DE20301346U1 - Image sensor for printed circuit board has C-shaped metal plates providing input and output terminals combined with injection molded structure defining hollow space for photosensitive chip - Google Patents

Image sensor for printed circuit board has C-shaped metal plates providing input and output terminals combined with injection molded structure defining hollow space for photosensitive chip

Info

Publication number
DE20301346U1
DE20301346U1 DE20301346U DE20301346U DE20301346U1 DE 20301346 U1 DE20301346 U1 DE 20301346U1 DE 20301346 U DE20301346 U DE 20301346U DE 20301346 U DE20301346 U DE 20301346U DE 20301346 U1 DE20301346 U1 DE 20301346U1
Authority
DE
Germany
Prior art keywords
photosensitive chip
image sensor
molded body
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20301346U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kingpak Technology Inc
Original Assignee
Kingpak Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingpak Technology Inc filed Critical Kingpak Technology Inc
Priority to DE20301346U priority Critical patent/DE20301346U1/en
Publication of DE20301346U1 publication Critical patent/DE20301346U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The image sensor has a matrix of C-shaped metal plates (30) providing signal input and output terminals, combined with an injection molded structure defining a hollow space (54) housing a photosensitive chip (34), coupled via bonding wires (36) to the signal input terminals and protected by a transparent layer (38). The signal output terminals are soldered to contact surfaces of a printed circuit board (51).

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (3)

1. Bildsensor für elektrische Verbindung mit einer ge­ druckten Leiterplatte, der Folgendes aufweist:
  • - mehrere in einer Matrix angeordnete Metallbleche, von de­ nen jedes über eine erste Platte, eine zweite Platte und eine dritte Platte zum Erzeugen einer C-förmigen Struktur verfügt;
  • - eine spritzgegossene Struktur zum Einschließen der Metall- bleche durch Spritzgießen, wobei diese spritzgegossene Struktur über einen ersten und einen zweiten Formkörper ver­ fügt und sie eine U-förmige Struktur mit einem Hohlraum auf­ weist, wobei ein Teil jeder der ersten Platten der Metall­ bleche innerhalb des ersten Formkörpers liegt, während ein anderer Teil jeder der ersten Platten gegenüber dem ersten Formkörper frei liegt, um Signaleingangsanschlüsse zu bil­ den, die zweiten Platten gegenüber der Unterseite des ersten Formkörpers frei liegen, um Signalausgangsanschlüsse zu bil­ den, die elektrisch mit der gedruckten Leiterplatte zu ver­ binden sind, und die dritten Platten gegenüber einer Seiten­ fläche des ersten Formkörpers frei liegen;
  • - einen fotoempfindlichen Chip, der innerhalb des Hohlraums der spritzgegossenen Struktur untergebracht ist;
  • - mehrere am fotoempfindlichen Chip ausgebildete Bondflecke;
  • - mehrere Drähte zum elektrischen Verbinden der Bondflecke mit den Signaleingangsanschlüssen; und
  • - eine transparente Schicht, die den ersten Formkörper be­ deckt, um den fotoempfindlichen Chip einzuschließen.
1. An image sensor for electrical connection to a printed circuit board, comprising:
  • a plurality of metal sheets arranged in a matrix, each of which has a first plate, a second plate and a third plate for producing a C-shaped structure;
  • - An injection molded structure for enclosing the metal sheets by injection molding, this injection molded structure has a first and a second molded body and it has a U-shaped structure with a cavity, with a part of each of the first plates of the metal sheets inside the first molded body is exposed while another part of each of the first plates is exposed to the first molded body to form signal input terminals, the second plates are exposed to the bottom of the first molded body to form signal output terminals which are electrically connected to the printed circuit board are to bind ver, and the third plates are exposed to a side surface of the first molded body;
  • a photosensitive chip housed within the cavity of the injection molded structure;
  • - Several bond spots formed on the photosensitive chip;
  • - Several wires for electrically connecting the bond pads to the signal input terminals; and
  • - A transparent layer that covers the first molded body be to enclose the photosensitive chip.
2. Bildsensor nach Anspruch 1, gekennzeichnet durch eine mittlere Platte, die am zweiten Formkörper angebracht ist, wobei der fotoempfindliche Chip auf der mittleren Platte platziert ist. 2. Image sensor according to claim 1, characterized by a middle plate, which is attached to the second molded body, with the photosensitive chip on the middle plate is placed.   3. Bildsensor nach Anspruch 1, dadurch gekennzeichnet, dass die zweiten Platten der Metallbleche über eine Ober­ flächenmontagetechnik elektrisch mit der gedruckten Leiter­ platte verbunden sind, so dass Lötzinn zu den dritten Plat­ ten der Metallbleche hochgestiegen ist.3. Image sensor according to claim 1, characterized in that the second plates of the metal sheets have a top surface mounting technology electrically with the printed conductor plate are connected so that solder to the third plat ten of the metal sheets has risen.
DE20301346U 2003-01-29 2003-01-29 Image sensor for printed circuit board has C-shaped metal plates providing input and output terminals combined with injection molded structure defining hollow space for photosensitive chip Expired - Lifetime DE20301346U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20301346U DE20301346U1 (en) 2003-01-29 2003-01-29 Image sensor for printed circuit board has C-shaped metal plates providing input and output terminals combined with injection molded structure defining hollow space for photosensitive chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20301346U DE20301346U1 (en) 2003-01-29 2003-01-29 Image sensor for printed circuit board has C-shaped metal plates providing input and output terminals combined with injection molded structure defining hollow space for photosensitive chip

Publications (1)

Publication Number Publication Date
DE20301346U1 true DE20301346U1 (en) 2003-03-27

Family

ID=7979521

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20301346U Expired - Lifetime DE20301346U1 (en) 2003-01-29 2003-01-29 Image sensor for printed circuit board has C-shaped metal plates providing input and output terminals combined with injection molded structure defining hollow space for photosensitive chip

Country Status (1)

Country Link
DE (1) DE20301346U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1526578A2 (en) * 2003-10-23 2005-04-27 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1526578A2 (en) * 2003-10-23 2005-04-27 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device
EP1526578A3 (en) * 2003-10-23 2006-04-12 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device
CN100433301C (en) * 2003-10-23 2008-11-12 松下电器产业株式会社 Solid-state imaging device
US7586529B2 (en) 2003-10-23 2009-09-08 Panasonic Corporation Solid-state imaging device
US7719585B2 (en) 2003-10-23 2010-05-18 Panasonic Corporation Solid-state imaging device

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030430

R150 Term of protection extended to 6 years

Effective date: 20060214

R157 Lapse of ip right after 6 years

Effective date: 20090801