DE2238121C3 - Verfahren zum Bilden von flachen Oberseiten an drahtförmigen Stromleitern, die durch den Glasboden der Grundplatte eines Bauelementengehäuses geführt sind - Google Patents
Verfahren zum Bilden von flachen Oberseiten an drahtförmigen Stromleitern, die durch den Glasboden der Grundplatte eines Bauelementengehäuses geführt sindInfo
- Publication number
- DE2238121C3 DE2238121C3 DE2238121A DE2238121A DE2238121C3 DE 2238121 C3 DE2238121 C3 DE 2238121C3 DE 2238121 A DE2238121 A DE 2238121A DE 2238121 A DE2238121 A DE 2238121A DE 2238121 C3 DE2238121 C3 DE 2238121C3
- Authority
- DE
- Germany
- Prior art keywords
- base plate
- wire
- glass bottom
- guided
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 title claims description 27
- 239000011521 glass Substances 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 10
- 238000003825 pressing Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000002349 favourable effect Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/50—Means forming part of the tube or lamps for the purpose of providing electrical connection to it
- H01J5/54—Means forming part of the tube or lamps for the purpose of providing electrical connection to it supported by a separate part, e.g. base
- H01J5/62—Connection of wires protruding from the vessel to connectors carried by the separate part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7111031A NL7111031A (US20060009399A1-20060112-C00042.png) | 1971-08-11 | 1971-08-11 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2238121A1 DE2238121A1 (de) | 1973-03-01 |
| DE2238121B2 DE2238121B2 (de) | 1980-07-10 |
| DE2238121C3 true DE2238121C3 (de) | 1981-05-27 |
Family
ID=19813785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2238121A Expired DE2238121C3 (de) | 1971-08-11 | 1972-08-03 | Verfahren zum Bilden von flachen Oberseiten an drahtförmigen Stromleitern, die durch den Glasboden der Grundplatte eines Bauelementengehäuses geführt sind |
Country Status (7)
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601911A (ja) * | 1983-06-17 | 1985-01-08 | Kanagawa Seisakusho:Kk | 水晶振動子の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3186065A (en) * | 1960-06-10 | 1965-06-01 | Sylvania Electric Prod | Semiconductor device and method of manufacture |
| US3199967A (en) * | 1960-08-17 | 1965-08-10 | Haveg Industries Inc | Method of producing hermetic seal |
| US3324357A (en) * | 1964-01-29 | 1967-06-06 | Int Standard Electric Corp | Multi-terminal semiconductor device having active element directly mounted on terminal leads |
| US3257708A (en) * | 1965-04-05 | 1966-06-28 | Ibm | Substrate with contact pins and method of making same |
-
1971
- 1971-08-11 NL NL7111031A patent/NL7111031A/xx not_active Application Discontinuation
-
1972
- 1972-08-03 DE DE2238121A patent/DE2238121C3/de not_active Expired
- 1972-08-08 GB GB3689472A patent/GB1395226A/en not_active Expired
- 1972-08-08 IT IT69584/72A patent/IT964899B/it active
- 1972-08-08 US US00278735A patent/US3798761A/en not_active Expired - Lifetime
- 1972-08-10 JP JP8031172A patent/JPS5329271B2/ja not_active Expired
- 1972-08-11 FR FR7229083A patent/FR2148622B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL7111031A (US20060009399A1-20060112-C00042.png) | 1973-02-13 |
| GB1395226A (en) | 1975-05-21 |
| US3798761A (en) | 1974-03-26 |
| JPS5329271B2 (US20060009399A1-20060112-C00042.png) | 1978-08-19 |
| JPS4826472A (US20060009399A1-20060112-C00042.png) | 1973-04-07 |
| FR2148622A1 (US20060009399A1-20060112-C00042.png) | 1973-03-23 |
| FR2148622B1 (US20060009399A1-20060112-C00042.png) | 1977-08-26 |
| DE2238121B2 (de) | 1980-07-10 |
| DE2238121A1 (de) | 1973-03-01 |
| IT964899B (it) | 1974-01-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AT502005B1 (de) | Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement | |
| DE102005049235B4 (de) | Schalter und Verfahren zum Herstellen desselben | |
| DE112011102437B4 (de) | Klemmverbindungsstruktur und Verfahren zum Herstellen derselben | |
| DE1279799B (de) | Verfahren zum Herstellen eines Isolierkoerpers mit nach aussen fuehrenden Anschluessen | |
| DE2506796C3 (de) | Verfahren zur Herstellung eines Kontaktorganes für eine Mehrfachsteckkontaktdose | |
| DE2502214A1 (de) | Verfahren zur herstellung von laminierten sammelschienen | |
| DE102013017168A1 (de) | Vorrichtung zum elektrischen Verbinden mehrerer Rundzellen sowie dazugehöriges Batteriemodul und Verfahren | |
| WO2019092037A1 (de) | Verfahren zum herstellen einer kontaktplatte für einen batteriestapel, kontaktplatte für einen batteriestapel sowie batteriestapel | |
| DE2454605C2 (de) | Halbleiterbauelement | |
| EP2437360B1 (de) | Stockwerksbrücker | |
| DE2238121C3 (de) | Verfahren zum Bilden von flachen Oberseiten an drahtförmigen Stromleitern, die durch den Glasboden der Grundplatte eines Bauelementengehäuses geführt sind | |
| DE1188209B (de) | Halbleiterbauelement | |
| DE102012205969A1 (de) | Sensorvorrichtung | |
| DE102016202873A1 (de) | Verfahren zur Herstellung eines elektrischen Verbindungselements und Verbindungselement für Batteriezellen | |
| DE102019126012A1 (de) | Schweißverfahren | |
| DE1277446B (de) | Verfahren zum Herstellen von Halbleiterbauelementen mit vollstaendig gekapseltem Halbleiterelement | |
| DE2757821C3 (de) | Verfahren zur Herstellung einer Mesa-Halbleiteranordnung mit Druckkontakt | |
| DE1514881C3 (de) | Verfahren zum Kontaktieren eines Halbleiterbauelementes | |
| DE4126219C2 (US20060009399A1-20060112-C00042.png) | ||
| DE3142692A1 (de) | Kontakt-schweissverbindung und verfahren zur herstellung | |
| DE102023129060A1 (de) | Anschlussklemme | |
| DE202022003039U1 (de) | Mehrlagiges Blechbauteil | |
| DE2909214C2 (de) | Verfahren zum Herstellen eines Polschuhs für elektrische Maschinen | |
| DE102022132312A1 (de) | Verfahren zum Herstellen mehrlagiger teilflexibler Blechbauteile | |
| EP1263117B1 (de) | Verfahren zur Herstellung einer Ankerwicklung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| C3 | Grant after two publication steps (3rd publication) | ||
| 8339 | Ceased/non-payment of the annual fee |