DE2332230A1 - Wiring instrument for microminiature cct. assembly - feeds wire through clamp connected with blowpipe for joint fusion - Google Patents

Wiring instrument for microminiature cct. assembly - feeds wire through clamp connected with blowpipe for joint fusion

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Publication number
DE2332230A1
DE2332230A1 DE2332230A DE2332230A DE2332230A1 DE 2332230 A1 DE2332230 A1 DE 2332230A1 DE 2332230 A DE2332230 A DE 2332230A DE 2332230 A DE2332230 A DE 2332230A DE 2332230 A1 DE2332230 A1 DE 2332230A1
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Germany
Prior art keywords
wire
capillary
clamp
arm
burner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE2332230A
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German (de)
Other versions
DE2332230C2 (en
Inventor
Yuzaburo Sakamoto
Morio Toyooka
Shunichi Yamamoto
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Hitachi Ltd
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Hitachi Ltd
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Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to DE2332230A priority Critical patent/DE2332230C2/en
Publication of DE2332230A1 publication Critical patent/DE2332230A1/en
Application granted granted Critical
Publication of DE2332230C2 publication Critical patent/DE2332230C2/en
Expired legal-status Critical Current

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    • HELECTRICITY
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/78Apparatus for connecting with wire connectors
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
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    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
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    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
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    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512Aligning
    • H01L2224/85148Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518Translational movements
    • H01L2224/85181Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/19042Component type being an inductor

Abstract

A wiring device for micro-miniature circuits has a capillary tube for attaching one end of a wire to a surface and with a clamp on an arm moving up and down independently of the capillary and limited by a stop located between them; the clamp grips the wire as the capillary moves upwards and a burner fuses a globule at the end of the wire, the burner being held on the clamp arm at a distance below the arm equal to that between the arm stop and the plane in which the attachment is to be made by the globule.

Description

DrahtbefestigungsvorrichtungWire fastening device

Die Erfindung betrifft eine Drahtbefestigungsvorrichtung zum Zusammenbau elektronischer Schaltungselemente mit Drahtverbindungen.The invention relates to a wire fastening device for assembling electronic circuit elements with wire connections.

Der Zusammenbau von elektronischen Kikrominiatur-Schaltungen wie integrierten Halbleiterschaltungen geht auf folgende Weise vor sich: Ein Draht wird durch ein Werkzeug oder eine Kapillare mit einer Stelle, beispielsweise einer Metallschicht auf einem Schaltungselement in Berührung gebracht, die Verbindung oder Befestigung erfolgt durch Druck oder Ultraschall, die Kapillare wird an eine ir einem Bauteil verlaufende Leitung heranbewegt, und der Draht wird durch Wärme und Druck oder durch Ultraschall mit der Leitung verbunden. Darauf wird die Kapillare vertikal angehoben und der Draht mittels einer Brennerflamme abgeschnitten. Hierdurch bildet sich am Schnittende des Drahtes eine kleine Kugel, die zur nächsten Verbindung des Drahts mit dem Schaltungselement geeignet ist'.The assembly of micro-miniature electronic circuits how semiconductor integrated circuits proceed in the following manner itself: A wire is made through a tool or a capillary with a point such as a metal layer on a circuit element brought into contact, the connection or fastening is carried out by pressure or ultrasound, the capillary is attached to an iran Component running line is moved up, and the wire is connected to the line by heat and pressure or by ultrasound. The capillary is then raised vertically and the wire is cut off using a burner flame. This forms at the end of the cut of the wire a small ball, which is suitable for the next connection of the wire to the circuit element '.

Andererseits bildet der Endteil des mit der Leitung verbundenen Drahtes, der nach dem Abschneiden auf dem Draht verbleibt, ein Endstück, das zu Fehlern im Schaltungselement, beispielsweise zuOn the other hand, the end part of the wire connected to the line, which remains on the wire after cutting, forms an end piece which leads to defects in the circuit element, for example to

409882/0663409882/0663

Kurzschlüssen führen kann. Das Endstück muß daher mittels einer Zange oder dergleichen von Hand entfernt werden. Dies ist jedoch extrem schwierig, da das Endstück nur durch ein Mikroskop zu sehen ist.Can lead to short circuits. The end piece must therefore be removed by hand using pliers or the like. However, this is extremely difficult as the end piece can only be seen through a microscope.

Um den Arbeitsaufwand zur Entfernung der Endstücke zu vermeiden, kann der in Fig. 3 der beigefügten Zeichnung gezeigte Draht 10 am Verbindungspunkt abgeschnitten werden, indem der Draht mit einer Klemme 2 gezogen wird, die ihn beim Anheben der Kapillare 1 nach Ausführung der Verbindung hält. Die Klemme 2 dient zur Führung des Draht oberhalb der Kapillare 1 sowie zum Ergreifen der Drähte zu jeder beliebigen Zeit.To avoid the labor of removing the end pieces, the wire shown in Figure 3 of the accompanying drawings 10 can be cut at the connection point by pulling the wire with a clamp 2, which holds it when the capillary 1 stops after the connection has been established. The clamp 2 is used to guide the wire above the capillary 1 and to grip the Wires at any time.

Gemäß Fig. 3a wird an der Spitze des Drahts eine Eugel 13 gebildet. Ein Leiterrahmen 15, an dessen Leiterteil ein Halbleiterelement 14 angebracht ist, wird unter die Kapillare 1 verschoben. Die Kapillare 1 wird abgesenkt und der Draht 10 mit dem Element verbunden (Fig. 3b). Nach der Verbindung des Drahts 10 mit einem Leiter des Leiterrahmens 15 wird die Kapillare 1 bis in eine geeignete Stellung angehoben (Fig. 3c). In dieser Stellung wird .die Klemme 2 betätigt, die den Draht 10 ergreift. Darauf wird die Kapillare 1 mit der den Draht 10 haltenden Klemme wiederum bis in eine vorherbestimmte Stellung angehoben, in der der Draht an der Verbindungsstelle am Leiterrahmen abgeschnitten wird. Hierbei bildet sich an der Schnittspitze des Drahtes 10 durch eine Brennerflamme 12 wiederum eine Kugel (Fig. 3d). Dieser Vorgang wiederholt sich während des Zusammenbaus eines Schaltungselements.According to FIG. 3a, a ball 13 is attached to the tip of the wire educated. A lead frame 15, on the lead part of which a semiconductor element 14 is attached, is moved under the capillary 1. The capillary 1 is lowered and the wire 10 with the element connected (Fig. 3b). After the connection of the wire 10 with a conductor of the lead frame 15, the capillary 1 is in a suitable Raised position (Fig. 3c). In this position, the clamp 2, which grips the wire 10, is actuated. Then the capillary 1 with the clamp holding the wire 10 again raised to a predetermined position in which the wire is attached to the Connection point is cut off on the lead frame. This forms at the cutting tip of the wire 10 by a burner flame 12 in turn a ball (Fig. 3d). This process is repeated during the assembly of a circuit element.

Bei dieser Arbeitsweise entsteht kein Endstück. Jedoch muß der Vorgang des Anhebens der Kapillare 1 unterbrochen werden, bis die Klemme 2 den Draht 10 sicher ergreift. Ist ferner die Arbeitsstellung der Klemme 2 nicht konstant, so ist die unter die Kapillare 1 ragende Drahtlänge nicht gleichmäßig, so daß auch die Größe der Kugeln uneinheitlich ist. Es ist sehr schwierig, die Haltestel-There is no end piece in this way of working. However, the process of lifting the capillary 1 must be interrupted until the terminal 2 securely grips the wire 10. Furthermore, if the working position of clamp 2 is not constant, it is below the capillary 1 protruding wire length is not uniform, so that the size of the balls is also inconsistent. It is very difficult to get to the

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lung der Kapillare 1 genau zu steuern. Daher kann der Zusammenbau nicht beschleunigt werden.Development of the capillary 1 to control precisely. Therefore, the assembly cannot be accelerated.

Der Erfindung liegt die Aufgabe zugrunde, eine Drahtbefestigungsvorrichtung zu schaffen, die sehr schnell und sehr genau arbeitet, bei der konstante Drahtlängen unterhalb der Kapillare erreicht werden und bei der die Größe der Kugeln an den Drahtspitzen einheitlich ist.The invention is based on the object of a wire fastening device to create that works very quickly and very precisely, with constant wire lengths below the capillary can be achieved and in which the size of the balls at the wire tips is uniform.

Erfindungsgemäß sind ein Klemmenarm und ein Kapillarenarm so angeordnet und ausgebildet, daß sie sich getrennt voneinander aufwärts und abwärts bewegen. Die untere Grenze der Abwärtsbewegung wird durch einen Anschlag gesteuert. Die Klemme arbeitet so, daß sie den Draht hält oder ergreift, während sich die Kapillare aufwärts bewegt, jedoch bevor der Kapillararm den Klemmenann trifft. Der Brenner ist so angeordnet, daß der Abstand vom KLemmenarm im wesentlichen der gltiche ist wie der Abstand zwischen dem Anschlag und der Stelle, an der die Befestigung des Drahtes erfolgt.According to the invention are a clamp arm and a capillary arm arranged and adapted to move up and down separately from each other. The lower limit of the downward movement is controlled by a stop. The clamp operates to hold or grasp the wire as the capillary moves upward, but before the capillary arm hits the clamp. The burner is arranged so that the distance from the clamp arm in essentially the same as the distance between the stop and the place where the wire is attached.

Anhand des in der Zeichnung dargestellten AusfUhrungsbeispiels wird die Erfindung im folgenden näher erläutert. Es zeigen: Fig. 1 die schematische Seitenansicht einer erfindungsgemäßenBased on the exemplary embodiment shown in the drawing the invention is explained in more detail below. 1 shows the schematic side view of an inventive

Befestigungsvorrichtung;
Fig. 2a die schematische Darstellung des Arbeitsablaufs der
Fastening device;
2a shows the schematic representation of the workflow in FIG

und 2dand 2d

undand

Fig. 3a die bereits erläuterte Arbeitsfolge der bekannten bis 3d vorrichtung.3a shows the working sequence of the known ones already explained to 3d device.

Die Vorrichtung enthält eine Kapillare oder Kapillarführung 1, eine Klemme 2 mit einem Mechanismus zur Führung des Drahts 10 und zum Halten des Drahtes zur gewünschten Zeit, einen Kapillararm 3» auf dem die Kapillarführung 1 gelagert ist, und einen Klem- The device contains a capillary or capillary guide 1, a clamp 2 with a mechanism for guiding the wire 10 and for holding the wire at the desired time, a capillary arm 3 »on which the capillary guide 1 is mounted, and a clamp

409882/0663409882/0663

-Λ --Λ -

raenarm 4, auf dem die Klemme 2 gelagert ist. Der Kapillararm 3 und der Klemmenarm 4 sind mit Vorsprüngen 5 bzw. 6 versehen. Die Vorsprünge 5 und 6 stehen einander gegenüber und sind mit nichtgezeigten Antriebseinrichtungen zur Durchführung der Befestigung verbunden. Zwischen dem Kapillararm 3 und dem Klemmenarm 4 ist ein Anschlag 7 angeordnet, dessen Stellung frei einstellbar ist.Oberhalb der Klemme 2 ist ein Führungsrad 8 und oberhalb des Führungsrades 8 eine Drahtspule 9 angeordnet, die frei drehbar sind. Auf die Spüle 9 ist der Draht 10 aus Gold oder Aluminium gewickelt.Raenarm 4, on which the clamp 2 is mounted. The capillary arm 3 and the clamp arm 4 are provided with projections 5 and 6, respectively. The projections 5 and 6 face each other and are not shown with Drive devices connected to carry out the attachment. Between the capillary arm 3 and the clamp arm 4 is a Stop 7 is arranged, the position of which is freely adjustable. Above the clamp 2 is a guide wheel 8 and above the guide wheel 8 is a wire spool 9, which are freely rotatable. On the Sink 9, the wire 10 is wound from gold or aluminum.

Angrenzend an die Spule 9 ist eine Zugfeder 11 vorgesehen, mit der der Draht 10 gespannt wird. Der Draht 10 wird über das Führungsrad 8, die Klemme 2 und die Kapillare 1 nach unten eingeführt. An seiner Spitze befindet sich eine durch die Flamme des Brenners 12 gebildete Kugel 13·Adjacent to the coil 9, a tension spring 11 is provided, with which the wire 10 is tensioned. The wire 10 is over the Guide wheel 8, the clamp 2 and the capillary 1 inserted downwards. At its tip there is one by the flame of the Burner 12 formed sphere 13

Die einzelnen Arbeitsschritte der Vorrichtung werden anhand Fig. 2a bis 2d erläutert.The individual working steps of the device are explained with reference to FIGS. 2a to 2d.

Der Zustand vor der Befestigung ist in Fig. 2a gezeigt. Ein auf einer nichtgezeigten Einspanneinrichtung angeordneter Leiterrahmen 15 wird unter die Kapillare 1 geführt. Der Leiterrahmen 15 ist mit einem Halbleiterelement 14 an einem Endteil eines seiner Leiter verbunden.The state before attachment is shown in Fig. 2a. One arranged on a clamping device (not shown) Leadframe 15 is guided under the capillary 1. The ladder frame 15 is connected to a semiconductor element 14 at one end part connected to one of its conductors.

Gemäß Fig. 2b wird die Kapillare 1 auf einen Anschluß des Elements 14 herabbewegt und die Kugel 13 an der Spitze des Drahtes 10 auf den Anschluß des Elements 14 gedrückt, um sie unter Druck und Wärme miteinander zu verbinden. Zu dieser Zeit wird der zusammen mit der Kapillare 1 nach unten bewegte Klemmenarm 4 durch den Anschlag 7 angehalten. Nachdem der Draht am Anschluß des Elements 14 befestigt ist, wird die Kapillare gleichzeitig zur Seite undAccording to FIG. 2b, the capillary 1 is moved down onto a connection of the element 14 and the ball 13 is moved down to the tip of the wire 10 pressed onto the terminal of the element 14 in order to connect them together under pressure and heat. At that time the will be together with the capillary 1 moved down the clamp arm 4 stopped by the stop 7. After the wire on the connector of the element 14 is attached, the capillary is simultaneously to the side and

409882/0663409882/0663

nach oben bewegt, und zwar zusammen mit dem Klemmenarm 4, bis in eine Stellung über einem anderen Leiter auf dem Leiterrahmen 15. Danach wird sie wiederum abgesenkt und der Draht 10 unter Wärme und Druck auf dem Leiter des Leiterrahmens 15 befestigt. Die Kapillare wird wiederum zur Ausbildung einer zusätzlichen Verbindung auf dem gleichen Leiter um ein kurzes Stück bewegt. Durch diesen zusätzlichen Befestigungsteil 16 wird die Verbindung verstärkt, so daß eine Lösung des Drahts 10 während des Schneidens desselben an Verbindungsteil verhindert wird. Besteht keine Gefahr der lösung des Drahts, so reicht ein Verbindungspunkt mit dem Leiter des Leiterrahmens 15 aus. Nachdem der Draht 10 am Leiter 15 befestigt ist, wird gemäß Pig. 2c die Kapillare 1 vertikal nach oben angehoben, bis sie auf den Klemmenarm 4 trifft und sich zusammen mit diesem nach oben bewegt. Die Klemme 2 ergreift den Draht 10, während äich die Kapillare 1 von der Befestigungsfläche nach oben bewegt, jedoch bevor der Vorsprung 5 den Vorsprung 6 berührt. Hierdurch wird der Draht 10 am Verbindungsteil 16 durch die Hubbewegung des Klemmenarms 4 abgeschnitten.moved upwards, together with the clamp arm 4, up to in a position over another conductor on the lead frame 15. It is then lowered again and the wire 10 is attached to the conductor of the leadframe 15 under heat and pressure. The capillary is in turn moved a short distance to form an additional connection on the same conductor. Through this additional fastening part 16, the connection is reinforced, so that a loosening of the wire 10 during the cutting of the same to Connecting part is prevented. If there is no risk of the wire loosening, a connection point with the conductor of the lead frame is sufficient 15 off. After the wire 10 is attached to the conductor 15, is according to Pig. 2c, the capillary 1 is lifted vertically upwards until it meets the clamp arm 4 and merges with it moved up. The clamp 2 grips the wire 10 while äich the capillary 1 moves upwards from the mounting surface, but before the projection 5 contacts the projection 6. This will make the Wire 10 on connector 16 by the lifting movement of the clamp arm 4 cut off.

Die Kapillare 1 und der Kleinmenarm 4 bewegen sich in die Ausgangsstellung (Fig. 2a) nach oben, während sie ihre relative Stellung gemäß Fig. 2d beibehalten. Am Draht 10 wird für die nächste Verbindung an der Schnittspitze wiederum mittels der Flamme des Brenners 12 eine Kugel 13 ausgebildet,wozu sich der Brenner 12 während der Bewegung der Kapillare 1 unter dieselbe bewegt. Dabei ist der Brenner 12 so eingestellt, daß der Abstand vom angehobenen Klemmenarms 4 gleich ist dem Abstand zwischen dem Anschlag 7 und der Ebene, in der der Draht 10 befestigt wird.The capillary 1 and the small arm 4 move into the Starting position (Fig. 2a) upwards, while they maintain their relative position according to FIG. 2d. On wire 10 will be for the next Connection at the cutting tip in turn formed a ball 13 by means of the flame of the burner 12, for which purpose the burner 12 moved under the same during the movement of the capillary 1. The burner 12 is set so that the distance from the raised Clamp arm 4 is equal to the distance between the stop 7 and the plane in which the wire 10 is attached.

Somit wird die Schnittspitze des Drahts 10 stets in der richtigen Stellung angehalten, in die die Flamme des Brenners 12 gelangt. Da die Größe der an der Spitze des geschnittenen Drahtes gebildeten Kugel stets die gleiche ist, wird die Verbindung am Element 14 vereinheitlicht.Thus, the cutting tip of the wire 10 is always stopped in the correct position in which the flame of the burner 12 arrives. Because the size of the wire cut at the top formed sphere is always the same, the connection on element 14 is standardized.

409882/0663409882/0663

-JG---JG--

Bei der erfindungsgemäßen Vorrichtung braucht die Hubbewegung der Kapillare 1 nicht unterbrochen zu werden, da die Klemme 2 den Braht 10 ergreift, während die vom KLemmenarm 4 getrennte Kapillare 1 sich nach oben bewegt.In the device according to the invention, the lifting movement takes place of the capillary 1 not to be interrupted, since the clamp 2 grips the braht 10, while the clamp arm 4 separated Capillary 1 moves upwards.

Die Länge des Drahts 10 unterhalb der Kapillare 1 kann durch Einstellung der Stellung des Anschlags 7 geändert werden. In diesem Fall sollte die Stellung des Klemmenarms 4 oder des Brenners 12 entsprechend der Stellung des Anschlags 7 geändert werden. Ferner kann die Größe der an der Spitze des Drahts 10 gebildeten Kugel durch geringfügige Änderung der Stellung des Anschlags 7 eingestellt werden. The length of the wire 10 below the capillary 1 can be through Setting the position of the stop 7 can be changed. In this case, the position of the clamp arm 4 or the torch 12 should be appropriate the position of the stop 7 can be changed. Further, the size of the ball formed at the tip of the wire 10 can be increased by slight change in the position of the stop 7 can be set.

Somit geht bei der erfindungsgemäßen Vorrichtung die Befestigung mit hoher Geschwindigkeit vonstatten, wobei keine Bndstücke entstehen.Thus, in the device according to the invention, the fastening is possible proceed at high speed with no end pieces.

PatentanspruchClaim

409882/0663409882/0663

Claims (1)

PATENTANSPRUCHPATENT CLAIM BA-10716BA-10716 /' Befestigungsvorrichtung, mit einer Kapillare zur Befestigung eines Endes eines Drahts an einer Oberfläche eines Gegenstands, und mit einer Klemme zur Halterung des Drahts und zum Schneiden desselben durch Entfernung von der Verbindungsstelle des Drahts mit dem Gegenstand, dadurch gekennzeichnet , daß dn Klemmenarm (4) mit der Klemme (2) und ein Kapillararm (3) mit der Kapillare (1) getrennt voneinander auf- und abwärts beweglich sind, daß die untere Grenze der Bewegung des Klemmenarms (4) durch einen Anschlag (7) steuerbar ist, der zwischen dem Klemmenarm (4) und dem Kapillararm (3) angeordnet ist, daß die Klemme (2) den Draht (10) ergreift, während sich die Kapillare (1) vom Verbindungspunkt nach oben bewegt, jedoch bevor der Kapillararm (3) auf den Klemmenarm (4) trifft, und daß ein Brenner (12) zur Ausbildung einer Kugel (I3) an der Schnittspitze des Drahts (1O) mittels einer Flamme derart angeordnet ist, daß der Abstand zwischen dem Brenner (12) und dem Klemmenarm (4) im wesentlichen gleich ist dem zwischen dem Anschlag (7) und der Ebene, in der der Draht (10) am Gegenstand befestigt wird.Fastening device, with a capillary for fastening one end of a wire to a surface of an object, and with a clamp for holding the wire and for cutting it by removing it from the junction of the wire with the object, characterized in that the clamp arm (4 ) with the clamp (2) and a capillary arm (3) with the capillary (1) are separately movable up and down, so that the lower limit of the movement of the clamp arm (4) can be controlled by a stop (7) between the clamp arm (4) and the capillary arm (3) is arranged so that the clamp (2) grips the wire (10) while the capillary (1) moves up from the connection point, but before the capillary arm (3) on the clamp arm (4) meets, and that a burner (12) for forming a ball (I3) at the cutting tip of the wire (1O) is arranged by means of a flame such that the distance between the burner (12) and the clamp arm (4) in essential ichen is the same as that between the stop (7) and the plane in which the wire (10) is attached to the object. 409882/0663409882/0663 LeerseiteBlank page
DE2332230A 1973-06-25 1973-06-25 Bonding device Expired DE2332230C2 (en)

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DE2332230C2 DE2332230C2 (en) 1983-05-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3333601A1 (en) * 1982-09-16 1984-03-22 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa WIRE CONNECTION OR WIRING DEVICE

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3447657A1 (en) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München WIRE CLAMPING DEVICE

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2117625A1 (en) * 1971-04-10 1972-10-26 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Semiconductor contacting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2117625A1 (en) * 1971-04-10 1972-10-26 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Semiconductor contacting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3333601A1 (en) * 1982-09-16 1984-03-22 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa WIRE CONNECTION OR WIRING DEVICE

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