DE202020106661U1 - Connector ensemble for mounting on a substrate - Google Patents

Abstract

Connector assembly for mounting on a substrate (7), having a first adhesive tape (6) in the area of at least one solder deposit (1) having an adhesive force of less than 5N and a second adhesive tape (8) having an adhesive force of more than 25 N.

Description

background

In many areas of technology, electrical connections to structures on substrates are required.

In automotive engineering, for example, panes made from different substrates are used on which electrically conductive structures such as antennas, displays, sensors or heating elements, to name just a few, are applied or incorporated.

These electrically conductive structures must be provided with a suitable connection to other units.

A problem here is that the connection must have certain requirements in terms of peel strength.

task

However, the requirements cannot be met with the previous arrangements from the prior art. It would therefore be desirable to find a remedy here.

Summary of the invention

The object is achieved in particular by a connector assembly for mounting on a substrate, having a first adhesive tape in the area of at least one solder deposit having an adhesive force of less than 5N and a second adhesive tape having an adhesive force of more than 25 N.

The object is also achieved by a disk ensemble having a substrate and a connector ensemble as described above.

Further refinements are the subject matter of the respective dependent claims. the description and the figures.

Figure list

• 1 eine schematische Schnittdarstellung durch Teile eines auf einem Substrat zu verbindenden Elements.
• 2 eine schematische Schnittdarstellung gemäß 1 mit einem Substrat gemäß Stand der Technik, und
• 3 eine weitere schematische Schnittdarstellung gemäß 1 mit einem Substrat gemäß anderen Aspekten von Ausführungsformen der Erfindung

Embodiments of the present invention are described by way of example with reference to the attached drawings, in which:

• 1 a schematic sectional view through parts of an element to be connected on a substrate.
• 2 a schematic sectional view according to 1 with a substrate according to the prior art, and
• 3 a further schematic sectional illustration according to 1 with a substrate in accordance with other aspects of embodiments of the invention

Detailed description of the invention with reference to the drawings

The invention will be illustrated in more detail below with reference to the figures. It should be noted that different aspects are described that can be used individually or in combination. That is, any aspect can be used with different embodiments of the invention, unless explicitly shown as a pure alternative.

Furthermore, for the sake of simplicity, reference will generally only be made to one entity in the following. Unless explicitly stated, the invention can also have several of the entities concerned. In this respect, the use of the words “a”, “an” and “an” is only to be understood as an indication that at least one entity is used in a simple embodiment.

As far as methods are described below, the individual steps of a method can be arranged and / or combined in any order, unless the context explicitly results in something different. Furthermore, the processes can be combined with one another - unless expressly indicated otherwise.

Figures with numerical values are generally not to be understood as exact values, but also include a tolerance of +/- 1% up to +/- 10%.

References to standards or specifications or norms are to be understood as a reference to standards or specifications or norms that apply at the time of filing and / or - if priority is claimed - also at the time of filing for priority. However, this is not to be understood as a general exclusion of applicability to the following or replacing standards or specifications or norms.

In 1 is a schematic sectional illustration through parts of an element to be connected to a substrate.

This in 1 The connector assembly shown is for mounting on a substrate 7th suitable. The connector ensemble has a flat cable, for example 2 and a solder connection 5 on. On the flat cable 2 can have one or more solder depots at other points 1 be provided with one or more electrical structures on the substrate 7th should be connected. In addition, further elements (optional) can be provided which, however, are immaterial for an understanding of the invention. These elements include adhesive film (s) 3. Additional layers can optionally be present.

This in 1 connector ensemble S shown is in 2 and 3 shown with additional elements.

The prior art provided that, as in 2 shown, the connector ensemble with a first relatively large adhesive tape 6th in the area of the solder deposit (s) on the substrate 7th , for example a pane of glass, is applied. However, these adhesive tapes only have a low adhesive force of around 5 N or less. There is therefore the risk that forces will pull or shear off the connector assembly again from the substrate.

Therefore, the invention now proposes - as in shown - in addition to the first tape 6th another tape 8th with a considerably higher holding force, e.g. of 25 N and more.

The somewhat objectionable arrangement in relation to the solder deposits has turned out to be advantageous, since it results in the previous structure in the area of the solder deposits 1 can be maintained and on the other hand tensile or shear loads rather in the area of the flat cable 2 or the transition to one (or more) round conductors 9 are to be expected.

In embodiments of the invention, the connector assembly has a transition 9 from a round cable to a flat cable.

In a further embodiment of the invention is the second adhesive tape 8th closer to transition 9 on the connector ensemble than the first adhesive tape 6th attached.

In a further embodiment of the invention, the second adhesive tape 8th an adhesive force of more than approximately 40 N or 50 N or more.

An exemplary adhesive tape 8th is for example a foam adhesive tape PT 1500 manufactured by 3M.

A disk ensemble can be produced from this, which is a substrate 7th and has a connector assembly according to the invention.

During manufacture can be on the substrate 7th on the one on the second tape 8th facing side at least in the area of the future connection point with the second adhesive tape 8th a primer must have been applied beforehand.

This primer can further increase the adhesive force. An exemplary primer is e.g. Scotchmount Primer 4298 UV from 3M.

The pane ensembles according to the invention can with the help of the first adhesive tape 6th and the second tape 8th provide strain relief for forces of 50 N and more.

The pane ensembles according to the invention are stable even with aging and are also safe against the effects of moisture.

List of reference symbols

1

Solder depot

2

Flat cable

3

Adhesive film

5

Solder connection

6

first tape

7th

Substrate

8th

second tape

Claims (6)

Connector assembly for mounting on a substrate (7), having a first adhesive tape (6) in the area of at least one solder deposit (1) having an adhesive force of less than 5N and a second adhesive tape (8) having an adhesive force of more than 25 N. Connector ensemble according to Claim 1 , characterized in that the connector assembly has a transition (9) from a round cable to a flat cable. Connector ensemble according to Claim 1 or 2 , characterized in that the connector assembly has a transition from a round cable to a flat cable, the second adhesive tape (8) being fastened closer to the transition on the connector assembly than the first adhesive tape (6). Connector assembly according to one of the preceding claims, characterized in that the second adhesive tape (8) has an adhesive force of more than approximately 50 N / mm ² or more. Disc assembly comprising a substrate (7) and a connector assembly according to one of the preceding claims Disc ensemble after Claim 5 characterized in that in the sequence of the Connector ensemble and the substrate (7) a primer is introduced.

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