DE2228345A1 - ARRANGEMENT OF INTEGRATED CIRCUITS AND POWER SUPPLY CABLES ON CIRCUIT BOARDS - Google Patents

Description

Arrangement of integrated circuits and power supply lines on printed circuit boards The invention relates to an arrangement of integrated circuits and supply lines on printed circuit boards.

It is known as integrated circuits called DIP on a sub-base in rows and the supply lines between these rows to arrange.

The supply lines that supply the integrated circuits with operating voltage and feed earth are usually designed as trunk lines. The individual branches are dimensioned as wide as the integrated ones for the purpose of sufficient current stability Circuits themselves. For example, the width of known branches is 0.782 cm, whereas the recommended minimum distance between the DIPs is 0.254 cm; per DIP row So 0.28 cm could be saved if the lieiterplatte was redesigned. Since the supply line has a trunk line and a branch for each DIP row has, the supply line actually takes more in known arrangements Place on the circuit board as the DIPs. If the DIP rows with the minimum spacing It would be possible to use the size of the circuit board for a given Reduce circuitry or the number of circuits on a printed circuit board to increase significantly.

The invention is based on the object of integrated circuits (DISs) and supply lines to be arranged on printed circuit boards in such a way that the rows of integrated circuits are close together and between the Rows of the integrated circuits do not have a spatial distance for the assigned Branches of the supply lines is required. The object is according to the invention solved by the fact that the integrated circuits of each row, the connecting wires extending down from a housing, over a branch of the utility line are arranged. Here, each branch of the supply line can also act as a heat conductor serve, which of overheated areas of the integrated circuits above it Carries away heat. The arrangement according to the invention designed a versatile, space-saving and economic training of those equipped with integrated circuits (DIP) Printed circuit boards.

In the arrangement according to the invention, the terminals for connection the supply line with the integrated circuits as breakthroughs in the Be formed circuit board, in each of which a connection wire of the supply line and the integrated circuit can be plugged in. The openings can be in parallel Lines, two lines per row of integrated circuits, if space is limited Spacing of the rows, be grouped.

Each branch of the supply line can be sandwiched so that several lines are superimposed and separated by insulation are. One of the lines 3 of the branch can have a U-shaped cross section, while the other line between the parallel arch elements and is thus shielded.

In the drawings are several embodiments according to the invention shown. 1 shows a plan view of a known printed circuit board Supply lines and integrated circuits, Fig. 2 is a view in section - lengthways the stepped line II-II of Fig. 1, Fig. 3 is a plan view an inventive arrangement of the supply line and integrated circuits on a printed circuit board, Fig. 4 is a view in section along the step-like Line IV-IV of FIG. 3 ', FIG. 5 shows a view in section of a further embodiment the supply line, Fig. 6 is a plan view of a portion of a third Execution of the supply lines, FIG. 7 a view in section along the plane Vil-VIl of FIG. 6, FIG. 8 shows a plan view of a section of a further arrangement for the wire to guides the integrated circuits and the supply lines.

The known arrangement 10 shown in FIGS. 1 and 2 consists from a circuit board 11 of conventional design, which has a plurality of tongues 12 both sides has one of its edges, one of which is printed conductor 13 lead away from the edge and to the connections 14, which are designed as mounting holes which are arranged in parallel lines; åEach line shows two times 7 Holes å exeils evenly spaced from each other. Two at distance A next to each other lying lines form a row; there is a distance B between two rows.

Normally the distances A and B are the same.

The supply line 15 has a strip-shaped trunk 16 with several branches 17 extending between the rows of holes 14. The supply line 15 also has a grounded conductor 18 in each Branch 17. The conductor 18 has several wire connections 19, from the right Go out edge and into the respective holes 14, normally the lower left hole of each set can be inserted into the circuit board 11. In addition, the Supply line 15 is a voltage bus that carries the supply current 20 in the branches 17 and the trunk 16, with several spaced apart Connecting wires 21 from the left side of the branches into a different hole 14, usually the top right hole of each set, run in the circuit board. The ground bus 18 and that of the voltage bus 20 are covered by an insulating layer 22 isolated from each other. Lay the various branches 17 of the supply line 15 each set of holes 14 to ground and voltage across lines 18 and 20 and the Connection wires 19 and 21.

The known arrangement 10 has integrated circuits 23 which consist of dual-in-line packages or DIPs.

These DIPs have a body 24 that contains electrical elements 25, of which several wire terminals 26, usually in groups of 6 or 7 per Side, from the sides outwards and downwards and into the connection # och 14 of the circuit board 11 can be added. The DIPs 23 are between the branches 17 of the power supply bus arranged and one of these branches 17 is supplied each DIP 23 with power. The branch 17 lying next to it on the left-hand side closes the relevant DIP 23 to earth.

The branches 17 are normally just as wide as the DIPs 23, i. 0.782 cm. Due to the nature of the branches 17, the supply line requires 15 more space on the circuit board 11 than the DIPs 23, since they have so many branches 17 how rows of integrated circuits 23 are provided plus a branch 17 must have.

This is an undesirable waste of space, since this is it Space used to accommodate a larger number of the more important DIPs could be.

When on the printed circuit board-11 the branches of the supply line could be removed from the spaces between the DIP rows, the rows could of the DIPs are moved closer to each other, i.e. up to the recommended minimum 0.254 cm so that each printed circuit board can accommodate a larger number of DIPs In contrast to the known arrangement of FIGS. 1 and 2, FIG Arrangement 30 according to the invention (FIG. 3) the DIP rows 23 by omitting the branches 17 of the supply line 15 between the rows of DIPs 23 approached one another.

In the assembly 30, a printed circuit board 31 carries connections 34 in parallel lines and two lines per row of integrated circuits 23. The lines of adjacent rows are at a close distance a to one another. The branches 40 of the supply line are within of space A between parallel lines of connections 34 each one and the same row integrated Circuits arranged. Each branch 40 includes a ground line 33 and a voltage bus line 43 (Fig. 4).

In another embodiment, a ground line 48 surrounds the utility line 52 (FIG. 5) and, in a further embodiment, there are two supply lines 60 and 62, which carry two different electrical potentials, next to an earth bus 58 provided (Fig. 7).

The circuit board 31 shown in Fig. 5 of the arrangement 30 according to the invention has several tongues 32 on either side of an edge, which of these outgoing printed lines 33 lead to terminals 34.

The connections 54 are in the embodiments shown in FIGS designed as holes 35 and, in the embodiment shown in FIG. 8, as connection surfaces 36.

The holes 35 are uniform in parallel lines Arranged at a distance from each other.

The distance A is between the parallel lines of the series integrated circuits the same as the distance β in the known arrangement (Fig. 1).

The distance G between the rows of integrated circuits is but much smaller than the distance B between the rows of the known arrangement. With a smaller distance C between the rows, more integrated circuits can be housed on a printed circuit board 31 given size. if consequently, more sets of connection holes 35 are provided, there are also more tongues 32 required for printed lines 33. With a larger number of tongues 32 and printed lines 33 may require the lines 32 and the printed lines 53 form a little thicker in order to reduce the electrical resistance low too keep what is easily done with the circuit board 31 can be.

The ground bus line 41 (Fig. 4) carries on its left side at a distance from each other connecting wires 42, which are directed outwards and downwards and into the lower left holes 35 of each set. The supply line 43 is over the ground bus 41 and has a plurality of spaced apart connecting wires 44 on, extending from the right side outward and down to the upper right Holes 35 extend. Of course, the lines 41 and 43 are through a Isolation 45 separated. The branch 40 has a maximum thickness of 0.089 cm.

A spring-hardened conductor material is a suitable conductor material for the connecting wires Phosphor bronze connection into consideration, with the connection wires being galvanically connected Tin can be treated to make the soldering work easier.

In the arrangement 30 (Fig. 3) the integrated circuits, e.g. the DIPs 2) #, placed on the printed circuit board 31 above the branches 40; their connecting wires 26 run into the respective holes 35 and are there with the printed conductors 33 together with the connection wires 42 and 44 of the supply lines soldered so that each DIP 23 is connected to the supply voltage and to earth.

The assembly is carried out by laying out the supply lines 40 of the circuit board 31 between the holes 34 of the parallel lines each Row, inserting the connecting wires 42 and 44 into the associated holes 34, putting on of DIPs 23 on branch 40, with connecting wires 26 on opposite sides Sides of the branch 40 are located, inserting the connecting wires 26 into the respective Holes 34 and soldering leads 26, 42 and 44 to the printed conductors 33.

By arranging the branches 40 of the supply line between the printed circuit board 31 and the DIPs 23 can have the rows of holes 34 opposite the known arrangement 10 can be designed at a much closer spacing from one another. The lines 41 and 43 running under the DIPs 23 can receive heat from the DIPs 23 derive.

They thus work as a cooling or radiation plate to prevent overheating to avoid. Lines 41 and 43 are a much better conductor of heat than that dielectric substrate of the printed circuit board 11, which is in the known Arrangement 10 (FIGS. 1 and 2) is located under the DIPs 23.

In the branch 47 of the supply line shown in FIG. 5, the Ground line 48 designed differently and has two parallel elements 49, the are connected to one another by a yoke 50. Connecting wires run at a distance from one another 51 similar to before from the left side outwards and downwards. The power supply line 52 lies between the parallel elements: 49 of the earth line 48. Spaced Lead wires 53 run outward and toward the right as before below. The insulation 54 separates the power supply line 52 from the parallel ones Elements 49 and the yoke 50. The arrangement of the parallel elements 49 and the yoke 50 shields the power supply line 52 from being induced with high frequencies Stray currents to avoid noise development.

Because of the limited thickness of the branch 47, the lines 48 and 52 should not be as thick as lines 4'1 and 43 of that shown in FIG. LC4 Embodiment, which is why the lines 48 and 52 are not equally large Have current carrying capacity. However, for many purposes it is shielding of the voltage supply lines 52 of greater advantage than the increased current carrying capacity.

In the embodiment shown in Figures 6 and 7, the contains Branch 57 of the supply line includes a ground line 58 with several spaced apart Connecting wires 59, a first power supply line 60, which is immediately above of ground line 58 and has a plurality of lead wires 61 spaced apart and a second voltage supply line 62 across the first voltage supply line 60 with a plurality of spaced apart connecting wires 63, which from their left Side out and down. The two supply lines 60 and 62 lead different electrical potentials, so that the DIPs as desired different potentials can be supplied.

If a particular DIP 23 does not require grounding or voltage, then it can the wire connection for the relevant DIP must be cut off at the insulation and sealed its open surface so that this particular DIP 23 is bypassed will.

In the arrangement shown in Fig. 6, the terminals 34 are pads 36. In the case of the connection surfaces 36, the wire connection lines from the DIPs 23 and the strip 40 bent or curved so that a horizontal foot is formed, which can be welded or soldered to the connecting surfaces 36.

The formation of the branches 40 with earth and supply connections for an individual DIP 23 slightly reduces the capacity in between, compared to that the ground line 18 and the supply line 20 of the known system the parallel Surface zones between the earth line 41 and the supply line 43 are omitted.

However, this capacity loss is improved by the space saving and Versatility of the integrated circuit form and the capacitive supply arrangement more than made up for it.

Claims (6)

Claims 1. Arrangement of integrated circuits and power supply lines on printed circuit boards, characterized in that the integrated circuits (24) each row and its connecting wires (26) run downwards from a housing (23), are arranged over a branch (40) of the supply line. 2. Arrangement according to claim 1, wherein the circuit board has openings has which can accommodate connecting wires, characterized in that each Branch (40) of the supply line has connecting wires (35) which run downwards and electrically with connecting wires in individual openings in the circuit board (26) of the integrated circuits are connected. 3. Arrangement according to claim 1, characterized in that the individual Head (41, 43) of the supply line are flat and over their entire Length has a uniform cross-sectional area. 4. Arrangement according to claim 1, characterized in that the width dimensions each branch (truck) of the supply line and the housing (23) of an integrated Circuit are essentially the same. 5. Arrangement according to claim 1, characterized in that each branch (40) of the supply line has conductors (49, 52) assembled as a sandwich, from which one upper and lower parallel elements (49) has through a yoke (50) are connected together? and of which another head (52) is arranged between and at a distance from these parallel elements. 6. Arrangement according to claim 5, characterized in that three different Conductors (58, 60, 62) of each branch (40) of the supply line different electrical Lead potentials. L e r s e i t e