DE2527858A1 - Elektrisches bauelement - Google Patents

Elektrisches bauelement

Info

Publication number
DE2527858A1
DE2527858A1 DE19752527858 DE2527858A DE2527858A1 DE 2527858 A1 DE2527858 A1 DE 2527858A1 DE 19752527858 DE19752527858 DE 19752527858 DE 2527858 A DE2527858 A DE 2527858A DE 2527858 A1 DE2527858 A1 DE 2527858A1
Authority
DE
Germany
Prior art keywords
component according
integrated circuit
luminous element
electrical component
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19752527858
Other languages
German (de)
English (en)
Inventor
Gert Dipl Phys Dr Siegle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Priority to DE19752527858 priority Critical patent/DE2527858A1/de
Priority to FR7618765A priority patent/FR2315700A1/fr
Priority to BR7604044A priority patent/BR7604044A/pt
Priority to ZA763718A priority patent/ZA763718B/xx
Priority to ES449149A priority patent/ES449149A1/es
Publication of DE2527858A1 publication Critical patent/DE2527858A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/145—Indicating the presence of current or voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Devices (AREA)
DE19752527858 1975-06-23 1975-06-23 Elektrisches bauelement Pending DE2527858A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19752527858 DE2527858A1 (de) 1975-06-23 1975-06-23 Elektrisches bauelement
FR7618765A FR2315700A1 (fr) 1975-06-23 1976-06-21 Element de montage electrique
BR7604044A BR7604044A (pt) 1975-06-23 1976-06-22 Elemento eletrico
ZA763718A ZA763718B (en) 1975-06-23 1976-06-22 Circuit element
ES449149A ES449149A1 (es) 1975-06-23 1976-06-23 Perfeccionamientos en componentes electricos.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752527858 DE2527858A1 (de) 1975-06-23 1975-06-23 Elektrisches bauelement

Publications (1)

Publication Number Publication Date
DE2527858A1 true DE2527858A1 (de) 1977-01-13

Family

ID=5949718

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752527858 Pending DE2527858A1 (de) 1975-06-23 1975-06-23 Elektrisches bauelement

Country Status (5)

Country Link
BR (1) BR7604044A (enExample)
DE (1) DE2527858A1 (enExample)
ES (1) ES449149A1 (enExample)
FR (1) FR2315700A1 (enExample)
ZA (1) ZA763718B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3208021A1 (de) * 1981-04-24 1982-11-11 Hitachi, Ltd., Tokyo Integrierte halbleiterschaltung
DE102015121577A1 (de) * 2015-12-11 2017-06-14 Infineon Technologies Ag Verfahren zur erkennung eines sich abzeichnenden ausfalls eines halbleiterchips eines halbleitermoduls und halbeitermodulanordnung

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3208021A1 (de) * 1981-04-24 1982-11-11 Hitachi, Ltd., Tokyo Integrierte halbleiterschaltung
DE102015121577A1 (de) * 2015-12-11 2017-06-14 Infineon Technologies Ag Verfahren zur erkennung eines sich abzeichnenden ausfalls eines halbleiterchips eines halbleitermoduls und halbeitermodulanordnung
DE102015121577B4 (de) 2015-12-11 2023-06-29 Infineon Technologies Ag Verfahren zur erkennung eines sich abzeichnenden ausfalls eines halbleiterchips eines halbleitermoduls und halbeitermodulanordnung

Also Published As

Publication number Publication date
FR2315700B3 (enExample) 1979-03-09
FR2315700A1 (fr) 1977-01-21
ES449149A1 (es) 1977-08-01
ZA763718B (en) 1977-05-25
BR7604044A (pt) 1977-07-05

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