DE2262729A1 - PASTED ELECTRONIC BLOCK - Google Patents

PASTED ELECTRONIC BLOCK

Info

Publication number
DE2262729A1
DE2262729A1 DE19722262729 DE2262729A DE2262729A1 DE 2262729 A1 DE2262729 A1 DE 2262729A1 DE 19722262729 DE19722262729 DE 19722262729 DE 2262729 A DE2262729 A DE 2262729A DE 2262729 A1 DE2262729 A1 DE 2262729A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
building block
block according
insulating means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19722262729
Other languages
German (de)
Inventor
Dieter Dr Krause
Karl-Otto Prof Dr Lehmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19722262729 priority Critical patent/DE2262729A1/en
Publication of DE2262729A1 publication Critical patent/DE2262729A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Description

Vergossener elektronischer Baustein Die Erfindung bezieht sich auS einen vergossenen elektronischen Baustein mit mindestens einer flexiblen, mit Bauelementen bestückten Leiterplatte.Encapsulated electronic module The invention relates to an encapsulated electronic component with at least one flexible component with components assembled circuit board.

Xs besteht die Aufgabe, eine komplexe gedruckte Schaltullg auf möglichst kleinem Ratm zur Herstellung eines vergossensen elektronischen Bausteins unterzubringen.The task is to create a complex printed circuit as possible to accommodate a small Ratm for the production of an encapsulated electronic component.

Es ist bekannt, bestückte Leiterplatten in mehreren parallelen Ebenen übereinander anzuordnen und zu einem Baustein# zu vergießen. Sch:##7ie'rigkeiten treten hier bei der Herstellung der elektrischen Verbindungen zwischen- den einzelnen Leiterplatten und bei der Ableitung der auftretenden Verlustwärme auf, wenn, wie häufig der Fall ist, eine oder mehrere der Leiterplatten Leistungstransistoren oder dergleichen enthalten.It is known to assemble printed circuit boards in several parallel planes to be arranged on top of each other and cast into a building block #. Sch: ## 7iencies occur here when making the electrical connections between the individual PCBs and in the dissipation of the heat loss that occurs, if, how is often the case, one or more of the circuit boards power transistors or like included.

Eine Lösung der oben genannten Aufgabe sieht einen elektronischen Baustein der eingangs genannten Art vor, der dadurch gekennzeichnet ist, daß die flexible Leiterplatte ein großes Länge/Breite-Verhältnis aufweist und zu einem räumlichen Gebilde aufgewickelt-oder gefaltet ist und daß zwischen benachbarten Teilen der Leiterplatte ein flexibles bandförmiges Isoliermittel mit guten Wärmeableit- und/oder elektrischen hbschirmeigenschaften-angeordnet ist.One solution to the above problem is an electronic one Block of the type mentioned above, which is characterized in that the flexible printed circuit board has a large length / width ratio and a spatial Formation wound up or folded and that between adjacent parts of the Printed circuit board a flexible band-shaped insulating means with good heat dissipation and / or electrical shielding properties-is arranged.

In einer bevorzugten Äusführungsform ist die flexible Leiterplatte und das bandförmige Isoliermittel in Zick-Zack-Form gefaltet, wobei die Faltrichtungen zueinander einen rechten Winkel bilden.In a preferred embodiment, the flexible printed circuit board is and the band-shaped insulating means folded in a zigzag shape with the folding directions form a right angle to each other.

Eine andere Ausführungsform ist dadurch gekennzeichnet, daß die flexible Leiterplatte und das bandförmige Isoliermittel parallel zueinander aufgewickelt sind. Die bei bekannten Bausteinen mit mehreren übereinander angeordneten Leiterplatten auftretenden Schwierigkeiten der Verbindung der Leiterplatten untereinander treten bei diesen hier angegebenen Anordnungen nicht auf, da sich das Leiterbild über die gesamte Ausdehnung der flexiblen Leiterplatte erstreckt und die beim Falten oder Aufwickeln entstehenden Teilstücke von vornherein miteinander verbund#en sind.Another embodiment is characterized in that the flexible Printed circuit board and the tape-shaped insulating means wound up parallel to each other are. The known modules with several printed circuit boards arranged one above the other occurring difficulties of the connection of the circuit boards with each other occur does not occur in the arrangements given here, as the conductor pattern extends over the entire extent of the flexible printed circuit board extends and when folding or Winding up resulting parts are connected to each other from the start.

Das bandförmige Isoliermittel besteht vorzugsweise aus einem flachgedrückten Schlauch aus elektrischem Isoliermaterial mit einer Einlage aus elektrisch ulld thermisch gut leitendem Werkstoff. Damit wird die Möglichkeit gegeben, die Verlustwärme aus dem Innern des elektronischen Bausteins abzuführen und gleichzeitig eine Abschirmung gegen die Einstreuung von elektromagnetischen Störfeldern zu erhalten.The band-shaped insulating means preferably consists of a flattened one Hose made of electrical insulating material with an insert made of electrical ulld thermally good conductive material. This gives the opportunity to reduce the heat loss dissipated from the inside of the electronic component and at the same time a shield against the scattering of electromagnetic interference fields.

Zur Erläuterung der Erfindung sind in den Figuren Ausfibrungsbeispiele dargestellt und im folgenden beschrieben.To explain the invention, exemplary embodiments are shown in the figures shown and described below.

Figur 1: Eine flexible, bestückte Leiterplatte 1 von großer länge im Verhältnis zu ihrer Breite ist zick-zack-förmig zusammengefaltet, so daß ein räumliches Gebilde entsteht. Die Bestückung und die Ausführung des Leiterbildes ist von vornherein so getroffen, daß an den Biegestellen sich nur Leiterbahnen und keine Bauteile befinden. Um die beim Falten oder beim Aufwickeln einander benachbarten Teile der flexiblen Leiterplatte 1 voneinander zu isolieren, ist ein bandförmiges Isoliermittel 2 vorgesehen, welches ebenfalls in Zick-Zack-Lage zwischen den einzelnen Lagen der Leiterplatte 1 geführt ist, wobei die Faltrichtung des bandförmigen Isoliermittels 2 einen rechten Winkel zu der Faltrichtung der flexiblen Leiterplatte 1 bildet.Figure 1: A flexible, populated printed circuit board 1 of great length in relation to its width is folded in a zigzag shape, so that a spatial structure emerges. The assembly and the execution of the conductor pattern is made from the outset in such a way that only conductor tracks and there are no components. To those adjacent to each other when folding or when winding up To isolate parts of the flexible printed circuit board 1 from one another is in the form of a tape Insulating means 2 is provided, which is also in a zigzag position between the individual Layers of the circuit board 1 is guided, the folding direction of the tape-shaped insulating means 2 forms a right angle to the folding direction of the flexible printed circuit board 1.

An den freien Kantenabschnitten 3 der flexiblen L&i4##'## platte 1 können Anschlüsse für die gedruckte Schaltung vorgesehen werden.At the free edge sections 3 of the flexible L & i4 ## '## plate 1 connections for the printed circuit can be provided.

Zur Abführung der in der gedruckten Schaltung entstehenden Verlustwärme is-t das bandförmige Isoliermittel 2 mit einer Einlage 4 aus elektrisch und thermisch gut leitendein Werkstoff versehen.' Beim Vergießen der Anordnung zur Herstellung eines elektronischen Bausteins in Blockform kann die Einlage 4 des Isoliermittels 2 mit an der Außenseite des vergossenen Blocks angeordneten Kühlflächen oder dergleichen verbunden werden.To dissipate the heat losses that arise in the printed circuit is the band-shaped insulating means 2 with an insert 4 made of electrical and thermal a material with good conductivity. ' When potting the arrangement for manufacture an electronic component in block form, the insert 4 of the insulating means 2 with cooling surfaces or the like arranged on the outside of the cast block get connected.

Figur 2: In dem hier gezeigten Ausführungsbeispiel besteht das bandförmige Isolicrmittel 2 aus einem flachgedrückten Schlauch 5 aus elektrischem Isoliermaterial mit einer Einlage 4 in Form eines die volle Schlauchbreite erfüllenden Metallbandes 4', beispielsweise einer Kupferfolie.Figure 2: In the embodiment shown here, there is the band-shaped Isolicrmittel 2 from a flattened tube 5 made of electrical insulating material with an insert 4 in the form of a metal band filling the full width of the hose 4 ', for example a copper foil.

FiF;ur 3 zeigt eine andere Ausführungsform des bandförmigen Isoliermittels 2. Mehrere parallel in einer Ebene angeordnete Metalldrähte oder -bänder 7 sind mit Isolierstoff 6 umpreßt bzw. in einen flachgedrückten Schlauch 5, wie in Figur 2, eingelegt. Sie bilden die thermisch und elektrisch gut leitende Einlage 4 und können parallel zur Längskante des bandförmigen Isoliermittels 2 oder quer dazu angeordnet sein. Die an den Enden herausgeführten Metalldrähte 7 sind, wie das Metallband 4' in Figur 2 mit einer Wärmesenke zu verbinden. Die Netalldrähte 7 bilden hier, ähnlich wie in dem anderen Ausführungsbeispiel, einen Faraday'schen Käfig, so daß die durch elektromagnetische Einstreuungen erzeugten Ladungen abgeführt werden können.Fig. 3 shows another embodiment of the band-shaped insulating means 2. Several metal wires or strips 7 arranged in parallel in one plane are encapsulated with insulating material 6 or in a flattened tube 5, as in FIG 2, inserted. They form the thermally and electrically highly conductive insert 4 and can be parallel to the longitudinal edge of the strip-shaped insulating means 2 or across it be arranged. The metal wires 7 led out at the ends are like the metal strip 4 'in Figure 2 to be connected to a heat sink. The metal wires 7 form here, similar to the other embodiment, a Faraday cage, so that the charges generated by electromagnetic interference can be discharged.

6 Patentansprüche 3 Figuren6 claims 3 figures

Claims (6)

Patentansprüche 1. Vergossener elektronischer Baustein mit mindestens einer flexiblen, mit Bauelementen bestückten Leiterpiatte, dadurch gekennzeichnet, daß die flexible Leiterplatte (1) ein großes Länge/Breite-Verhältnis aufweist und zu einem räumlichen Gebilde aufgewickelt oder gefaltet ist und daß zwischen benachbarten Teilen der Leiterplatte (1) ein flexibles, bandförmiges Isoliermittel (2) mit guten Wärmeableit- und/oder elektrischen Abschirmeigenschaften angeordnet ist.Claims 1. Encapsulated electronic module with at least a flexible printed circuit board equipped with components, characterized in that that the flexible printed circuit board (1) has a large length / width ratio and is wound or folded into a spatial structure and that between adjacent Share the circuit board (1) a flexible, tape-shaped insulating means (2) with good Heat dissipation and / or electrical shielding properties is arranged. 2. Baustein nach Anspruch 1, dadurch gekennzeichnet, daß die flexible Leiterplatte (1) und das bandförmige Isoliermittel (2) in Zick-Zack-Form gefaltet sind, wobei die Faltrichtungen zueinander einen rechten Winkel bilden.2. Building block according to claim 1, characterized in that the flexible Printed circuit board (1) and the band-shaped insulating means (2) folded in a zigzag shape with the folding directions forming a right angle to one another. 3. Baustein nach Anspruch 1, dadurch gekennzeichnet, daß die flexible Leiterplatte (1) und das bandförmige Isoliermittel (2) parallel zueinander aufgewickelt sind.3. Building block according to claim 1, characterized in that the flexible Printed circuit board (1) and the strip-shaped insulating means (2) wound up parallel to one another are. 4. Baustein nach Anspruch 1, 2 oder 3, dadurch gekennzeichnet, daß das bandförmige Isoliermittel (2) aus einem flachgedrückten Schlauch (5) aus elektrischem Isoliermaterial mit einer Einlage (4) aus elektrisch und thermisch gut leitendem Werkstoff besteht.4. Building block according to claim 1, 2 or 3, characterized in that the band-shaped insulating means (2) from a flattened hose (5) made of electrical Insulating material with an insert (4) made of electrically and thermally good conductive material Material. 5. Baustein nach Anspruch 4, dadurch gekennzeichnet, daß die Einlage (4) aus einem die volle Schlauchbreite erfüllenden Metallband (4') besteht.5. Building block according to claim 4, characterized in that the insert (4) consists of a metal band (4 ') which fills the full width of the hose. 6. Baustein nach Anspruch 4, dadurch gekennzeichnet, daß die Einlage (4) aus mehreren parallel zu einer der Kanten in einer Ebene angeordneten Netalldrähten oder -bändern (7) besteht. a6. Building block according to claim 4, characterized in that the insert (4) from several metal wires arranged parallel to one of the edges in one plane or bands (7). a
DE19722262729 1972-12-21 1972-12-21 PASTED ELECTRONIC BLOCK Pending DE2262729A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19722262729 DE2262729A1 (en) 1972-12-21 1972-12-21 PASTED ELECTRONIC BLOCK

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722262729 DE2262729A1 (en) 1972-12-21 1972-12-21 PASTED ELECTRONIC BLOCK

Publications (1)

Publication Number Publication Date
DE2262729A1 true DE2262729A1 (en) 1974-07-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE19722262729 Pending DE2262729A1 (en) 1972-12-21 1972-12-21 PASTED ELECTRONIC BLOCK

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792879A (en) * 1984-04-17 1988-12-20 I F M Electronic Gmbh Mounting structure for electric and electronic circuit elements
US4811165A (en) * 1987-12-07 1989-03-07 Motorola, Inc. Assembly for circuit modules
US5117282A (en) * 1990-10-29 1992-05-26 Harris Corporation Stacked configuration for integrated circuit devices
EP0489995A1 (en) * 1990-12-12 1992-06-17 International Business Machines Corporation Flexible printed circuit package and flexible printed circuit for incorporation into such a package
US5519578A (en) * 1993-06-17 1996-05-21 Nec Corporation Folded printed wiring board structure with electromagnetic shield

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792879A (en) * 1984-04-17 1988-12-20 I F M Electronic Gmbh Mounting structure for electric and electronic circuit elements
US4811165A (en) * 1987-12-07 1989-03-07 Motorola, Inc. Assembly for circuit modules
US5117282A (en) * 1990-10-29 1992-05-26 Harris Corporation Stacked configuration for integrated circuit devices
EP0555407A1 (en) * 1990-10-29 1993-08-18 Harris Corp Stacked configuration for integrated circuit devices.
EP0555407A4 (en) * 1990-10-29 1994-11-23 Harris Corp Stacked configuration for integrated circuit devices
EP0489995A1 (en) * 1990-12-12 1992-06-17 International Business Machines Corporation Flexible printed circuit package and flexible printed circuit for incorporation into such a package
US5268813A (en) * 1990-12-12 1993-12-07 International Business Machines Corp. Flexible printed circuit package and flexible printed circuit for incorporating in such a package
US5519578A (en) * 1993-06-17 1996-05-21 Nec Corporation Folded printed wiring board structure with electromagnetic shield

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