DE2265274C2 - Hochspannungs-Halbleitergleichrichter - Google Patents

Hochspannungs-Halbleitergleichrichter

Info

Publication number
DE2265274C2
DE2265274C2 DE2265274A DE2265274A DE2265274C2 DE 2265274 C2 DE2265274 C2 DE 2265274C2 DE 2265274 A DE2265274 A DE 2265274A DE 2265274 A DE2265274 A DE 2265274A DE 2265274 C2 DE2265274 C2 DE 2265274C2
Authority
DE
Germany
Prior art keywords
glass
thermal expansion
semiconductor
stack
semiconductor wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2265274A
Other languages
German (de)
English (en)
Other versions
DE2265274A1 (de
Inventor
Takeshi Ishizuka
Takeshi Hitachi Sasaki
Kensuke Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE2265274A1 publication Critical patent/DE2265274A1/de
Application granted granted Critical
Publication of DE2265274C2 publication Critical patent/DE2265274C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
DE2265274A 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter Expired DE2265274C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46076360A JPS5116264B2 (enrdf_load_stackoverflow) 1971-10-01 1971-10-01

Publications (2)

Publication Number Publication Date
DE2265274A1 DE2265274A1 (de) 1977-04-07
DE2265274C2 true DE2265274C2 (de) 1984-01-12

Family

ID=13603176

Family Applications (3)

Application Number Title Priority Date Filing Date
DE2265274A Expired DE2265274C2 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter
DE2265208A Expired DE2265208C2 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter
DE2247159A Expired DE2247159C3 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE2265208A Expired DE2265208C2 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter
DE2247159A Expired DE2247159C3 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter

Country Status (3)

Country Link
JP (1) JPS5116264B2 (enrdf_load_stackoverflow)
CA (1) CA987790A (enrdf_load_stackoverflow)
DE (3) DE2265274C2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4417164C1 (de) * 1994-05-17 1995-06-22 Bosch Gmbh Robert Hochspannungskippdiode insb. geeignet als Zündspannungsverteiler eines Verbrennungsmotors

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150664A (en) * 1974-10-30 1976-05-04 Hitachi Ltd Handotaisochino seizohoho
JPS53975A (en) * 1976-06-25 1978-01-07 Hitachi Ltd Glass-sealed type semiconductor device
JPS54978A (en) * 1977-06-06 1979-01-06 Hitachi Ltd Semiconductor device of glass seal type
JPS53115023A (en) * 1978-02-14 1978-10-07 Sharp Corp Preparing high voltage rectifier
JPS58176957A (ja) * 1982-04-12 1983-10-17 Hitachi Ltd ガラスモ−ルド型半導体装置
JPS58163013U (ja) * 1982-04-26 1983-10-29 株式会社日立製作所 多チヤンネル音響機器のフアンクシヨン間音もれ防止回路
JPS59102130U (ja) * 1982-12-28 1984-07-10 株式会社高岳製作所 容器の除湿装置
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
JP4363467B2 (ja) 2007-07-05 2009-11-11 ソニー株式会社 蛍光体とこれを用いた蛍光ランプ、並びに、蛍光ランプを用いた表示装置及び照明装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL190331A (enrdf_load_stackoverflow) * 1954-08-26 1900-01-01
DE1303509B (enrdf_load_stackoverflow) * 1959-09-22 1972-07-13 Carman Laboratories Inc
US3363150A (en) * 1964-05-25 1968-01-09 Gen Electric Glass encapsulated double heat sink diode assembly
NL129867C (enrdf_load_stackoverflow) 1964-08-07 1900-01-01
CH497790A (de) * 1967-11-15 1970-10-15 Mitsubishi Electric Corp Halbleiterelement
US3559002A (en) * 1968-12-09 1971-01-26 Gen Electric Semiconductor device with multiple shock absorbing and passivation layers
DE1939900A1 (de) * 1969-08-06 1971-02-18 Licentia Gmbh Selengleichrichter mit einem oder mehreren Plattenstapeln
US3771025A (en) * 1969-10-02 1973-11-06 Gen Electric Semiconductor device including low impedance connections

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4417164C1 (de) * 1994-05-17 1995-06-22 Bosch Gmbh Robert Hochspannungskippdiode insb. geeignet als Zündspannungsverteiler eines Verbrennungsmotors

Also Published As

Publication number Publication date
JPS5116264B2 (enrdf_load_stackoverflow) 1976-05-22
DE2247159C3 (de) 1985-06-20
DE2265208A1 (de) 1976-12-23
DE2265274A1 (de) 1977-04-07
CA987790A (en) 1976-04-20
JPS4843278A (enrdf_load_stackoverflow) 1973-06-22
DE2247159A1 (de) 1973-04-12
DE2247159B2 (de) 1977-04-21
DE2265208C2 (de) 1981-12-24

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Legal Events

Date Code Title Description
8181 Inventor (new situation)

Free format text: SUZUKI, KENSUKE ISHIZUKA, TAKESHI SASAKI, TAKESHI, HITACHI, JP

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D2 Grant after examination
8363 Opposition against the patent
8331 Complete revocation