DE2332230C2 - Bonding device - Google Patents

Bonding device

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Publication number
DE2332230C2
DE2332230C2 DE2332230A DE2332230A DE2332230C2 DE 2332230 C2 DE2332230 C2 DE 2332230C2 DE 2332230 A DE2332230 A DE 2332230A DE 2332230 A DE2332230 A DE 2332230A DE 2332230 C2 DE2332230 C2 DE 2332230C2
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Germany
Prior art keywords
wire
capillary
clamp
fastening
stop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2332230A
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German (de)
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DE2332230A1 (en
Inventor
Yuzaburo Sakamoto
Morio Toyooka
Shunichi Kodaira Tokyo Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
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Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to DE2332230A priority Critical patent/DE2332230C2/en
Publication of DE2332230A1 publication Critical patent/DE2332230A1/en
Application granted granted Critical
Publication of DE2332230C2 publication Critical patent/DE2332230C2/en
Expired legal-status Critical Current

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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    • H01L2924/19042—Component type being an inductor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Description

dadurch gekennzeichnet,characterized,

(d) daß die Kapillare (1) und die Klemme (2) unabriirfigig voneinander auf die Befestigungsstelle zu und von dieser wegbewegbar sind,(d) that the capillary (1) and the clamp (2) unabriirfigig each other on the fastening point can be moved to and from this,

(e) daß die der Befestigungsstelle am nächsten liegenden Position der Klemme (2) durch einen Anschlag (7) festgelegt ist,(e) that the position of the clamp (2) which is closest to the fastening point is replaced by a Stop (7) is set,

(f) daß die Klemme (2) so steuerbar ist, daß sie den Draht (10) erfaßt, bevor sie sich von der Befestigungsstelle wegbewegt, und(f) that the clamp (2) is controllable so that it grips the wire (10) before it moves away from the Attachment point moved away, and

(g) daß der Abstand zwischen dem Brenner (12) und der Klemme (2) während der Ausbildung des Kügelchens (13) im wesentlichen gleich ist dem Al'land zwischen der durch den Anschlag (7) festgelegten Position der Klemme (2) und der Befestigungsstelle.(g) that the distance between the torch (12) and the clamp (2) during training of the bead (13) is essentially equal to the Al'land between that caused by the stop (7) fixed position of the clamp (2) and the fastening point.

3535

Die Erfindung bezieht sich auf eine Bondvorrichtung der im Oberbegriff des Patentanspruchs angegebenen Gattung zur Herstellung von elektrischen Drahtverbindungen zwischen Schaltungsteilen. Eine derartige Bondvorrichtung ist aus der deutschen Offenlegung-^- schrift 21 17 625 bekannt.The invention relates to a bonding device as specified in the preamble of the claim Type for the production of electrical wire connections between circuit parts. Such a one Bonding device is from the German disclosure - ^ - publication 21 17 625 known.

Die Arbeitsweise herkömmlicher Bondvorrichtungen dieser Art soll anhand von F i g. 3 erläutert werden. Gemäß Fig.3a läuft der Verbindungsdraht 10 durch eine Klemme 2 und eine darunter befindliche Kapillare 1. Die Klemme 2 ist an einem Klemmenarm 4 angeordnet, der mit einem die Kapillare 1 tragenden Kapillarenarm 3 verbunden und mit diesem zusammen auf- und abwärts bewegbar ist. Am freien Ende des Drahtes 10 ist ein Kügelchen 13 ausgebildet. Unter der Kapillare 1 ist ein Leiterrahmen 15, an dessen einem Teil ein Halbleiterelement 14 vorgesehen ist, verschiebbar angeordnet.The mode of operation of conventional bonding devices of this type is illustrated with reference to FIG. 3 will be explained. According to FIG. 3a, the connecting wire 10 runs through a clamp 2 and a capillary located below it 1. The clamp 2 is arranged on a clamp arm 4, which with a capillary 1 supporting Capillary arm 3 is connected and can be moved up and down with this together. At the free end of the A bead 13 is formed on the wire 10. Under the capillary 1 is a lead frame 15, on one part of which a semiconductor element 14 is provided, arranged displaceably.

Aus der in Fig. 3a gezeigten Stellung wird die Kapillare 1 mit der Klemme 2 in die in F i g. 3b gezeigte Stellung abgesenkt, wobei die Kapillare 1 das Kügelchen 13 mitnimmt und mit dem Halbleiterelement 14 in Berührung bringt. Die Befestigung an dem Halbleiterelement 14 erfolgt durch Wärme und Druck oder Ultraschall.From the position shown in FIG. 3a, the capillary 1 with the clamp 2 is moved into the position shown in FIG. 3b shown Lowered position, the capillary 1 taking the bead 13 with it and with the semiconductor element 14 brings in touch. It is attached to the semiconductor element 14 by means of heat and pressure or ultrasound.

Sodann wird die Kapillare 1 angehoben, der Leiterrahmen 15 wird verschoben, die Kapillare 1 wird erneut abgesenkt, und der Draht 10 wird nun ein zweites Mal an einem weiteren Teil des Leiterrahmens 15 befestigt.Then the capillary 1 is raised, the lead frame 15 is shifted, the capillary 1 becomes lowered again, and the wire 10 is now attached a second time to a further part of the leadframe 15 attached.

nie Kapillare I und die Klemme 2 werden daraufhin in die in F i g- ic gezeigte Stellung angehoben. In dieser Stellung wird die Klemme 2 geschlossen, so daß der Dr.ihi 10 erfaßt wird. Durch weiteres Anheben der Klemme 2 mit der Kapillare 1 wird der Draht 10 an der zweiten Befestigungsslelle abgetrennt Beim weiteren Anheben in die in F i g. 3d gezeigte Stellung gelangt das neu gebildete freie Ende des Drahtes 10 vor einen Brenner 12, der erneut ein Kügelchen 13 anformt. Die Vorrichtung ist nun bereit zur Durchführung des nächsten Bondvorgangs.never capillary I and the terminal 2 are then raised to the position shown in F i g ic position. In this position, clamp 2 is closed so that Dr.ihi 10 is detected. By further lifting the clamp 2 with the capillary 1, the wire 10 is severed at the second fastening clip. In the position shown in 3d, the newly formed free end of the wire 10 arrives in front of a burner 12, which again forms a bead 13. The device is now ready to carry out the next bonding process.

Bei der bekannten Vorrichtung ist es erforderlich, das die Kapillare 1 und die Klemme 2 enthaltende Werkzeug bei der Aufwärtsbewegung im Anschluß an die Herstellung der zweiten Befestigungsstelle in derjenigen Stellung anzuhalten, in der die Klemme 2 den Draht erfaßt und dieser an der zweiten Befestigungsstelle abgetrennt werden soll. Dadurch wird der Arbeitsablauf verzögert Verzichtet man auf die Unterbrechung, so ist der Punkt, an dem die Klemme den Draht während der Aufwärtsbewegung erfaßt, Undefiniert, weil während des Erfassens der Draht zunächst durch die Klemme hindurchrutscht In diesem Fall ist die unterhalb der Kapillare herausragende Drahtlänge nicht konstant, so daß nicht gewährleistet ist daß sich bei Beendigung des Hubvorgangs die Drahtspitze im Bereich des Brenners befindet Je nach der erreichten Stellung kann es also vorkommen, daß an der Drahtspitze kein Kügelchen oder auch ein zu großes Kügelchen angeformt wird. In beiden Fällen kann beim anschließenden Bondvorgang keine einwandfreie Verbindung mehr hergestellt werden.In the known device, it is necessary to stop the tool containing the capillary 1 and the clamp 2 during the upward movement following the production of the second fastening point in that position in which the terminal 2 grips the wire and this is cut off at the second fastening point target. This delays the work flow. If the interruption is omitted, the point at which the clamp grips the wire during the upward movement is undefined because the wire initially slips through the clamp during gripping.In this case, the length of the wire protruding below the capillary is not constant, so that it is not guaranteed that the wire tip is in the area of the burner when the lifting process is completed. In both cases, it is no longer possible to establish a proper connection during the subsequent bonding process.

Der Erfindung liegt die Aufgabe zugrunde, eine Bondvorrichtung der eingangs bezeichneten Gattung zu schaffen, die bei hoher Arbeitsgeschwindigkeit in der Lage ist, zwischen den einzelnen Bondvorgängen am jeweils freien Ende des Drahtes Kügelchen genau definierter Größe auszubilden.The invention is based on the object of providing a bonding device of the type indicated at the beginning create, which is able to work at high speed between the individual bonding processes on the each free end of the wire to form beads of precisely defined size.

Die erfindungsgemäße Lösung dieser Aufgabe ist im Kennzeichenteil des Patentanspruchs angegeben. Dadurch, daß Kapillare und Klemme unabhängig voneinander bewegbar sind und die Klemme derart steuerbar ist, daß sie den Draht erfaßt, bevor sie sich von der Befestigungsstelle wegbewegt wird erreicht, daß die Klemme im stationären Zustand und somit ohne Schlupf den Draht erfassen kann, ohne daß dabei Zeit verloren geht, da sich gleichzeitig die Kapillare von der Befestigungsstelle wegbewegen und dabei eine entsprechende Drahtlänge freigeben kann. Dadurch, daß die der Befestigungsstelle am nächsten liegende Position der Klemme durch einen Anschlag festgelegt ist, und durch die im kennzeichnenden Merkmal (f) des Anspruchs angegebenen Abstandsverhältnisse wird ferner erreicht, daß nach dem Abtrennen des Drahtes von der jeweils zweiten Befestigungsstelle jedes Bondvorgangs der Draht mit einer genau festgelegten Länge aus der Kapillare herausragt und dadurch sein freies Ende genau in den Bereich des Brenners gebracht wird, so daß jedes Mal ein Kügelchen genau definierter Größe erzeugt wird.The inventive solution to this problem is given in the characterizing part of the claim. Through this, that capillary and clamp can be moved independently of one another and the clamp can be controlled in this way is that it grips the wire before it moves away from the attachment site achieves that The clamp can grasp the wire in the stationary state and thus without slippage, without losing any time goes, because at the same time the capillary move away from the attachment point and thereby a corresponding Wire length can release. In that the position closest to the fastening point the terminal is fixed by a stop, and by the characterizing feature (f) of the claim specified spacing ratios is also achieved that after separating the wire from the each second fastening point of each bonding process the wire with a precisely defined length from the Capillary protrudes and thereby its free end is brought exactly into the area of the burner, so that each time a bead of a precisely defined size is produced.

Ein Ausführungsbeispiel der Erfindung wird nachstehend anhand der F i g. 1 und 2 erläutert, wobeiAn exemplary embodiment of the invention is described below with reference to FIGS. 1 and 2 explained, wherein

F i g. 1 eine schematische Seitenansicht und dieF i g. 1 is a schematic side view and FIG

Fig. 2a bis 2d in ähnlicher Weise wie die oben erläuterten Fig.3a bis 3d den Arbeitsablauf der Vorrichtung nach Fig. 1 erläutern.2a to 2d in a manner similar to the above-explained FIGS. 3a to 3d the workflow of the Explain the device according to FIG.

In den Fig. 1 und 2 sind die gleichen Bezugszeichen wie in Fig.3 zur Bezeichnung entsprechender TeileIn FIGS. 1 and 2, the same reference numerals as in FIG. 3 are used to designate corresponding parts

verwendet. Über die anhand von Fig.3 erläuterten Einzelheiten hinaus sind in F i g. 1 noch ein am Kapillararm 3 vorgesehener Vorsprung 5 und ein am Klemmenarm 4 vorgesehener Vorsprung 6 gezeigt, wobei diese Vorsprünge 5 und 6 einander gegenüber stehen. Zwischen dem Kapillarenarm 3 und dem Klemmenarm 4 ist femer ein Anschlag 7 angeordnet, dessen Stellung frei einstellbar ist Oberhalb des Klemmenarms 4 ist ein frei drehbares Führungsrad 8 angeordnet, über das der beispielsweise aus Gold oder Aluminium bestehende Draht 10 von einer Vorratsspule 9 zugeführt wird. Eine Zugfeder 11 sorgt für die Spannung des Drahtes 10.used. About the explained with reference to Figure 3 Details are also given in FIG. 1 a projection 5 provided on the capillary arm 3 and a projection on the Clamp arm 4 provided projection 6 shown, these projections 5 and 6 opposite one another stand. A stop 7 is also arranged between the capillary arm 3 and the clamp arm 4, the position of which is freely adjustable. Above the clamp arm 4 is a freely rotatable guide wheel 8 arranged over the, for example, made of gold or Aluminum existing wire 10 is fed from a supply reel 9. A tension spring 11 takes care of the Wire tension 10.

In Fig.2a ist ähnlich wie in der oben beschriebenen F i g. 3a der Ausgangszustand vor Durchführung eines Bondvorgangs gezeigt.In Fig.2a is similar to that described above F i g. 3a shows the initial state before a bonding process is carried out.

Gemäß Fig.2b wird die Kapillare 1 auf die Befestigungsstelle zu nach unten bewegt, wobei sie das am Drahtende vorgesehene Kügelchen 13 auf das Halbleiterelement 14 drückt und eine Befestigung des Drahtes unter Druck und Wärme bewirkt Bei dieser Abwärtsbewegung der Kapillare 1 wird der sich nach unten bewegende Klemmenarm 4 durch den Anschlag 7 angehalten. Im Anschluß an die Herstellung der Befestigung mit dem Halbleiterelement 14 erfolgt eine zweite Befestigung des Drahtes 10 an einer Stelle des Leiterrahmens 15 in ähnlicher Weise, wie dies anhand von F i g. 3 beschrieben wurde. Beim zweiten Befestigungsschritt wird die Kapillare 1 auf dem Leiterrahmen 15 ein kurzes Stück bewegt, so daß ein zusätzlicher Befestigungsteil 16 gebildet wird, durch den die Verbindung derart verstärkt wird, daß sich der Draht während des anschließenden Abtrennens nicht lösen kann. Besteht eine solche Gefahr nicht, so reicht ein einzelner Verbindungspunkt zwischen dem Draht 10 und dem Leiterrahmen 15 aus.According to FIG. 2b, the capillary 1 is moved downwards towards the fastening point, with the At the end of the wire provided beads 13 presses on the semiconductor element 14 and a fastening of the Wire under pressure and heat causes this downward movement of the capillary 1 which is The clamp arm 4 moving down is stopped by the stop 7. Following the production of the Fastening with the semiconductor element 14 takes place a second fastening of the wire 10 at a point of the Lead frame 15 in a manner similar to that shown in FIG. 3 has been described. At the second fastening step the capillary 1 is moved a short distance on the lead frame 15, so that an additional Fastening part 16 is formed, through which the connection is reinforced so that the wire cannot solve during the subsequent disconnection. If there is no such risk, submit single connection point between the wire 10 and the lead frame 15.

Im Anschluß an diesen zweiten Befestigungsschritt wird die Kapillare 1 von der Befestigungsstelle vertikal nach oben angehoben, wobei der Kapillarenarm 3 an der in F i g. 2c gezeigten Stelle mit seinem Vorsprung 5 auf den Vorsprung 6 des Klemmenarms 4 trifft und diesen nach oben mitnimmtFollowing this second fastening step, the capillary 1 becomes vertical from the fastening point lifted upwards, the capillary arm 3 at the in F i g. 2c with its projection 5 meets the projection 6 of the clamp arm 4 and takes it upwards

Die Klemme 2 ergreift den Draht 10, während sich die Kapillare 1 von der Befestigungsstelle nach oben bewegt jedoch bevor der Vorsprung 5 den Vorsprung 6 berührt das heißt bevor sich die Klemme 2 selbst von der Befestigungsstelle weg nach oben bewegt Dadurch, daß die Klemme 2 nach oben mitgenommen wird, nachdem sie den Draht erfaßt hat wird dieser an der Befestigungsstelle abgetrenntThe clamp 2 grips the wire 10 while the capillary 1 extends upward from the attachment point however, before the projection 5 contacts the projection 6, that is, before the clamp 2 moves away from itself moved away from the fastening point that the terminal 2 is taken up after it has grasped the wire is this at the Separated fastening point

Die Klemme 2 und die Kapillare 1 bewegen sich nun in die in F i g. 2d gezeigte Ausgangsstellung nach oben, wobei sie ihre relative Stellung beibehalten. In der Endstellung befindet sich das freie Ende des Drahtes 10 auf der Höhe des Brenners 12, der während der Aufwärtsbewegung der Kapillare 1 unter diese bewegt wird, um das Kügelchen 13 auszubilden. Dabei ist der Brenner 12 so eingestellt daß sein Abstand von der Klemme 2 im angehobenen Zustand, das heißt während der Ausbildung des Kügeichens, gleich ist dem Abstand zwischen dem Anschlag 7 und der Drahtbefestigungsstelle. The clamp 2 and the capillary 1 now move into the position shown in FIG. 2d starting position upwards, maintaining their relative position. The free end of the wire 10 is in the end position at the level of the burner 12, which moves the capillary 1 under this during the upward movement to form the bead 13. The burner 12 is set so that its distance from the Terminal 2 in the raised state, that is, during the formation of the Kügeichens, is the same as the distance between the stop 7 and the wire attachment point.

Somit wird das freie Ende des Drahtes 10 stets in der richtigen Stellung angehalten, in die die Flamme des Brenners 12 gelangt. Da die Größe des am DrahtendeThus, the free end of the wire 10 is always stopped in the correct position in which the flame of the Burner 12 arrives. Because the size of the end of the wire

-5 geformten Kügeichens stets gleich ist, werden gleichmäßige Verbindungen mit den Halbleiterelementen 14 hergestellt.- 5 shaped Kügeichens is always the same, even connections with the semiconductor elements 14 are made.

Bei der hier beschriebenen Vorrichtung braucht die Hubbewegung der Kapillare 1 nicht unterbrochen werden, da die Klemme 2 den Draht ergreift, während sich die Kapillare 1 unabhängig von der Klemme 2 nach oben bewegt.In the device described here, the lifting movement of the capillary 1 does not need to be interrupted because the clamp 2 grips the wire, while the capillary 1 follows independently of the clamp 2 moved up.

Die Länge des Drahtes 10 unterhalb der Kapillare 1 kann durch entsprechende Verstellung des Anschlags 7 verändert werden. Dabei sollte auch die Stellung des Klemmenarms 4 oder die des Brenners 12 entsprechend der Stellung des Anschlags 7 geändert werden. Ferner kann die Größe des am Drahtende gebildeten Kügeichens 13 durch geringfügige Änderung vier Stellung des Anschlags 7 verändert werden.The length of the wire 10 below the capillary 1 can be adjusted by adjusting the stop 7 accordingly to be changed. The position of the clamp arm 4 or that of the burner 12 should also be appropriate the position of the stop 7 can be changed. Furthermore, the size of the formed at the wire end Kügeichens 13 can be changed four position of the stop 7 by a slight change.

Hierzu 1 Blatt Zeichnungen1 sheet of drawings

Claims (1)

Patentanspruch:Claim: Bondvorrichtung zur Herstellung vdh eiekirisehen Drahtverbindungen zwischen Schaluingsici len, umfassend,Bonding device for manufacturing vdh eiekirisehen Wire connections between Schaluingsici len, comprehensive, (a) eine Kapillare (1) zur Führung des Drahtes (10) und zur Befestigung desselben an dem jeweiligen Schaltungsteil (14,15),(A) a capillary (1) for guiding the wire (10) and for fastening it to the respective one Circuit part (14,15), (b) eine oberhalb der Kapillare (1) angeordnete ,,, Klemme (2) zum Festhalten des Drahtes (10) und Abtrennen desselben durch Entfernen der Klemme von der Befestigungsstelle, und(b) a above the capillary (1) arranged ,,, Clamp (2) for holding the wire (10) and severing it by removing the Clamp from attachment point, and (c) einen Brenner (12) zur Ausbildung eines Kügelchens (13) am freien Ende des Drahtes f5 (10),(c) a burner (12) for forming a bead (13) at the free end of the wire f5 (10),
DE2332230A 1973-06-25 1973-06-25 Bonding device Expired DE2332230C2 (en)

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Application Number Priority Date Filing Date Title
DE2332230A DE2332230C2 (en) 1973-06-25 1973-06-25 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2332230A DE2332230C2 (en) 1973-06-25 1973-06-25 Bonding device

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DE2332230A1 DE2332230A1 (en) 1975-01-09
DE2332230C2 true DE2332230C2 (en) 1983-05-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3447657A1 (en) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München WIRE CLAMPING DEVICE

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950536A (en) * 1982-09-16 1984-03-23 Toshiba Corp Wire bonding device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2117625C3 (en) * 1971-04-10 1975-04-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Semiconductor contacting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3447657A1 (en) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München WIRE CLAMPING DEVICE

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