DE2101253A1 - Fire resistant wood chip board - using alkali metal silicates - Google Patents

Fire resistant wood chip board - using alkali metal silicates

Info

Publication number
DE2101253A1
DE2101253A1 DE19712101253 DE2101253A DE2101253A1 DE 2101253 A1 DE2101253 A1 DE 2101253A1 DE 19712101253 DE19712101253 DE 19712101253 DE 2101253 A DE2101253 A DE 2101253A DE 2101253 A1 DE2101253 A1 DE 2101253A1
Authority
DE
Germany
Prior art keywords
chip board
fire resistant
wood chip
alkali metal
metal silicates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712101253
Other languages
German (de)
Inventor
Hans-Heinz 6000 Frankfurt Link
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to DE19712101253 priority Critical patent/DE2101253A1/en
Publication of DE2101253A1 publication Critical patent/DE2101253A1/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00Compositions of lignin-containing materials
    • C08L97/02Lignocellulosic material, e.g. wood, straw or bagasse
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02Homopolymers or copolymers of esters of monocarboxylic acids
    • C08L31/04Homopolymers or copolymers of vinyl acetate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Fireproofing Substances (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Building Environments (AREA)

Abstract

Fire resistant wood chip board is prepd. by adding Na or K-silicate together with PVAc as binding agents to the wood chips prior to mixing. Water glass is a cheap material and produces a difficulty inflammable and very poor heat conducting chip board. The silicate is added in propn. about 50 wt.% and the binding agent about 5 wt.%.

Description

Feuerwiderstandsfähige Holzspanplatte Die Erfindung betrifft ein Verfahren zur Herstellung von feuerwiderstandsfähigen Holzspanplatten und nach diesem Verfahren hergestellte Holzspanplatten. Fire Resistant Chipboard The invention relates to a Process for the production of fire-resistant chipboard and according to this Process manufactured chipboard.

Um Baustoffe wie Spanplatten schwer entflammbar zu machen, iät es bekannt, bei der Herstellung der Holzspanplatten den Holzspänen vor dem Mischvorgang ein Feuerschutzmittel, z. B. Bogrsäuere oder Natriumborat zusammen mit einem Bindemittel zuzugeben. Die DAS 1 205 694 beinhaltet solch ein Verfahren, bei welchem den Holzspänen und dem Kunstharzbindemittel Borsäuere in Pulverform beigemischt wird und aus dieser die Spannplatte gepreßt wird. Ebenso wird nach der DAS 1 215 357 ein Brandschutzmittel vor der Verpressung der Platte mit dem Bindemittel und den Holzspänen vermischt.It diets to make building materials like chipboard flame retardant known, in the production of the chipboard, the wood chips before the mixing process a fire retardant, e.g. B. Boric acids or sodium borate together with a binder admit. DAS 1 205 694 includes such a method in which the wood chips and boric acid in powder form is admixed with and made up of the synthetic resin binder the clamping plate is pressed. According to DAS 1 215 357, a fire protection agent is also used before pressing the board with the binder and the wood chips mixed.

Die DAS 1 267 836 beinhaltet ein Verfahren, bei welchem das Flammschutzmittel erst auf die Holzteilchen aufgebracht wird und diese anschließend verpreßt werden.DAS 1 267 836 contains a method in which the flame retardant is first applied to the wood particles and these are then pressed.

Diese schwer entfaarimtharen Holzspanplatten werden besonders zur Abtrennung von großen Räumen, z. B. als Stellende verwendet, um den Einbau massiver Wände zu vermeiden. Ebenso werden sie als Schränkwände dort verwendet, wo die Schrankrückwand gleichzeitig als Abtrennwand dient. Denn in diesem Falle muß die SchrankrAckwand ganz bestimmte Bedingungen im Hinblick auf ihre Feuerwiderstandsfähigkeit erfüllen. Ebenso ist es wichtig, daß die hier verwendeten Materialien schlechte Wärmeleiter sind.These hard-to-remove wood chipboards are particularly suitable for Separation of large rooms, e.g. B. used as digits to make the installation more massive Avoid walls. They are also used as cupboard walls where the rear wall of the cupboard is serves as a partition wall at the same time. Because in this case the cabinet wall must meet very specific conditions with regard to their fire resistance. It is also important that the materials used here are poor heat conductors are.

Der Erfindung liegt deshalb die Aufgabe zugrunde, ein verbessertes Verfahren zur Herstellung von schwer entflammbaren Holzspanplatten zu schaffen.The invention is therefore based on the object of an improved To create a process for the production of flame-retardant chipboard.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß den Holzspänen vor dem Vermischen Natrium- oder Saliumsilikat zusammen mit Polyvinylazetat als Bindemittel zugegeben werden.This object is achieved according to the invention in that the wood chips before mixing sodium or salium silicate together with polyvinyl acetate as Binders are added.

Der Vorteil der Erfindung ist darin zu sehen, daß durch Verwendung von normalem Wasserglas, also von Natriuisilikat zusammen mit Polyvinylasetat eine schwer gntfla bare und sehr schlecht wärieleitende Holzspanplatte geschaffen werden kann. Dabei ist Wasserglas ein billiger Ausgangsstoff. Es hat sich als vorteilhaft erwiesen, wenn das Natrium- oder Kaliumsilikat in einem Gewichtsanteil von ungefähr 50 % beigemengt wird. Der günstigste Gewichtsanteil des Polyvinylazetats liegt bei ungefähr 5 %.The advantage of the invention is that through use from normal water glass, i.e. from sodium silicate together with polyvinyl acetate Difficult to flake and very poorly heat-conducting Chipboard can be created. Water glass is a cheap raw material. It has Proven to be advantageous if the sodium or potassium silicate in a weight fraction about 50% is added. The cheapest weight fraction of the polyvinyl acetate is around 5%.

Als sehr vorteilhaftes Beispiel hat sich ein Gewichtsanteil von 34.8 % Holzspäne, von 56.5 Gewichtsprozent Wasserglas, von 4.35 Gewichtsprozent Polyvinylazetat und von 4.35 Gewichtsprozent Wasser erwiesen. Der Anteil an Wasserglas und Wasser läßt sich aber bei hohen Druckern noch reduzieren.A weight fraction of 34.8 has proven to be a very advantageous example % Wood chips, from 56.5 percent by weight water glass, from 4.35 percent by weight polyvinyl acetate and proven to be 4.35 percent by weight water. The proportion of water glass and water but can still be reduced with high printers.

Entflammungsversuche mit erfindungsgemäßen Holzspanplatten zeigten eine hohe Feuerwiderstandsfähigkeit und ein hohes Wärmedämpfvermögen. Eine 4 cm dicke erfindungsgemäße Holzspanplatte wurde - mindestens entsprechend der Einheitstemperaturkurve DIN 4102 -während der Zeit von 3o Minuten bis auf ungefähr 9oo°C erhitzt, wobei die Maximal temperatur an der Oberfläche der anderen Seite unter 9o°C lag.Flame tests with chipboard according to the invention showed high fire resistance and high thermal insulation properties. A 4 cm thick chipboard according to the invention - at least according to the standard temperature curve DIN 4102 - heated during the time of 30 minutes to about 900 ° C, wherein the maximum temperature on the surface of the other side was below 90 ° C.

Claims (3)

Patentansprüche Claims Verfahren zur Herstellung von feuerwiderstandsfähigen Holzspanplatten, dadurch gekennzeichnet, daß den Holzspänen vor dem Vermischen Natrium- oder Kaliumsilikat zusammen mit Polyvinylazetat als Bindemittel zugegeben werden.Process for the production of fire-resistant chipboard, characterized in that the wood chips before mixing sodium or potassium silicate can be added together with polyvinyl acetate as a binder. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Natrium- oder Kaliumsilikat in einem Anteil von ungefähr 50 Gewichtsprozent zugegeben wird.2. The method according to claim 1, characterized in that the sodium or potassium silicate is added in an amount of about 50 percent by weight. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Bindemittel in einem Gewichtsanteil von ungefähr 5 % zugegeben wird.3. The method according to claim 1, characterized in that the binder is added in a weight proportion of approximately 5%.
DE19712101253 1971-01-13 1971-01-13 Fire resistant wood chip board - using alkali metal silicates Pending DE2101253A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19712101253 DE2101253A1 (en) 1971-01-13 1971-01-13 Fire resistant wood chip board - using alkali metal silicates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712101253 DE2101253A1 (en) 1971-01-13 1971-01-13 Fire resistant wood chip board - using alkali metal silicates

Publications (1)

Publication Number Publication Date
DE2101253A1 true DE2101253A1 (en) 1972-08-03

Family

ID=5795681

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712101253 Pending DE2101253A1 (en) 1971-01-13 1971-01-13 Fire resistant wood chip board - using alkali metal silicates

Country Status (1)

Country Link
DE (1) DE2101253A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3427502A1 (en) * 1984-07-26 1986-01-30 Bayer Ag, 5090 Leverkusen Fire-resistant component
EP0568519A2 (en) * 1992-04-28 1993-11-03 METAMAR, naamloze vennootschap Method for the manufacturing of a construction element

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3427502A1 (en) * 1984-07-26 1986-01-30 Bayer Ag, 5090 Leverkusen Fire-resistant component
EP0568519A2 (en) * 1992-04-28 1993-11-03 METAMAR, naamloze vennootschap Method for the manufacturing of a construction element
BE1005770A3 (en) * 1992-04-28 1994-01-18 Metamar Naamloze Vennootschap Construction element and method for the production thereof.
EP0568519A3 (en) * 1992-04-28 1994-05-18 Metamar Naamloze Vennootschap Construction element and method for the manufacturing thereof

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