DE2246208A1 - Verfahren zur herstellung von gedruckten schaltungen - Google Patents
Verfahren zur herstellung von gedruckten schaltungenInfo
- Publication number
- DE2246208A1 DE2246208A1 DE19722246208 DE2246208A DE2246208A1 DE 2246208 A1 DE2246208 A1 DE 2246208A1 DE 19722246208 DE19722246208 DE 19722246208 DE 2246208 A DE2246208 A DE 2246208A DE 2246208 A1 DE2246208 A1 DE 2246208A1
- Authority
- DE
- Germany
- Prior art keywords
- adhesive
- base
- circuit
- embossing
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 53
- 239000000853 adhesive Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 28
- 238000004049 embossing Methods 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 238000000748 compression moulding Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 8
- 239000012948 isocyanate Substances 0.000 description 7
- 150000002513 isocyanates Chemical class 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18285971A | 1971-09-22 | 1971-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2246208A1 true DE2246208A1 (de) | 1973-03-29 |
Family
ID=22670358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19722246208 Pending DE2246208A1 (de) | 1971-09-22 | 1972-09-21 | Verfahren zur herstellung von gedruckten schaltungen |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS4839972A (enExample) |
| DE (1) | DE2246208A1 (enExample) |
| FR (1) | FR2153383A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2556756A1 (de) * | 1975-12-17 | 1977-07-07 | Kabel Metallwerke Ghh | Basismaterial fuer flexible gedruckte schaltungen |
| EP0113763A4 (en) * | 1982-07-12 | 1984-11-16 | Motorola Inc | Lead frame and method. |
| WO1993009655A1 (de) * | 1991-10-31 | 1993-05-13 | Hüls Troisdorf Aktiengesellschaft | Verfahren zur herstellung einer gedruckten schaltung sowie gedruckte schaltung |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2455422A1 (fr) * | 1979-04-23 | 1980-11-21 | Castanet Raymond | Dispositif pour l'obtention de circuits imprimes |
| US5286231A (en) * | 1992-03-26 | 1994-02-15 | Kop-Flex, Inc. | Flexible elastomer coupling element |
-
1972
- 1972-09-21 DE DE19722246208 patent/DE2246208A1/de active Pending
- 1972-09-21 FR FR7233499A patent/FR2153383A1/fr not_active Withdrawn
- 1972-09-22 JP JP9470672A patent/JPS4839972A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2556756A1 (de) * | 1975-12-17 | 1977-07-07 | Kabel Metallwerke Ghh | Basismaterial fuer flexible gedruckte schaltungen |
| EP0113763A4 (en) * | 1982-07-12 | 1984-11-16 | Motorola Inc | Lead frame and method. |
| WO1993009655A1 (de) * | 1991-10-31 | 1993-05-13 | Hüls Troisdorf Aktiengesellschaft | Verfahren zur herstellung einer gedruckten schaltung sowie gedruckte schaltung |
| US5560795A (en) * | 1991-10-31 | 1996-10-01 | Philips Electronics N.V. | Process for manufacturing a printed circuit board and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4839972A (enExample) | 1973-06-12 |
| FR2153383A1 (enExample) | 1973-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2820098B1 (de) | Verwendung eines latentreaktiven klebefilms zur verklebung von eloxiertem aluminium mit kunststoff | |
| DE69905280T2 (de) | Verfahren zur herstellung einer chipkarte | |
| DE2421475A1 (de) | Klebeschichtstoff | |
| DE102016007217B4 (de) | Mehrschichtverbund, Verfahren zu seiner Herstellung und seine Verwendung | |
| CH646280A5 (de) | Verfahren zur herstellung von verbindungszwischenstuecken. | |
| EP0012862A2 (de) | Verfahren zur stromlosen Metallisierung einer isolierenden Unterlage | |
| DE2246208A1 (de) | Verfahren zur herstellung von gedruckten schaltungen | |
| EP0285900A2 (de) | Verfahren zur Herstellung gedruckter Schaltungen | |
| DE2918923C2 (de) | Schichtstoff mit einer Polyvinylidenfluoridschicht | |
| EP1078965B1 (de) | Thermoaktivierbare Haftklebefolie und Verfahren zur Herstellung struktureller Klebverbindungen | |
| EP0050096A1 (de) | Verfahren zum Verkleben von Gegenständen mit härtbaren Klebstoffen | |
| DE102023101310B4 (de) | Verfahren zur Herstellung eines Hybridbauteils | |
| DE808476C (de) | Verfahren zum Verbinden von Flaechen | |
| DE3422965A1 (de) | Verfahren zur herstellung von mit einem oberflaechenschutz versehenen schichtstoffplatten oder -folien | |
| WO1998018877A1 (de) | Verkleben von hartschaumteilen | |
| DE2819576A1 (de) | Verfahren zur herstellung einer flaechigen verbindung zwischen zwei oberflaechen | |
| EP0218168B1 (de) | Transferdruckverfahren | |
| EP0392297A1 (de) | Verfahren zum Verbinden flächenhafter Gebilde mittels wärmeaktivierbarer Klebefolie | |
| EP0816051B1 (de) | Kaschierverfahren und Vorrichtung zum Ausführen des Verfahrens | |
| DE1933737A1 (de) | Magnetaufzeichnungsgeraet und Verfahren zu seiner Herstellung | |
| DE102011000336B4 (de) | Verfahren zur Herstellung eines Formteils mittels Tiefziehen | |
| EP1022370A2 (de) | Verfahren zur Herstellung oberflächenveredelter Faservliesformteile | |
| DE838713C (de) | Schichtplatte mit gegen Druck bestaendiger Oberflaechenpraegung, insbesondere Gaufrier-, Druck- oder aehnliche Platte | |
| DE10026270C1 (de) | Verfahren zum Laminieren einer Leiterplatte auf eine Grundplatte und Laminiervorrichtung | |
| DE2832024A1 (de) | Verfahren zur herstellung eines schichtstoffs mit klebstoffueberzug |