DE2506653A1 - Verfahren zur herstellung partiell metallisierter einheiten - Google Patents
Verfahren zur herstellung partiell metallisierter einheitenInfo
- Publication number
- DE2506653A1 DE2506653A1 DE19752506653 DE2506653A DE2506653A1 DE 2506653 A1 DE2506653 A1 DE 2506653A1 DE 19752506653 DE19752506653 DE 19752506653 DE 2506653 A DE2506653 A DE 2506653A DE 2506653 A1 DE2506653 A1 DE 2506653A1
- Authority
- DE
- Germany
- Prior art keywords
- grooves
- metal
- path
- cathode
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 claims abstract description 28
- 239000003990 capacitor Substances 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 238000005553 drilling Methods 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 230000002787 reinforcement Effects 0.000 claims description 8
- 230000003197 catalytic effect Effects 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 239000012811 non-conductive material Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011888 foil Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000007654 immersion Methods 0.000 abstract description 2
- 238000001746 injection moulding Methods 0.000 abstract description 2
- -1 inductors Substances 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD17895274A DD111932A1 (enExample) | 1974-06-05 | 1974-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2506653A1 true DE2506653A1 (de) | 1975-12-18 |
Family
ID=5496036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19752506653 Pending DE2506653A1 (de) | 1974-06-05 | 1975-02-17 | Verfahren zur herstellung partiell metallisierter einheiten |
Country Status (2)
| Country | Link |
|---|---|
| DD (1) | DD111932A1 (enExample) |
| DE (1) | DE2506653A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4412125A1 (de) * | 1993-04-09 | 1995-03-02 | Toyoda Gosei Kk | Teil-Galvanisierte Kunststoffprodukte und Teil-Galvanisierungsverfahren dafür |
| DE4432910A1 (de) * | 1993-09-17 | 1995-03-23 | Toyoda Gosei Kk | Teil-Galvanisierte Kunststoffprodukte und Teil-Galvanisierungsverfahren dafür |
| EP1020947A3 (en) * | 1998-12-22 | 2000-10-04 | Nokia Mobile Phones Ltd. | Method for manufacturing an antenna body for a phone and phone or handset having an internal antenna |
| WO2022111999A1 (de) * | 2020-11-30 | 2022-06-02 | Gerhardi Kunststofftechnik Gmbh | Galvanisch dekoriertes bauteil |
-
1974
- 1974-06-05 DD DD17895274A patent/DD111932A1/xx unknown
-
1975
- 1975-02-17 DE DE19752506653 patent/DE2506653A1/de active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4412125A1 (de) * | 1993-04-09 | 1995-03-02 | Toyoda Gosei Kk | Teil-Galvanisierte Kunststoffprodukte und Teil-Galvanisierungsverfahren dafür |
| DE4432910A1 (de) * | 1993-09-17 | 1995-03-23 | Toyoda Gosei Kk | Teil-Galvanisierte Kunststoffprodukte und Teil-Galvanisierungsverfahren dafür |
| EP1020947A3 (en) * | 1998-12-22 | 2000-10-04 | Nokia Mobile Phones Ltd. | Method for manufacturing an antenna body for a phone and phone or handset having an internal antenna |
| US6333716B1 (en) | 1998-12-22 | 2001-12-25 | Nokia Mobile Limited | Method for manufacturing an antenna body for a phone |
| WO2022111999A1 (de) * | 2020-11-30 | 2022-06-02 | Gerhardi Kunststofftechnik Gmbh | Galvanisch dekoriertes bauteil |
Also Published As
| Publication number | Publication date |
|---|---|
| DD111932A1 (enExample) | 1975-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0361193B1 (de) | Leiterplatte mit einem spritzgegossenen Substrat | |
| EP1245138B1 (de) | Verfahren, anlage und vorrichtung zur herstellung eines elektrischen verbindungselementes sowie elektrisches verbindungselement und halbzeug | |
| EP0361195B1 (de) | Leiterplatte mit einem spritzgegossenen Substrat | |
| EP0469635A1 (de) | Verfahren zur Herstellung von Leiterplatten | |
| EP0700630B1 (de) | Folienleiterplatten und verfahren zu deren herstellung | |
| EP0385995A1 (de) | PRäGEFOLIE, INSBESONDERE HEISSPRäGEFOLIE, ZUR ERZEUGUNG VON LEITERBAHNEN AUF EINEM SUBSTRAT. | |
| DE3502744C2 (enExample) | ||
| DE2506653A1 (de) | Verfahren zur herstellung partiell metallisierter einheiten | |
| EP0185303B1 (de) | Elektrisch leitende Kupferschichten und Verfahren zur Herstellung derselben | |
| DE60211628T2 (de) | Zusammengesetzte elektronische bauteile | |
| DE4131065A1 (de) | Verfahren zur herstellung von leiterplatten | |
| DE3325133A1 (de) | Mikrowellenschaltungsplatte und verfahren zu ihrer herstellung | |
| DE1496984C3 (de) | Verfahren zum Herstellen gedruckter Schaltungen mit galvanisch erzeugten Leiterbahnen nach der Aufbaumethode | |
| DE1665314C2 (de) | Basismaterial zur Herstellung gedruckter Schaltungen | |
| DE1665771C2 (de) | Verfahren zur Herstellung gedruckter Schaltungsplatten | |
| DE3546611C2 (enExample) | ||
| DE2715875A1 (de) | Leiterplatte und verfahren zur herstellung einer leiterplatte | |
| DE3914727A1 (de) | Mehrlagen-leiterplatten fuer feinleiter und verfahren zu ihrer herstellung | |
| DE19753149C2 (de) | Verfahren zum Herstellen eines Keramik-Metall-Substrates | |
| CH658157A5 (de) | Verfahren zum herstellen von leiterplatten mit mindestens zwei leiterzugebenen. | |
| EP0278485B1 (de) | Verfahren zur Herstellung eines Digitalisiertabletts | |
| DE2336917A1 (de) | Verfahren zur herstellung von elektronischen einheiten | |
| EP0186655A2 (de) | Verfahren zur Herstellung einer Verbundleiterplatte | |
| DE2058476A1 (de) | Verfahren zum partiellen Metallisieren von Kunststoffoberflaechen | |
| DE3427015C2 (enExample) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OHJ | Non-payment of the annual fee |