JPS53115023A - Preparing high voltage rectifier - Google Patents

Preparing high voltage rectifier

Info

Publication number
JPS53115023A
JPS53115023A JP1627378A JP1627378A JPS53115023A JP S53115023 A JPS53115023 A JP S53115023A JP 1627378 A JP1627378 A JP 1627378A JP 1627378 A JP1627378 A JP 1627378A JP S53115023 A JPS53115023 A JP S53115023A
Authority
JP
Japan
Prior art keywords
high voltage
voltage rectifier
preparing high
molded layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1627378A
Other languages
Japanese (ja)
Inventor
Saburo Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1627378A priority Critical patent/JPS53115023A/en
Publication of JPS53115023A publication Critical patent/JPS53115023A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE: To uniformly construct an insulation molded layer, by means of providing a first molded layer with its both ends smoothly formed into a curved line, further providing a second molded layer for lengthening a distanc along the surfaces, in the high voltage rectifier of layer-built type.
COPYRIGHT: (C)1978,JPO&Japio
JP1627378A 1978-02-14 1978-02-14 Preparing high voltage rectifier Pending JPS53115023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1627378A JPS53115023A (en) 1978-02-14 1978-02-14 Preparing high voltage rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1627378A JPS53115023A (en) 1978-02-14 1978-02-14 Preparing high voltage rectifier

Publications (1)

Publication Number Publication Date
JPS53115023A true JPS53115023A (en) 1978-10-07

Family

ID=11911930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1627378A Pending JPS53115023A (en) 1978-02-14 1978-02-14 Preparing high voltage rectifier

Country Status (1)

Country Link
JP (1) JPS53115023A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499284U (en) * 1991-01-16 1992-08-27

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4830877A (en) * 1971-08-24 1973-04-23
JPS4843278A (en) * 1971-10-01 1973-06-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4830877A (en) * 1971-08-24 1973-04-23
JPS4843278A (en) * 1971-10-01 1973-06-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499284U (en) * 1991-01-16 1992-08-27

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