1975-12-13 1976-12-13 Refroidisseur par liquide pour composant electrique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752556239 DE2556239A1 (de) 1975-12-13 1975-12-13 Kuehleinrichtung zur fluessigkeitskuehlung fuer ein elektrisches bauteil

Publications (1)

Publication Number Publication Date
DE2556239A1 true DE2556239A1 (de) 1977-06-23

Family

ID=5964319

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752556239 Pending DE2556239A1 (de) 1975-12-13 1975-12-13 Kuehleinrichtung zur fluessigkeitskuehlung fuer ein elektrisches bauteil

Country Status (2)

Country Link
DE (1) DE2556239A1 (nl)
FR (1) FR2335050A1 (nl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE441047B (sv) * 1983-10-06 1985-09-02 Asea Ab Halvledarventil for hogspenning med spenningsdelarsektioner innefattande motstand

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1208008B (de) * 1963-07-27 1965-12-30 Bbc Brown Boveri & Cie Halbleiter-Gleichrichtergeraet
DE1464781A1 (de) * 1964-07-08 1968-12-19 Bbc Brown Boveri & Cie Halbleiter-Stromrichteranlage mit mehreren Halbleiterelementen
FR1545906A (fr) * 1967-10-06 1968-11-15 Jeumont Schneider Dispositif de refroidissement d'élément semiconducteur

Also Published As

Publication number Publication date
FR2335050A1 (fr) 1977-07-08
FR2335050B1 (nl) 1982-06-04

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