FR2315700A1 - Element de montage electrique - Google Patents

Element de montage electrique

Info

Publication number
FR2315700A1
FR2315700A1 FR7618765A FR7618765A FR2315700A1 FR 2315700 A1 FR2315700 A1 FR 2315700A1 FR 7618765 A FR7618765 A FR 7618765A FR 7618765 A FR7618765 A FR 7618765A FR 2315700 A1 FR2315700 A1 FR 2315700A1
Authority
FR
France
Prior art keywords
light element
integrated circuit
light
mounting element
electrical mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7618765A
Other languages
English (en)
French (fr)
Other versions
FR2315700B3 (enExample
Inventor
Gert Siegle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Publication of FR2315700A1 publication Critical patent/FR2315700A1/fr
Application granted granted Critical
Publication of FR2315700B3 publication Critical patent/FR2315700B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/145—Indicating the presence of current or voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Devices (AREA)
FR7618765A 1975-06-23 1976-06-21 Element de montage electrique Granted FR2315700A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752527858 DE2527858A1 (de) 1975-06-23 1975-06-23 Elektrisches bauelement

Publications (2)

Publication Number Publication Date
FR2315700A1 true FR2315700A1 (fr) 1977-01-21
FR2315700B3 FR2315700B3 (enExample) 1979-03-09

Family

ID=5949718

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7618765A Granted FR2315700A1 (fr) 1975-06-23 1976-06-21 Element de montage electrique

Country Status (5)

Country Link
BR (1) BR7604044A (enExample)
DE (1) DE2527858A1 (enExample)
ES (1) ES449149A1 (enExample)
FR (1) FR2315700A1 (enExample)
ZA (1) ZA763718B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2097581A (en) * 1981-04-24 1982-11-03 Hitachi Ltd Shielding semiconductor integrated circuit devices from light
DE102015121577B4 (de) * 2015-12-11 2023-06-29 Infineon Technologies Ag Verfahren zur erkennung eines sich abzeichnenden ausfalls eines halbleiterchips eines halbleitermoduls und halbeitermodulanordnung

Also Published As

Publication number Publication date
FR2315700B3 (enExample) 1979-03-09
DE2527858A1 (de) 1977-01-13
ES449149A1 (es) 1977-08-01
ZA763718B (en) 1977-05-25
BR7604044A (pt) 1977-07-05

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Legal Events

Date Code Title Description
ST Notification of lapse