DE2124887B2 - Electrical component, preferably semiconductor component, with foil contact - Google Patents

Electrical component, preferably semiconductor component, with foil contact

Info

Publication number
DE2124887B2
DE2124887B2 DE19712124887 DE2124887A DE2124887B2 DE 2124887 B2 DE2124887 B2 DE 2124887B2 DE 19712124887 DE19712124887 DE 19712124887 DE 2124887 A DE2124887 A DE 2124887A DE 2124887 B2 DE2124887 B2 DE 2124887B2
Authority
DE
Germany
Prior art keywords
film
conductor tracks
electrical component
component
carrier body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19712124887
Other languages
German (de)
Other versions
DE2124887C3 (en
DE2124887A1 (en
Inventor
Bengi 2000 Hamburg Goetze
Edward 2081 Tangstedt Uden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Original Assignee
Philips Patentverwaltung GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH filed Critical Philips Patentverwaltung GmbH
Priority to DE19712124887 priority Critical patent/DE2124887C3/en
Priority to NL7206491A priority patent/NL7206491A/xx
Priority to AU42266/72A priority patent/AU466740B2/en
Priority to IT6853172A priority patent/IT958885B/en
Priority to GB2295772A priority patent/GB1363805A/en
Priority to JP4776972A priority patent/JPS5428715B1/ja
Priority to FR7217421A priority patent/FR2137934B1/fr
Priority to CA142,537A priority patent/CA964380A/en
Publication of DE2124887A1 publication Critical patent/DE2124887A1/en
Priority to US449850A priority patent/US3930115A/en
Publication of DE2124887B2 publication Critical patent/DE2124887B2/en
Application granted granted Critical
Publication of DE2124887C3 publication Critical patent/DE2124887C3/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/0105—Tin [Sn]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

Die Erfindung betrifft ein elektrisches Bauelement in Mikrotechnik, vorzugsweise ein Halbleiterbauelement, bei dem der Bauelementenkörper mit Hilfe einer biegsamen, elektrisch isolierenden und Leiterbahnen mit Anschlußzonen tragenden Folie kontaktiert ist.The invention relates to an electrical component in microtechnology, preferably a semiconductor component, in which the component body with the help of a flexible, electrically insulating and conductor tracks is contacted with connection zones bearing film.

Eine biegsame Isolierfolie mit einem Muster von Leiterbahnen, an dem ein Bauelementenkörper befestiet ist. ist in »Proc. of the Electronic Components Conference (1. E. E. Ε.)«, 1967, Seite 283—290 beschrieben.A flexible insulating sheet with a pattern of conductive paths to which a component body is attached is. is in "Proc. of the Electronic Components Conference (1. E. E..) ", 1967, pp. 283-290 described.

Bei Bauelementen, bei denen der Bauelementenkörper mit Hilfe einer Folie kontaktiert ist, ist es im s Hinblick auf die Serienfertigung ein wichtiges Erfordernis, die Kontaktierung der Anschlußleiter so einfach und kostensparend wie möglich durchzuführen.In the case of components in which the component body is contacted with the aid of a film, it is in s an important requirement with regard to series production, the contacting of the connecting conductors to be carried out as simply and cost-effectively as possible.

Es ist bekannt die Anschlußkontaktierung auf die Weise durchzuführen, daß die auf der Folie aufgebrach-It is known to carry out the connection contacting in such a way that the applied to the film

i'i ten Leiterbahnen an ihren, dem Bauelementenkörper gegenüberliegenden Seiten übci die Folie hinausragen und an diesen freien Enden mit einer Printplatte kontaktiert werden (vergleiche »Electronics«, Bd. 44, Nr. 3 1.2.1971), Seite 44-48). Dieses Verfahren erfordert umständliche Schritte bei der Fertigung.i'i th conductor tracks on their, the component body opposite sides over the film protrude and at these free ends with a printed circuit board be contacted (see "Electronics", vol. 44, no. 3 1.2.1971), pages 44-48). This method requires cumbersome manufacturing steps.

Der Erfindung liegt die Aufgabe zugrunde, die Anschlußkontaktierung von auf eine Folie autgebrachten Leiterbahnen mit einer Printplatte auf sehr einfache und mechanisch stabile Weise zu bewirken.The invention is based on the object of the connection contacting of applied to a film To effect conductor tracks with a printed circuit board in a very simple and mechanically stable manner.

.'D Diese Aufgabe wird erfindungsgemäß dadurch gelöst daß die Folie überwiegend ganzflächig mit der den Leiterbahnen abgewandten Seite fest mit einem Trägerkörper verbunden ist der so ausgebildet ist daß er von einer die Anschlußzonen der Leiterbahnen auf.'D This object is achieved according to the invention that the film predominantly over the entire surface with the side facing away from the conductor tracks firmly with a Carrier body is connected which is designed so that it is from one of the connection zones of the conductor tracks

?r> der Folie kontaktierenden Anschlußfassung aufgenommen werden kann.? r > the film contacting terminal socket can be added.

Der Erfindung liegt also die Erkenntnis zugrunde, alle für ein elektrisches Bauelement erforderlichen Zuleitungen durch auf eine Folie aufgebrachte Leiterbahnen zuThe invention is thus based on the knowledge that all of the supply lines required for an electrical component through conductor tracks applied to a film

-«ι realisieren.- «ι realize.

Der Trägerkörper kann als U-Profil gestaltet sein und die Folie wird so darauf befestigt, daß die Anschlußzonen der Leiterbahnen die Abschlußkanten der Schenkel des U-Profils umfassen. Ist der Trägerkörper eine Platte,The carrier body can be designed as a U-profile and the film is attached to it in such a way that the connection zones the conductor tracks include the end edges of the legs of the U-profile. If the carrier is a plate,

i> wird die Folie so darauf befestigt, daß die Anschlußzonen der Leiterbahnen eine Abschlußkante des plattenförmigen Trägerkörpers umfassen. Die Folie kann auf den Trägerkörper aufgeklebt werden, wobei das Aufkleben so erfolgt, daß die Folie entweder an der Seite, die der die Leiterbahnen tragenden Seite abgekehrt ist, mit einem geeigneten Kleber beschichtet und mit einer abziehbaren Schutzfolie versehen wird, oder daß die Folie erst unmittelbar vor dem Aufkleben mit einem geeigneten Kleber, zum Beispiel Epoxydharz, versehen wird.i> the film is attached to it in such a way that the connection zones of the conductor tracks comprise a terminating edge of the plate-shaped carrier body. The slide can be on the carrier body are glued, the gluing takes place in such a way that the film is either on the Side facing away from the side carrying the conductor tracks coated with a suitable adhesive and is provided with a removable protective film, or that the film is only immediately before being glued on is provided with a suitable adhesive, for example epoxy resin.

Der Trägerkörper, der beispielsweise aus Aluminium sein kann, ist mit mindestens einem eine feste Lage zwischen dem Bauelement und der Anschlußfassung gewährleistenden Anschlag versehen, und ist gleichzeitig Kühlkörper für das Bauelement.The carrier body, which can be made of aluminum, for example, is a fixed layer with at least one provided between the component and the terminal socket ensuring stop, and is at the same time Heat sink for the component.

Eine zusätzliche Kühlung des Bauelementes kann dadurch erreicht werden, daß die von der Folie abgewandte Seite des Bauelementenkörpers mit einem weiteren Kühlkörper versehen ist.Additional cooling of the component can be achieved by the fact that the film remote side of the component body is provided with a further heat sink.

Um den Bauelementenkörper vor Umwelteinflüssen zu schützen, kann er auf geeignete Weise, vorzugsweise mit Kunstharz abgedeckt werden. Dem Kunstharz können gegebenenfalls die Wärmeableitung verbessernde, die Wärmeausdehnung vermindernde oder auchIn order to protect the component body from environmental influences, it can in a suitable manner, preferably covered with synthetic resin. If necessary, the synthetic resin can improve the heat dissipation, the thermal expansion reducing or also

μ feuchtigkeitsabsorbierende Zusätze sowie Farbstoffe beigegeben werden.μ moisture-absorbing additives and dyes be added.

Zur Verbesserung der Wärmeableitung kann der Bauelementenkörper auch auf dem U-förmigen Trägerkörper direkt angeordnet werden. Zu diesem Zweck wird der Trägerkörper mit einer muldenförmigen Ausnehmung versehen und die Folie erhält eine Öffnung, so daß die Leiterbahnen teilweise freiliegen und der Bauelementenkörper zwischen dem Trägerkör-To improve the heat dissipation, the component body can also be placed on the U-shaped carrier body can be arranged directly. For this purpose, the carrier body is trough-shaped Provided recess and the film is given an opening so that the conductor tracks are partially exposed and the component body between the carrier body

per und den Leiterbahnen angeordnet werden kann.can be arranged by and the conductor tracks.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß die Kontaktierung elektrischer Bauelemente mit mehr als zwei Anschlüssen, wie zum Beispiel Transistoren, integrierte Schaltungen oder ähnliches, aber auch von Kondensatoren oder Widerständen etc, schnell und unter Einsparung zusätzlicher Verfahrensschritte, wie sie zum Beispiel eine Drahtkontaktierung oder das Freilegen der Anschlußzonen von Leiterbahnen mit sich bringt, erfolgen kann. ι ηThe advantages achieved by the invention are in particular that the contact is electrical Components with more than two connections, such as transistors, integrated circuits or similar, but also of capacitors or resistors etc, quickly and saving additional process steps, such as wire bonding or the exposure of the connection zones of conductor tracks with it, can take place. ι η

Mehrere Ausführungsbeispiele der Erfindung sind in den Zeichnungen dargestellt und werden im folgenden näher beschrieben. Es zeigtSeveral exemplary embodiments of the invention are illustrated in the drawings and are described below described in more detail. It shows

F i g. 1 ein mit «iner Folie kontaktiertes elektrisches Bauelement auf einem Trägerkörper mit U-Profil'is gemäß der Erfindung befestigt,F i g. 1 an electrical contact with an inner foil Component on a carrier body with a U-profile attached according to the invention,

Fig. la ein mit einer Folie kontaktiertes elektrisches Bauelement in einer abgewandelten Anordnung auf einem Trägerkörper mit U-Profil,Fig. La an electrical contacted with a film Component in a modified arrangement a support body with a U-profile,

Fig.2 ein mit einer Folie kontaktiertes elektrisches Einzelbauelcnicnt auf einem plattenförmigen Trägerkörper, Fig. 2 an electrical contact with a film Individual components on a plate-shaped support body,

F i g. 3 die Anordnung des Bauelementenkörpers bei einem weiteren Ausführungsbeispiel eines Bauelementes gemäß der Erfindung, r> F i g. 3 shows the arrangement of the component body in a further exemplary embodiment of a component according to the invention, r>

Fig.4 ein elektrisches Bauelement mit einem zusätzlich angeordneten Kühlkörper und4 shows an electrical component with a additionally arranged heat sink and

Fig.5 eine Anschlußfassung für ein elektrisches Bauelement5 shows a connection socket for an electrical component

Unter einer Anschlußfassung wird hier jede Vorrichtung verstanden, die geeignet ist, das Bauelement mechanisch zu halten und einen elektrischen Kontakt zu ihr herzustellen.A connection socket is understood here to mean any device which is suitable for the component to hold mechanically and to establish electrical contact with it.

F i g. 1 zeigt ein erstes Ausführungsbeispiel des Bauelements nach der Erfindung. Der Bauelementenkörper 1, z. B. eine integrierte Schaltung, ist in flip-chip-Technik mit Leiterbahnen 3 auf einer Folie 2 verlötet Die Ar.schlußzonen 5 der Leiterbahnen 3 sind in der Zeichnung verbreitert dargestellt und dienen der Anschlußkontaktierung in einer Anschlußfassung 7 (vergl. F i g. 5).F i g. 1 shows a first embodiment of the component according to the invention. The component body 1, e.g. B. an integrated circuit is in flip-chip technology with conductor tracks 3 on a film 2 soldered The Ar.schlusszonen 5 of the conductor tracks 3 are shown enlarged in the drawing and are used Connection contact in a connection socket 7 (see FIG. 5).

Um den Bauelementenkörper gegen Umwelteinflüsse zu schützen, ist er mit einer Kunststoffumhüllung 11 versehen.In order to protect the component body against environmental influences, it is covered with a plastic sheath 11 Mistake.

Die Leiterbahnen 3 sind durch Laminierung und anschließende Ätzung mit Hilfe der photolithographischen Technik auf der Folie 2 ausgebildet worden, sie bestehen z. B. aus Kupfer und sind verzinnt oder vergoldet, um das Verlöten mit dem Kristall zu erleichtern.The conductor tracks 3 are by lamination and subsequent etching with the help of the photolithographic Technique has been formed on the slide 2, they consist, for. B. made of copper and are tinned or gold-plated to make it easier to solder to the crystal.

Die Folie 2, z. B. eine Polyimidfolie, ist an der den Leiterbahnen 3 abgekehrten Seite mit Hilfe eines geeigneten Klebers, z. B. Epoxydharz, überwiegend ganzflächig auf den Trägerkörper 4 aufgeklebt, und zwar so, daß die Folie 2 um die AbschluBkanten 8 des Trägerkörpers 4 herumgeklebt wird, so daß auch die Innenseiten der Schenkel des U-förmigen Trägerkörpers 4, oder zumindest Teile davon, von der Folie 2 bedeckt sind.The slide 2, e.g. B. a polyimide film is on the side facing away from the conductor tracks 3 with the help of a suitable adhesive, e.g. B. epoxy resin, glued predominantly over the entire surface of the support body 4, and so that the film 2 is glued around the end edges 8 of the support body 4, so that the Inner sides of the legs of the U-shaped support body 4, or at least parts thereof, of the film 2 are covered.

Der Trägerkörper 4 kann aus Aluminium-Band von einer Stärke von etwa 04 mm U-förmig gebogen werden und kann erforderlichenfalls an der Stelle, wo der Kristall aufgebracht werden soll, gelocht werden, um Spannungen durch unterschiedliche Wärmeausdehnung zu vermeiden.The support body 4 can be bent into a U-shape from aluminum tape with a thickness of approximately 04 mm and, if necessary, can be punched at the point where the crystal is to be applied, in order to avoid tension due to different thermal expansion.

Die Schenkel des Trägerkörpers 4 weisen einen Anschlag 9 auf, der eine feste Lage zwischen dem Bauelement und der Anschlußfassung 7 gewährleistetThe legs of the support body 4 have a stop 9 which is a fixed position between the Component and the connection socket 7 guaranteed

F i g. 1 a zeigt eine Abwandlung des in F i g. 1 dargestellten elektrischen Bauelementes, bei der die Folie 2 mit dem auf den Leiterbahnen 3 kontaktierten Bauelementenkörper 1 nicht außen um den U-förmigen Trägerkörper 4 herum, sondern in den U-förmigen Trägerkörper 4 hineingeklebt ist Diese Anordnung kann gewählt werden, wenn der Bauelementenkörper 1 oder die Leiterbahnen 3 eines besonderen Schutzes bedürfen.F i g. 1 a shows a modification of the one shown in FIG. 1, in which the film 2 with the component body 1 contacted on the conductor tracks 3 is not glued outside around the U-shaped carrier body 4, but into the U-shaped carrier body 4. This arrangement can be selected when the component body 1 or the conductor tracks 3 require special protection.

F i g. 2 zeigt die Möglichkeit der Folienkontaktierung für ein Einzelbauelement z. B. für einen Planartransistor. Der Bduelementenkörper in einer Kunststoffumhüllung 11 ist auf den Leiterbahnen 3 angeordnet Der Trägerkörper 4 hat die Form einer Platte, um die die Folie 2 an einer Kante 13 herumgeklebt ist Der piattenförmige Trägerkörper 4 weist einen Anschlag 9 auf, der eine feste Lage zwischen dem Bauelement und der Anschlußfassung 7 gewährleistetF i g. 2 shows the possibility of foil contacting for a single component z. B. for a planar transistor. The component body in a plastic cover 11 is arranged on the conductor tracks 3 The carrier body 4 has the shape of a plate, around which the film 2 is glued at an edge 13 the connection socket 7 guaranteed

F i g. 3 zeigt eine Anordnung des Bauelementenkörpers 1 direkt auf dem Trägerkörper 4. Diese Anordnung ist zweckmäßig, wenn eine besonders gute Wärmeableitung erwünscht ist Hierzu wird der nur teilweise dargestellte Trägerkörper 4 mit einer muldenförmigen Ausnehmung 12 versehen, die den Bauelementenkörper 1 aufnimmt. Die Folie 2 bekommt eine Ausstanzung, so daß die Leiterbahnen 3 teilweise freigelegt werden, um eine Kontaktierung mit dem Bauelementenkörper 1 zu ermöglichen. Die Verbindung des Bauelementenkörpers 1 zum Trägerkörper 4 wird mit Hilfe einer Wärmeleitpaste oder eines Wärmeleitklebers hergestelltF i g. 3 shows an arrangement of the component body 1 directly on the carrier body 4. This arrangement is useful when particularly good heat dissipation is required. This is only partially The support body 4 shown is provided with a trough-shaped recess 12 that supports the component body 1 records. The film 2 is punched out so that the conductor tracks 3 are partially exposed to enable contact with the component body 1. The connection of the component body 1 to the carrier body 4 is produced with the help of a thermal paste or a thermal adhesive

F i g. 4 zeigt einen über dem Bauelementenkörper 1 zusätzlich angeordneten Kühlkörper 6, der vorzugsweise aus; demselben Material wie der Trägerkörper 4 besteht.F i g. 4 shows a cooling body 6 additionally arranged above the component body 1, which is preferably the end; the same material as the carrier body 4 is made.

F i g. 5 zeigt das Prinzip der Anschlußfassung 7 für ein elektrisches Bauelement gemäß den Fig. 1, 1a oder 4 mit den Einsteckschlitzen 10 für den bis zum Anschlag 9 reichenden Teil des Schenkels des Trägerkörpers 4. Der schraffierte Teil kann zur Vereinfachung der Herstellung der Anschlußfassung entfallen.F i g. 5 shows the principle of the connection socket 7 for an electrical component according to FIG. 1, 1a or 4 with the insertion slots 10 for up to the stop 9 reaching part of the leg of the support body 4. The hatched part can be omitted to simplify the manufacture of the connection socket.

Hierzu 5 Blatt ZeichnungenIn addition 5 sheets of drawings

Claims (9)

Patentansprüche:Patent claims: 1. Elektrisches Bauelement in Mikrotechnik, vorzugsweise Halbleiterbauelement bei dem der Bauelementenkörper mit Hilfe einer biegsamen, elektrisch isolierenden und Leiterbahnen mit Anschlußzonen tragenden Folie kontaktiert ist dadurch gekennzeichnet, daß die Folie (2) überwiegend ganzflächig mit der den Leiterbahnen1. Electrical component in microtechnology, preferably semiconductor component in which the component body with the help of a flexible, electrically insulating and conductor tracks with connection zones-bearing film is thereby contacted characterized in that the film (2) predominantly over the entire surface with the conductor tracks (3) abgewandten Seite fest mit einem Trägerkörper(3) facing away from the side firmly with a carrier body (4) verbunden ist, der so ausgebildet ist, daß er von einer die Anschlußzonen (5) der Leiterbahnen (3) auf der Folie kontaktierenden Anschlußfassung (7) aufgenommen werden kann.(4) is connected, which is designed to be of one of the connection zones (5) of the conductor tracks (3) on the foil contacting connection socket (7) can be included. 2. Elektrisches Bauelement nach Anspruch 1, dadurch gekennzeichnet, daß der Trägerkörper (4) gleichzeitig Kühlkörper ist2. Electrical component according to claim 1, characterized in that the carrier body (4) is also the heat sink 3. Elektrisches Bauelement nach Anspruch 1 oder 2, dadurch gekennzeichnet daß der Trägerkörper (4) ein U-Profil aufweist und die Folie (2) so mit ihm verbunden ist, daß die Anschlußzonen (5) der Leiterbahnen (3) die Ab.schlußkanten (8) der Schenkel des U-Profils umfassen.3. Electrical component according to claim 1 or 2, characterized in that the carrier body (4) has a U-profile and the film (2) is connected to it in such a way that the connection zones (5) of the Conductor tracks (3) include the Ab.schlusskanten (8) of the legs of the U-profile. 4. Elektrisches Bauelement nach Anspruch 3, dadurch gekennzeichnet, daß der U-förmige Trägerkörper (4) mit einer muldenförmigen Ausnehmung (12) versehen ist und die Folie (2) eine Öffnung aufweist, so daß die Leiterbahnen (3) teilweise freiliegvrn und der Bauelementenkörper (1) zwischen dem Trägerkörper (4) und den Leiterbahnen i[3) angeordnet ist.4. Electrical component according to claim 3, characterized in that the U-shaped support body (4) is provided with a trough-shaped recess (12) and the film (2) has an opening has, so that the conductor tracks (3) partially exposed and the component body (1) between the carrier body (4) and the conductor tracks i [3) is arranged. 5. Elektrisches Bauelement nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Trägerkörper (4) plattenförmig ausgebildet ist und die Folie (2) so mit ihm verbunden ist, daß die Anschlußzonen (5) der Leiterbahnen (3) eine Abschlußkante (13) des plattenförmigen Trägerkörpers (4) umfassen (F ig. 2).5. Electrical component according to claim 1 or 2, characterized in that the carrier body (4) Is plate-shaped and the film (2) is connected to it that the connection zones (5) of the Conductor tracks (3) comprise a terminating edge (13) of the plate-shaped support body (4) (Fig. 2). 6. Elektrisches Bauelement nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß ü'.ie Folie (2) auf den Trägerkörper (4) aulgeklebt ist.6. Electrical component according to one of claims 1 to 5, characterized in that ü'.ie Foil (2) is glued onto the carrier body (4). 7. Elektrisches Bauelement nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß der Bauelementenkörper (1) auf der Folie (2) mit Kunstharz (11) abgedeckt ist.7. Electrical component according to one of claims 1 to 6, characterized in that the Component body (1) on the film (2) is covered with synthetic resin (11). 8. Elektrisches Bauelement nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß der Trägerkörper (4) mit mindestens einem, eine feste Lage zwischen dem Bauelement und der Anschlußfassung (7) gewährleistenden Anschlag (9) versehen ist.8. Electrical component according to one of claims 1 to 7, characterized in that the Carrier body (4) with at least one fixed position between the component and the connection socket (7) ensuring stop (9) is provided. 9. Elektrisches Bauelement nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß die von der Folie (2) abgewendete Seite des Bauelementenkörpers (1) mit einem Kühlkörper (6) verbunden ist (F ig. 4).9. Electrical component according to one of the Claims 1 to 8, characterized in that the side of the component body facing away from the film (2) (1) is connected to a heat sink (6) (Fig. 4).
DE19712124887 1971-05-19 1971-05-19 Electrical component, preferably semiconductor component, with foil contact Expired DE2124887C3 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE19712124887 DE2124887C3 (en) 1971-05-19 1971-05-19 Electrical component, preferably semiconductor component, with foil contact
NL7206491A NL7206491A (en) 1971-05-19 1972-05-13
AU42266/72A AU466740B2 (en) 1971-05-19 1972-05-15 Electric component, preferably a semiconductor device, having a foil contacting
GB2295772A GB1363805A (en) 1971-05-19 1972-05-16 Electrical components particularly semiconductor devices
IT6853172A IT958885B (en) 1971-05-19 1972-05-16 SPECIAL ELECTRICAL COMPONENT SEMICONDUCTOR DEVICE WITH SHEET-SHAPED CONTACT
JP4776972A JPS5428715B1 (en) 1971-05-19 1972-05-16
FR7217421A FR2137934B1 (en) 1971-05-19 1972-05-16
CA142,537A CA964380A (en) 1971-05-19 1972-05-19 Electric component having foil supported contacts
US449850A US3930115A (en) 1971-05-19 1974-03-11 Electric component assembly comprising insulating foil bearing conductor tracks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712124887 DE2124887C3 (en) 1971-05-19 1971-05-19 Electrical component, preferably semiconductor component, with foil contact

Publications (3)

Publication Number Publication Date
DE2124887A1 DE2124887A1 (en) 1972-12-07
DE2124887B2 true DE2124887B2 (en) 1979-08-02
DE2124887C3 DE2124887C3 (en) 1980-04-17

Family

ID=5808355

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712124887 Expired DE2124887C3 (en) 1971-05-19 1971-05-19 Electrical component, preferably semiconductor component, with foil contact

Country Status (8)

Country Link
JP (1) JPS5428715B1 (en)
AU (1) AU466740B2 (en)
CA (1) CA964380A (en)
DE (1) DE2124887C3 (en)
FR (1) FR2137934B1 (en)
GB (1) GB1363805A (en)
IT (1) IT958885B (en)
NL (1) NL7206491A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3814469A1 (en) * 1987-04-30 1988-11-17 Mitsubishi Electric Corp Semiconductor arrangement and method for producing it

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
ZA783270B (en) * 1977-07-06 1979-06-27 Motorola Inc Molded circuit board
DE2752655A1 (en) * 1977-09-23 1979-06-07 Blaupunkt Werke Gmbh Electronic-component assembly for automated mass-production - has component in hole in support foil closed on one side by metal-plane heat sink
NL191959B (en) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identification card with IC module and carrier element for an IC module.
US4638348A (en) * 1982-08-10 1987-01-20 Brown David F Semiconductor chip carrier
US4528748A (en) * 1982-11-29 1985-07-16 General Electric Company Method for fabricating a printed circuit board of desired shape
DE3627372C3 (en) * 1986-08-12 1994-04-14 Loewe Opta Gmbh Arrangement consisting of a printed circuit board, a heat sink and electronic components to be cooled
US6842325B2 (en) * 2001-09-19 2005-01-11 Square D Company Flexible circuit adhered to metal frame of device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2923860A (en) * 1957-08-22 1960-02-02 Miller John Dawson Printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3814469A1 (en) * 1987-04-30 1988-11-17 Mitsubishi Electric Corp Semiconductor arrangement and method for producing it

Also Published As

Publication number Publication date
FR2137934B1 (en) 1980-04-04
JPS5428715B1 (en) 1979-09-18
FR2137934A1 (en) 1972-12-29
AU466740B2 (en) 1975-11-06
DE2124887C3 (en) 1980-04-17
GB1363805A (en) 1974-08-21
DE2124887A1 (en) 1972-12-07
IT958885B (en) 1973-10-30
AU4226672A (en) 1973-11-22
NL7206491A (en) 1972-11-21
CA964380A (en) 1975-03-11

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