DE2051839C3 - Vorrichtung zum Zusammenbau von Kühlkörpern fur Halbleiterbauelemente - Google Patents

Vorrichtung zum Zusammenbau von Kühlkörpern fur Halbleiterbauelemente

Info

Publication number
DE2051839C3
DE2051839C3 DE2051839A DE2051839A DE2051839C3 DE 2051839 C3 DE2051839 C3 DE 2051839C3 DE 2051839 A DE2051839 A DE 2051839A DE 2051839 A DE2051839 A DE 2051839A DE 2051839 C3 DE2051839 C3 DE 2051839C3
Authority
DE
Germany
Prior art keywords
grooves
bodies
cooling fins
heat sinks
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2051839A
Other languages
German (de)
English (en)
Other versions
DE2051839B2 (de
DE2051839A1 (de
Inventor
Karl 6800 Mannheim Reiter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB AG Germany
Original Assignee
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Germany
Priority to DE2051839A priority Critical patent/DE2051839C3/de
Priority to CH1466471A priority patent/CH528146A/de
Priority to FR7137909A priority patent/FR2113080A7/fr
Publication of DE2051839A1 publication Critical patent/DE2051839A1/de
Publication of DE2051839B2 publication Critical patent/DE2051839B2/de
Application granted granted Critical
Publication of DE2051839C3 publication Critical patent/DE2051839C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE2051839A 1970-10-22 1970-10-22 Vorrichtung zum Zusammenbau von Kühlkörpern fur Halbleiterbauelemente Expired DE2051839C3 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE2051839A DE2051839C3 (de) 1970-10-22 1970-10-22 Vorrichtung zum Zusammenbau von Kühlkörpern fur Halbleiterbauelemente
CH1466471A CH528146A (de) 1970-10-22 1971-10-08 Vorrichtung mit von dieser gehaltenen Kühlkörpern für Halbleiterbauelemente
FR7137909A FR2113080A7 (OSRAM) 1970-10-22 1971-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2051839A DE2051839C3 (de) 1970-10-22 1970-10-22 Vorrichtung zum Zusammenbau von Kühlkörpern fur Halbleiterbauelemente

Publications (3)

Publication Number Publication Date
DE2051839A1 DE2051839A1 (de) 1972-04-27
DE2051839B2 DE2051839B2 (de) 1973-04-12
DE2051839C3 true DE2051839C3 (de) 1973-11-22

Family

ID=5785840

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2051839A Expired DE2051839C3 (de) 1970-10-22 1970-10-22 Vorrichtung zum Zusammenbau von Kühlkörpern fur Halbleiterbauelemente

Country Status (3)

Country Link
CH (1) CH528146A (OSRAM)
DE (1) DE2051839C3 (OSRAM)
FR (1) FR2113080A7 (OSRAM)

Also Published As

Publication number Publication date
DE2051839B2 (de) 1973-04-12
DE2051839A1 (de) 1972-04-27
FR2113080A7 (OSRAM) 1972-06-23
CH528146A (de) 1972-09-15

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
8320 Willingness to grant licences declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: BBC BROWN BOVERI AG, 6800 MANNHEIM, DE

8339 Ceased/non-payment of the annual fee
8327 Change in the person/name/address of the patent owner

Owner name: ASEA BROWN BOVERI AG, 6800 MANNHEIM, DE