DE2201746A1 - Automatic wiring device with several working heads - Google Patents

Description

PATENT LAWYERS DR. O. DlTTMANN K. L. SCHIFF DR. A. ν. FIVE DIPL. ING. P. STREHL PATENTANWÄLTE β MÜNCHEN '0β POSTFACH SBOlBO JAMES JOSEPH STERANKO AND JOHII HENRY HOLLAND Our file: DA-K835 (M-297)

β MUNICH 00 MARIAHILFPLATZ 2 ft 3

TELEPHONE) (0811) 48 4Ο4Ο ft 44 82 44 TELEGR.i EUROMARCPAT MUNICH

January 14, 1972 KLS / M

A utomatic Wiring equipment

with military workers (priority: January 27, 1971, U.SA, no.Ho 170)

The invention relates to an automatic wire device and relates in particular to a. _{Machine working with dlteler} control, u several working heads.

me preparation vcn eiektrischen visions on Circuits _E skarten _to fa3t techniques of printed Se _h al _{tune = owie Vo} of point-su-point connections. _{As a result} of circuits, printed " _{hold-up cards} " _{are often a} .

• el, double and even Vieifach layer un _{e e} eei net _{lur U} sing, invention.

Automatic point-to-point wiring has previously been used. For example, the Denver Company has an apparatus available called J ₁ wire winding machine called fi "

* ^Λ1η another Γ

are already

from the Gardner

my as
-nkt-eu-point-

ii si li di

mc Ve fc st Me Au se

209839/0680

ΓΛ-Κ830 _ 2 -

Wiring procedure is in U.S. Patent 3,336,077 written. During these operations, the wires were connected to the connection wrapped around. The machines work automatically under the control of a digital control device.

Another point-to-point technique is remelting soldering a continuously fed wire to certain solder pads on the printed circuit boards. In German Offenlegungsschrift 2 015 594 and 2 028 583, a Wiring method described in which soldered connections are produced through the insulated wire. The insulated wire runs through an opening in the soldering head. The head is lowered and heated in contact with the solder pad. Included the head sublimates the insulation and solder the wire to that Solder spot by remelting. The present invention represents an improvement on the laid-open documents mentioned described devices and methods.

In such wiring systems it is advantageous to wire several circuit cards at the same time. So far are Wiring machines with multiple working heads not entirely successful, since it is quite difficult to make a machine that will make a good connection every time. Been Machines with several working heads are used, this has the effect If only one faulty connection occurs, the whole machine stops, until the error is corrected.

(ο

DA-K030-3-2201 7A6

According to the invention, a wiring device with several working heads created under the control of one digital control device works automatically. Any connection is checked electrically and mechanically after its creation to determine whether it has been manufactured properly. To do this, a probe is lowered into contact with the connection point, to determine electrical continuity between the wire and the joint. The connection is not correct is performed, a second duty cycle is performed on the connection head, with the bad connection usually is corrected. This check and rework takes place under the control of one provided for each work head Tax system instead. The process is carried out independently of the activity of the digital control device. Hence will The whole machine with its multiple working heads is not stopped every time a faulty connection is established. Instead, the machine runs almost continuously because the faulty connections in the repeated cycle automatically to be repaired.

According to the invention, a wire gripper is also provided which, after completion of the connection process, subjects each connection to a non-destructive tensile test. According to the invention, a test for electrical continuity is also carried out in order to determine stripped wire locations. It is examined whether there is an electrical short circuit between the wire and the soldering head through which the wire runs. The exam is

209839/0660

taken, while between the table and the head relative I'r-v p; ng takes place, i.e. when the wire from a solder spot 'to one another is drawn. By identifying places where the insulation has been removed or damaged, potential short circuits are identified avoided in the completed wiring pattern.

According to the invention, after each connection has been established a flow of cooling air is automatically directed to the solder joint. This significantly reduces the cycle time of the machine.

The device according to the invention also has a two-stage Power supply that connects the soldering tip to two un-

! different temperatures heats. At the first stage will be

j a large amount of heat is supplied to sublimate the wire insulation

j mieren. A smaller amount of heat is used in the second stage

for remelting the wire to the solder spot.

The invention is avoided in connection with a preferred exemplary embodiment in the following description Drawings described; show in it

Fig. 1 is a pictorial representation of the invention Systems;

2A and 2B are a side view of the wiring head, Figures 2C and 2D show a plan view of the soldering head; Figures 2E to 2G show details of a wire lock; 3 shows the mode control switches;

4A to 4C the relays for passage, motor drive and probe drive; 209839/0660

Fig. 5 shows the clipping circuit; ;

Pig. 6A and 6B show the circuit for continuity and insulation testing;

Figures 7A and 7B show the connection circuits; j

Fig. 8A shows the cooling control circuit;

Fig. 8B shows the heating control circuit; ;

9A to 90 show the time diagrams for an operation, in which a good connection is achieved in the first cycle;

and · }

Fig. 10A to 10S and 10ΛΑ to 10SS timing diagram ::. E for a j

Work process in which a bad connection |

dung and a good connection in the subsequent cycle creates jj will. ;

In the system shown in FIG

wiring of circuit cards runs from a Sj: le 12 kon-;

continuously fed wire through a hole in a solder; ·

head 11. An electrical circuit board 13 is on a loaded ]

movable table 14 attached, the relative movements between the f.

Solder head 11 and the solder pad on the circuit board 13 causes. \

By moving the table under the control of a digital control | device 15 is the circuit card 13 automatically under the Solder head 11 positioned. In the case of the control device 1, it can for example, the commercially available "Sl -Syn JJ / C ' Positioning System "from Superior Electric Company, USA. This system controls the position of the table · Π via a T.ori.:·. t, r ···· i f <_- ri.-ο, liaf. · j · .. ··. ·;.: · i 1: ·. ^ in ·· bsa t in.r. t ο Stell ·. ui ■ -

'' ■ '·'"'ti tnni Li sch initer · - in. ·! Kr»;.: I ri. ^ Eu t, f · 1 1'. V.'j ιίΙ. J

"2 Π ^: } ^ρ i ■) / (J?) Tt 'j

In the particular embodiment described here, four different circuit cards 13, 16, 17 and 18 are used wired simultaneously from the system. At each point at which a connection is to be made, certain Operations carried out with the soldering head and the associated equipment. Lowering is one of these procedures or punctures of the soldering head 11 on the solder spot, the heating of the soldering tip, the supply of cooling air to the solder joint, the checking of the connection for continuity, the checking of the connection mechanical strength, testing the wire for short circuits when moving the head relative to the circuit board and cutting the wire at the end of each Wiring network. These functions are under the control of the control systems 19 to 22.

Mechanical Structure of the minds of men

2A-2B and 2C-2D show a connector head suitable for use in conjunction with an automatically operated system. Some features of this head are claimed in the application on which the German Offenlegungsnchschrift 2 015 b94 is based. The connection head comprises a soldering tip 201 with a bore through which a continuously fed wire (not shown) runs. The Spitr.e 201 is mounted on a head system, dns busbar η? O2 and 20 '-> for supplying power to iio Lü Lsp i *?. · / 0 'ur.fai.it.

209039/0660

DA-K830 - 7 -

2201 7

The entire tip assembly is pivotable about shaft 204 so that the head can be lowered from its normal rest position into contact with the solder pad on the circuit board. This downward movement is then _s when a stepping motor is applied in the forward direction the 205th The motor 205 causes the head system to move downwards via a rotating cam disk 206 and a lever arm 207. If the motor is acted upon in the opposite direction, it moves the head system back into its normal position.

Three switches 208, 209 and 210 are used to set the three positions. Head system to be scanned. These switches are one at a time actuated when the head system assumes the height for soldering, that for the wire guide or diej'.r.Sje for overdrive. At the soldering level, the soldering tip 201 is in contact with the respective solder spot on the circuit board. On the Wire guide height moves the table in mutually perpendicular directions to move the wire from one solder pad to another to pull.

After completing a wire network and cutting the wire, the head system is in the highest position, on moves the height for overdrive. In this position, the table moves in any direction relative to the head system the next point where a wire is to be soldered.

209839/0660

DA-K830

- θ - ^ 22017 ^ 6

To heat the soldering tip, the busbars 202 and 203 are supplied with current via lines 211 and 212. This stream comes from a power source which is controlled by the control system assigned to the individual soldering heads 11. It precautions are also taken to selectively ground the soldering tip. At the command of the control system, the satellite rails 202 and 203 earth potential applied to the soldering tip '. This is done when the control system checks to see if between the soldering tip and the insulated wire passing through the "tip shorts. The insulation is removed from the wire electrical continuity will occur and an alarm condition will be reported. A line 213 forms the contact with the wire on the side of the wire spool facing away from the free end.

Another electrical test is performed by means of a probe 214 that is in contact on command from the control system is brought to the soldering point where the connection was made. The control system energizes a probe solenoid 215, which selectively moves the probe 214 downward. The probe 214 is normally floating. However, during a test for continuity, ground potential is applied to the probe via line 216. Is located With the probe in its upper position, a switch 217 actuated, which sends a corresponding display of the probe position to the control system.

209839/0660

DA-K830 - 9

Lurch in the bore of the soldering tip Bes nitrogen gas is passed for cleaning and cooling continuously. This nitrogen is fed in via a line 218. Once the remelting soldered connection has been made, a controlled air source is switched on to cool the solder joint. The air becomes _;
supplied via an air valve, which is activated by a solenoid
219 is controlled. The air is introduced via a line 220 into a, v-ii junction, which is covered in FIG. 2A by the busbar ί ^deJ 202. , Sti

do: ^no

To cut the wire at the end of a wire network,
an electrically operated knife 221 is provided. Of the
A magnetic coil 222 for the knife ^{wi is} selectively applied to the control system. If the knife is at the upper point c =, ^{t € of} its stroke, a switch 223 is actuated; if ■ * ^C the knife is in the lower position of its stroke, a *
similar switch on the other side of solenoid 222
applied.

A wire locking mechanism is used to hold the wire behind
Completion of a connection to capture and mechanically
tighten. The wire lock 224 and an associated magnetic. ^ε coil 225 are shown in detail in FIGS. 2E to 2G. The ^! Wire lock 224 includes two clamp washers 226 and 227. '
When solenoid 225 is energized, the wire between ⁽

grasped by the two clamping disks and against the spring preload!
pressed so that tension is applied to the connection. A.

209839/0660

DA-K830 - 10-2201

Description of the tax systems

Each of the control systems 19 to 22 has the <u Fig. 3 to

j circuit shown.

In describing the circuitry of these control systems, a term will be used to make it easier to find of the circuit elements in the drawings. The first digit of each reference number indicates the drawing on which the

j control element is set dpi. For example, the relay appears 301 in Fig. 3. In the present description,

\ nwhich designates the relay contacts with the same reference numbers as the respective relay, but with an appended letter. For example, relay 302 has contacts 3O2A and 3O2B. The relay contacts are not always on the same drawing sheet as the relay. For example, relay 408 appears in FIG. 4, while a group of contacts of that relay, namely contacts 408C, appear in FIG.

To make it easier to understand how the relays work, they are labeled with a description of their function. For example, relay 408 is labeled DUR, which is an abbreviation for continuity. This means that the relay is energized or picks up if there is electrical continuity. All relay contacts are shown in their rest position. With all circuits the relay is put into the working state or activated

209839/0660

«, 22017A6

DA-K830 _ 11 -

i> ι ^ tf.n-tial struck to the relay, by the circuit of tr l; .oUrin. " is closed.

The punctures made during a. Connection process

j Hroi switches on the must be carried out vm ori · · shown in Fig. 1, digital control device 15 ger'.euert. (The above-mentioned Slo-Syn perforated strip control has auxiliary, Function control organs. which can be used for this purpose.) Closing these three switches is decoded and indicates one of seven possible functions, which are designated with F1 to F7.

Closing the switches actuates three M relays 301-303. The functions selectively controlled by these relays can be viewed as powers of two, with M relay 301 forming the highest position. For example, the function FA can be activated by activating the H relay: ·· 501 and not activating the M relays 302 and 303.

A manual switch 304 is mounted on each soldering head assembly. With this kit, the operator can turn off a particular soldering head without interfering with the operation of the other heads on the same table. The "skip" position switches off all F functions and acts on the circuit relay 401 in FIG. AC, denoted by KRE. -

209839/0660

T1A-KÖ30 - 12 - ' 22017

I) iT Vr-rbimlunr.n curtain

First of all, consider the pre-binding function identified by F2. This function initiates the connection and test processes. This function is activated by using de :; M-Relair> 302 activated. As a result, the relay contacts 3O1A, 3O2A and 3O3B are applied to the circuit via the minimal switch 304, which generates the downward signal T) WN 1. According to Fig. 7, the function F2 is on the Konj contacts 6O1B of the relay ABI, the contacts 6O2C of the relay RECYC} and the contacts 4Ο2Λ of the relay ERF and generates the signal \ DWN 1 of ground potential. This signal is via a diode 405 i and the contacts 603A'de3 relay for the connection height of the

\ Soldering head to the relay 402 marked ABW. Because \ earth potential is on the upper side of the relay 402, the \ connection head is lowered to the connection height. When Q «r * <pf has reached this level, a switch 604 is actuated. This) is the designated BLS connection height relay 603 beaufj strike. This in turn de-energizes the relay 402 in that the con-

i clocks 6O3A of the relay BLS are opened.

i.

If the connection level is reached, as indicated by addressing ι

of relay 603 is displayed, earth potential is applied to the in

I Fig. 7 shown delay relay applied. These relays are ! the relay labeled LRF 701 and the one labeled VERZ

'; Relay 702. The ground potential is supplied via the j Signal of function F2 at ground potential via the contacts

209839/0660

6O1B, a switch 710, contacts 6O2C, contacts G03B and _d

a diode 703 to the delay relays 701 and Ί2. The examples _K the relays remain unstressed until a predetermined Verzö- \ _f

err. time has expired.

The total heating time of the soldering tip is determined by the Verzö- i ,, Gerungs-time setting of the relay 701. FIG. Is Tadurch, the period _c controlled during which the connector relay · 7C1 is loaded. As long as this is the case: ir-i contacts 704A (FIG. 8B) closed. Thereby there is a; _λ Hei>; power source 805 in the state in which it de · soldering tip | supplies a high level of energy. As a result, a "large amount of heat" is generated which sublimates the wire insulation. ·

When the insulation is removed, there is between the wire spool; and the soldering tip a circuit. Closing this stream;, circle is perceived by an amplifier circuit 406,>

3 the ground potential via a diode 407 to a j designated by DUR Relay 408 sets. (At the same time, another relay 413, designated by DUR, is applied.) The relay 48 picks up <

and opens relay contacts 408D (Fig. 8B). Thereby, the j supplied from the heating current 805 is reduced to a quantity of energy \ value of a temperature below the sublimation

temperature of the insulation, but above the melting temperature of the solder. Used between the wire on the spool and The soldering tip does not complete a circuit, for example because the wire is broken, the high heat supply stops when

209839/0660

* <s

dac / delay relay 702 has expired. This will make the Contacts 7O2A (Pig. 8B) open, and those fed to the soldering tip The amount of energy is reduced.

This avoids possible damage to the circuit board that would occur when the high amount of energy is used during would be supplied to the entire awakening period.

At the end of the period during which the soldering tip is heating up, a ground signal is applied to a delay relay 706 labeled OFF. This relay determines the time during which a flow of cooling air is supplied to the solder joint. The earth potential is fed to relay 706 through contacts 701B of relay ERF. This ground potential is across contacts 706A of the relay OFF at an air control relay 707 labeled AIR. The contacts 7O7A (Fig. 8A) close and apply a voltage of 110 V to an air valve 808, which supplies cooling air to the solder joint. At the same time, a connection counter 809 is activated. The airflow is delivered to the solder joint for the period determined by the delay relay 706.

If the delay relay 706 is applied after the delay time, the soldering tip is raised. This is done by that via the contacts 7O6A and 6O5A (Fig. 7) of the with RLS designated relay 605 for the wire guide height ground potential is fed. This creates a ground potential Signal AUF1 generated, that of a diode 409 and via contacts

209839/0660

DA-K83O -15- / 1. LLV

6O6A (Pig. 4) of a relay 606 for applying an OPEN designated relay 403 is supplied. The relay 403 causes the soldering tip to move upward until the relay drops out. χ

The relay remains energized until the soldering tip hits the wire guide 'S

has reached altitude. This is determined by closing a switch 607 _(g for wire guide height. This turns the relay 605 t

applied.

During the lifting of the soldering head, the soldering point is mechanically tensioned by the fact that the fixed wire divider with a predetermined Force pulls on the wire. The wire fect plate is actuated, when a relay 711 labeled FEST is applied. This takes place when the delay relay 702 is applied is. The relay 701 remains energized until the relay 401 picks up and the contact 401D opens.

Next, the probe is lowered into contact with the solder joint. For this purpose is supplied _r otential via a diode 410 to earth a designated PROBE relay 404th This ground potential, referred to as the TEST 1 signal, is generated by the circuit shown in FIG. It should be noted that there is earth potential at point F2B. This potential is coupled in via relay contacts 608A to generate the TEST 1 signal.

When the probe relay 404 is applied, the probe is lowered until it reaches the soldering point. At this moment the relay 408 labeled DUR is energized when

- 16 C --- J

DA-K830 - 16 £ -J 2201 7 A6

I between the probe (in contact with the soldering point)

\ and the wire is in a circuit. As soon as the re-

\ lais 408 responds, the probe relay 404 drops out, and the

I probe returns to its upper position. Will no Duroh-

I was determined before the TEST ABG designated by a

I tes relay 608 has expired, the

1 probe switched off and a relay labeled RECYC

! and a relay 609 marked WIED are activated,

to initiate a second connection cycle.

/. If the probe detects passage, the DUR

J designated relays 408 and 413 are held. The relay 408 becomes

I held by a circuit through contacts 408B

I (Fig. 7) is closed and the relay 408 via a diode

i 421 supplies earth potential.

When the probe has returned to its upper position, will

■ a switch 611 corresponding to this position is actuated. There-

! through a relay 612 labeled PUS is acted upon. The contacts i 612B (Fig. 7B) close a circuit, the ■ 3 a lying at ground potential signal DONE BIND generated, the \ indicates that the compound iat completed. Note that the various tests must be met before this signal is generated. Contacts 408B must have toggled, indicating that the test for continuity was positive. The contacts 6O5A must have switched over, wa3 indicates that the soldering head has returned to the wire guide height.

209839/0660

2.

is reversing. Contacts 706A must have switched, which indicates that the air flow has been turned off. Further test; There are exercises in this chain. The BIND READY signal excites the relay 613 labeled SEARCH. If this relay 613 is acted upon, "earth potential is present via the contacts 613B, 601B, (FIG. 6) and a diode 622 on the busbar] *, which is connected to the two . extend sides of the soldering tip These busbars are held at ground potential when the head see the wire be- ^ s solder pads leads During this period takes place a ^con-;. tinuous check to see if between the head and the withdrawn from the coil wire Passage exists.

It should be noted that the soldering tip is also grounded during a connection process. During this process, the Contacts 7O4C (Fig. 6) closed. This will have a Diode 623 earth potential applied to the busbars on both sides of the soldering head. Used during the connection process If continuity is detected, the relays 408 and 413 labeled DUR respond. This will make contacts 408D (Fig. is switched, and the power source 805 is switched from high heat to low heat. That means that if the Isolation is completely sublimated, the power source automatically is switched from the high value to the low value.

If the BIND READY signal is generated, it is applied Via "a diode 411 the relay 401 designated rait KRE. At

*> λ η η ι η

ΠΛ-Κ030 - is - <- <J 22017Λ6

Actuation of this relay 401 closes a 'tromkrcir. back zv the digital control device 15, so that the Steuorung can go to the next command in the command sequence ü> .r.

It should be noted that other conditions exist under \ which enters this final-Zustar-d. The diode 411 is one of several diodes in a ODKR gate 412 which outputs a signal to the hole \ strip control means 15, which means that the puncture of the relevant control unit have been completed and the operation can be continued v "ground. Each of the control systems 19 to 22 has contacts which are actuated by the relay 401 labeled KRE in the respective control system. If all these contacts in series are actuated, a reset command is generated in the digital control device 15. This removes the signal F2, causing the M relay 302 to drop out. This causes the relays 701, 702, 408, 413, 706 and 401 to drop out.

After relay 401 has dropped out, the soldering tip is grounded via relay 613. This relay is over the signal BIND DONE, which is fed through a diode 614 and ground potential leads, acted upon. The soldering tip is grounded via a circuit that is made via contacts 613B and 401B as well as leads via the diode 622 to the busbars, which run on both sides of the soldering tip. Occurs during the subsequent Wire routing operations between the soldering tip and the wire there is passage on the coil, then the one marked with ΛΒΙ speaks

• »ftoooQ / HRRQ

Relay 601 on. This relay GO1 remains energized until it is turned off by the operator. An indication of this insulation fault is connected to one another by a lamp (from networked. } The connection at the end of a wire routing process in which an insulation fault condition occurs cannot be made before the operator has switched off the relay 6O < .

When a connection is completed, the relays are;

401, 413 and 613 are applied. As a result, the relay 401;

held by a circuit shown in Fig. 4 which is via < contacts 613C, 401C and 413C and diode 4-2.

The remaining relays drop out, while relay 401 remains picked up until the relays labeled DUR drop out. This ensures that relay 401 is not dropped before relay 413 has dropped to properly Ensure operation of the circuit for the detection of insulation faults (Fig. 6).

Tendon idvergan g

The cutting process is carried out after a network of wires has been soldered. At the end of this network formation, the wire is cut off. The function is programmed by the digital control device 15 by applying the relay 301 pro. This relay is used to apply ground potential to a line that generates function F4. Upper contacts 516A

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thereby the signal DWN2, which is represented by a! Mode 414, ί

5 relays 40? Marked with ΛΒ'λ '. acted upon, thereby v. the j
i head lowered in contact with the control panel to keep the wire in the correct position for the knife.

;] If the soldering head reaches the circuit board, what through

'Closing the switch 604 and activating the relay GO) ΐ

{ is displayed, relay 1>, marked SCHN, responds. This causes the knife to move towards the circuit board and cut the wire in its path.

When the knife reaches the lowest point of its path, a switch 518 is closed. This creates a SCHN j FEHTlG designated relay 516 is applied, which the magnet) discards the coil of the knife by actuating the contacts 516Λ,

; which remove the ground potential from the relay 517. This can the knife in his; Return to the rest position. At the same time will Ground potential supplied via contacts 5O5B and a signal OPEN

• generated. This signal is sent to the relay marked OPEN fed to raise the soldering head to the wire guide height.

{ Has the relay 516 responded and is the soldering head ^ä at its wire guide height and the knife at its upper level? Situation, which is indicated by closing a switch 519 labeled CTSW, a signal SCHN ABG is generated. This signal is fed to the relay 401 via a diode 415. This gives the digital control unit a signal

209839/0660

DA-K830 - ²¹

2201.7A6

* “Has been led; the ex-

that means that the function performed

_Λ "vital control device 15> ^ er.

internal auxiliary switch in the digital,

",,,," pph to earth ■■■ · ■ ,, in "then reset and the control get

first command over. ■ *

Cutting Test Procedure |

. .- ,,. » ή! «Soldering tip again After making a cut, the

Tirtvprk arranged to si- »f αν

over the last soldering point in the better * R |

, · .Wi-chnn dem ') raht on the I m

to ensure that there is no circuit between ι ^

"" _Ηι , _{Γ (} , κ is determined, %

Coil and the solder joint exist longer. Mdarch J ₁

whether the cut was successful. j

Puncture is ital in the di _C 5teuereinric do _{h e} by setting auxiliary switches proßrammiert. which act on the M relays 301 and 302. Thereby aas earth potential! leading signal P6 generated. The signal P6 is coupled in via contacts 408C (FIG. 6) and 608B to generate the TEST 2 signal. This signal TEST 2 causes a diode 416 to act on the relay 404, which lowers the probe into contact with the soldering point. The existence of a circuit between the probe and the wire on the spool is determined via amplifier or sensing circuit 406. Be = -. Eht none of the-

'like circuit, the sample is raised again when the relay 608 labeled TEST ABG has been released. Through this 'The earth potential is removed and the TEST 2 sign is ended.

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DA-K830-22-22017

By switching over the contacts 603B, a signal UP ^ is generated which, via a diode 417, lifts the soldering head in its uppermost position, namely on the overdrive height, causes.

When the probe has reached this uppermost position, which is indicated by the response of the relay 612 labeled PUS, and is the soldering head at its overdrive height, what

by closing a switch 620 and applying an I.
<Relay 606 labeled SLS is displayed, a SCHN TEST ABG signal is generated. It should be noted that all switch contacts 608B, 612A and 606B are actuated and carry ground potential, which generates this signal. The signal SCHN TEST ABG is applied via a diode 419 to the relay 401, which indicates in the digital control device that the function or the process has been completed.

If continuity is determined between the probe and the wire on the coil before the relay 608 labeled TEST ABG has expired, the relay 408 labeled DUR 1 responds and keeps itself energized actuated contacts 408C (Fig. 6), a manual push button switch 621 and a diode 420 on the relay 408. The relay remains energized as long is printed until the pressure switch 621st

Return to return and reconnect

If the connection cannot be established properly if the j

Solder head lowered to the first shark in contact with the solder spot j

this is determined by checking for continuity. ■ ',

A second cycle is then performed with the soldering head to> |

try another connection. During the;

Connection cycle has the actuation of contacts 6O5A (Fig. 7) j;

the ground potential leading signal F2B is generated. This signal j.

has been used to generate the signal TEST 1, which the * Has lowered the probe. If continuity has been established, actuation of contacts 408B (FIG. 7) is the signal F2B has been switched off.

However, if passage is not achieved, the probe remains for a delay time determined by relay 603 in the lowered state on the solder spot. The passage of time this; Relay is activated by applying the signal F? B through a diode 624 initiated. After about 150 milliseconds the relay is 60S has expired and the probe is returning to its upper position.

The relay 602 labeled RECYC is held and the relay 609 labeled WIED is energized. Since the two relays are now energized, the contacts 6O2C and 6O4C interrupt the current path of the signal F2 to the relays for the connection functions. This means that the ReIa: n 701, 702,

209839/0860

706, 600, 406 and 413. The falling of the marked AUS Relay 706 causes the hold circuit of the labeled RECYC Relay 602 is released, v / o through the puncture F2 via the contact 6O2C again on the connection logic will. The fact that this is the second connection cycle is shown in the relay labeled WIED. "2 609 saved. The connection cycle is not repeated. There will be no continuity during the test on continuity is generated, the connection lamp 610 is turned on. she remains switched on until the button 710 for the next connection process is pressed. This removes the signal F2.

It should be noted that in the second cycle of the Vyrbin-J the contacts 609D (FIG. 8B) of the WLED designated Relay 609 are open because this relay is

** has moved. As a result, the heating current source 805 is switched on,

J that of the soldering tip during the second connection ^ process the

channel heat supply. Thus, a possible guard

Elimination of the circuit curves due to the influence of too great a

J Avoided amount of heat.

The circuit also allows a position check.

After wiring any number of networks, the digital controller is programmed to do a such a position check provides. For this purpose, the relay 303 is activated, which generates a signal F1. The working head will

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DA-K830 - 25 -

thereby set to a specific return position on the circuit board, and a position verification lamp is turned on? switched. When the head is in the correct position, the operator presses a button on the control panel, "

to get a signal POSITION O.K. to create. '

The mode of operation of the system according to the invention can be traced back to V

from a comparison of FIGS. 9 and 10 better understand. Fig. 9Λ
to 90 are time charts for the different ^functions:; the while making a good connection in the first
Duty cycle to be carried out. Figures 10A to 10S and 10AA
to 1OSS show timing diagrams in which the workflow for
the case is shown that during the first cycle
bad connection and a good one during the second cycle
Connection is created.

209839/0660

Claims (1)

DA-KMO -2G-. 220 Π 46 Expectations 1. ) Device for automatic point-to-point twisting of circuit cards, characterized by a plurality of soldering heads (11) in which the heat is concentrated on a soldering tip (201) provided with an opening i: · .t, a supply (1?) of insulated wire for each of the soldering heads, the Wire runs through the respective openings of the soldering tip, a table (<O, on which the circuit cards are fastened below the individual soldering heads, whereby the table and soldering heads can be moved relative to one another in such a way that C: the heads are in alignment with solder -; spots can be placed on the circuit cards to which the wire is to be soldered, furthermore a digital control device (15) which adjusts the table in such a way that the soldering heads each have a solder spot on which the wire to be soldered, are aligned, I and which works under the control of a stored program, as well as a control system (19 ... 22) for each soldering I head that, depending on signals from the digital control j device automatically actuates the respective soldering head so that the head is lowered into contact with a soldering spot, heat is selectively supplied λ. ei, in order to solder Jen Lotfleck to the steacnle Dr .htctück in contact with him by remelting it, and the * \ --Λ is raised again. 209839/0660 LA-K330 220Ί7Α6 ?. Device according to claim 1, characterized draws that any tax system '-... 22) a Device (707) includes, after the A.:, -Ten the wire automatically initiates a flow of cooling air directed towards the soldering point at the soldering spot. 3. Apparatus according to claim 1 or 2, characterized in that a sonie (214) ve: each control system (19 ... 22) a Einric; the probe in contact with soldering means (404, 413) which checks between the wire and the probe for an electrical connection to the lnr.öeri g e k e η η - r, ehor * is and .. ·. £ (404), which, vegt, and a -. • heu passage to determine:;. r »t.'n is. 4. Device according to claim 3, characterized in i. ± ■■ - i> ⁿ ~ shows that each tax syste; . ( '* ... 22, r ei'ic Einriclitung (602, 609) which oir /; -..-, - itcren Vsrbindungs>; cle initiates when the Prüfünf found --uf passage d " There is an electrical connection between the wire and the probe. b. Device according to one of Claims 1 to 4, characterized in that a wire gripper (224) is provided for each solder head (11) and that each control system (19 ... 22) detects a device (711) which controls the wire gripper after a connection has been made, actuated in such a way that it applies a certain me- . 209839/0660 μ- «» - 28 - 22017A6 ^ ianic pull to determine whether the solder joint is mechanically strong. 6. Device according to one of claims 1 to 5, characterized yyy indicated that each control system (19 ... 22) means (601) which is operable when are moved relative to each f _r head (11) una x'isch (14), and testing for electrical continuity between the wire and the head. 7. Apparatus for automatic point-to-point wiring of circuit cards, characterized by a supply (12) of continuously facing wire, a connection head (11) with an opening through which the wire runs, a table (14) on which the circuit card can be fastened, the table and head being movable relative to one another in such a way that the head is marked with a = | Point on the circuit board to which the wire is to be connected, further means for producing a relative movement between the head and the circuit board in order to bring the head into contact with said point on the circuit board Probe (214), means (404) for moving the probe into contact with the solder joint, and means (408, 413) for checking for electrical continuity between the wire and the probe to determine if electrical pre-ignition is conimony . 20S839 / 0660 b. 8. Apparatus according to claim 7, characterized by a wire gripper (224) and a device (711) which oeaufschlagt the wire gripper after making a connection in such a way that it exerts a mechanical tensile stress on the solder joint to determine whether the solder joint is mechanical is firm. 9. Apparatus according to claim 7 or 8, wherein the wire is insulated, characterized by a device (601) which is actuatable when the head (11) and table (14) moved relative to each other worrien, and the electrical continuity between the Detects wire and soldering tip (201), and an indicator (615) which is actuatable when continuity occurs: j-.p to indicate that the insulation of the wire is removed . 209839/06 6 0 Blank page