DE202010014365U1 - Stackable cooler assembly - Google Patents
Stackable cooler assembly Download PDFInfo
- Publication number
- DE202010014365U1 DE202010014365U1 DE202010014365U DE202010014365U DE202010014365U1 DE 202010014365 U1 DE202010014365 U1 DE 202010014365U1 DE 202010014365 U DE202010014365 U DE 202010014365U DE 202010014365 U DE202010014365 U DE 202010014365U DE 202010014365 U1 DE202010014365 U1 DE 202010014365U1
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- receiving space
- plates
- assembly according
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
- F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
- F28D1/0325—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another
- F28D1/0333—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another the plates having integrated connecting members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
- F28D1/0366—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by spaced plates with inserted elements
- F28D1/0375—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by spaced plates with inserted elements the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/028—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using inserts for modifying the pattern of flow inside the header box, e.g. by using flow restrictors or permeable bodies or blocks with channels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2220/00—Closure means, e.g. end caps on header boxes or plugs on conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/06—Fastening; Joining by welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Aufeinander stapelbare Kühleranordnung, bestehend aus einer Mehrzahl von aufeinander stapelbaren Kühlplatten (4), wobei jede Kühlplatte (4) zwei miteinander korrespondierende Deckplatten (41) aufweist, die jeweils mindestens einen Aufnahmeraum (410) besitzt, der einem anderen Aufnahmeraum 410 der gegenüberliegenden Deckplatte 41 entspricht, wobei der Aufnahmeraum (410) an seiner Außenwand mindestens ein Verbindungsteil (411) aufweist, das eine Durchbohrung (412) besitzt, die mit dem Aufnahmeraum (410) verbunden ist, und wobei eine Mehrzahl von Wölbungen (413) in jedem Aufnahmeraum ausgebildet ist.Stackable cooler assembly consisting of a plurality of stackable cooling plates (4), wherein each cooling plate (4) has two mutually corresponding cover plates (41) each having at least one receiving space (410), the other receiving space 410 of the opposite cover plate 41st wherein the receiving space (410) has on its outer wall at least one connecting part (411) having a throughbore (412) connected to the receiving space (410), and wherein a plurality of bulges (413) are formed in each receiving space is.
Description
Die Erfindung betrifft einen Kühler, insbesondere eine Kühleranordnung, die aufeinander zusammensetzbar ist, wobei ein geschlossener Kreislauf zur Wärmeabfuhr in dieser Konstruktion erzielbar ist.The invention relates to a radiator, in particular a radiator assembly which is composable to each other, wherein a closed circuit for heat dissipation in this construction can be achieved.
Mit zunehmender Miniaturisierung werden elektronische Produkte immer kleiner, aber trotzdem mit einer stets erhöhten Leistung wie z. B.: einer schnelleren Berechnungsgeschwindigkeit bzw. einer höheren Frequenz. Nachteilig ist jedoch bei höherer Leistung auch die steigende Abwärme, die diese elektronischen Produkte beim Betrieb erzeugen. Eine wirksame Kühlvorrichtung zu finden, ist daher ein entscheidender Faktor geworden, um einen normalen Betrieb und somit eine Systemstabilität aufrechterhalten zu können.With increasing miniaturization electronic products are getting smaller, but still with a constantly increased performance such. B .: a faster calculation speed or a higher frequency. A disadvantage, however, with higher power and the increasing waste heat that produce these electronic products during operation. Finding an effective cooling device has therefore become a crucial factor in maintaining normal operation and hence system stability.
Eine herkömmliche Kühlvorrichtung ist so ausgelegt, dass eine Mehrzahl von Kühlrippen auf einem metallischen Wärmeabführsitz angebracht ist, sodass eine Wärmeabfuhr an die Umgebung durch Luftkonvektion erfolgt. Weil diese Kühlvorrichtung nur eine begrenzte Wärmeleitfähigkeit aufweist, so werden als ihr Nachfolger verbesserte Kühleranordnungen mit Kühlplatten und Wärmerohren entwickelt, die unter Einwirkung der Zustandsänderung einer darin eingefüllten Arbeitsflüssigkeit eine bessere Kühlleistung erlauben.A conventional cooling device is designed so that a plurality of cooling fins is mounted on a metallic heat dissipation seat, so that a heat dissipation to the environment by air convection takes place. Because this cooling device has only a limited thermal conductivity, as its successor improved radiator arrangements with cooling plates and heat pipes are developed, which allow a better cooling performance under the influence of the change in state of a working fluid filled therein.
Um Nachteile der oben genannten Kühleranordnungen zu vermeiden, hat der Erfinder in der
Im Zusammenhang mit dem oben genannten Stand der Technik hat der Erfinder zudem noch eine andere ”verbesserte Kühleranordnung” in der
Obwohl die beiden genannten Erfindungen die Kühlwirkung erhöhen können, ist ihre Kühlleistung, bedingt durch beschränkten Wärmeübertragungsweg der Arbeitsflüssigkeit, immer noch begrenzt. So stellt sich der Erfinder die Aufgabe, ein rationelles Design anzubieten, das die Nachteile der oben genannten Erfindungen effektiv verbessern kann.Although the two aforementioned inventions can increase the cooling effect, their cooling capacity, due to limited heat transfer path of the working fluid, is still limited. Thus, the inventor has the task to offer a rational design that can effectively improve the disadvantages of the above-mentioned inventions.
Der Erfindung liegt die Aufgabe zugrunde, eine aufeinander stapelbare Kühleranordnung zu schaffen, die durch einfache Maßnahmen die oben genannten Nachteile vermeidet.The invention has for its object to provide a stackable cooler assembly that avoids the above disadvantages by simple measures.
Diese Aufgabe wird erfindungsgemäß gelöst durch eine aufeinander stapelbare Kühleranordnung, die die im Anspruch 1 angegebenen Merkmale aufweist. Weitere vorteilhafte Weiterbildungen der Erfindung gehen aus den Unteransprüchen hervor.This object is achieved by a stackable cooler assembly having the features specified in
Gemäß der Erfindung wird eine aufeinander stapelbare Kühleranordnung bereitgestellt, die sich aus einer Mehrzahl von Kühlplatten zusammensetzt, die aufeinander zusammengefügt sind. Die hier genannte Kühlplatte besteht aus zwei Hälften, die jeweils einen Aufnahmeraum aufweist, der dem gegenüberstehenden Aufnahmeraum an der Gegenhälfte passt. Nachdem die beiden Aufnahmeräume aufeinander abgestimmt und zusammengefügt sind, bildet die Kühlplatte einen Hohlraum in sich, wobei der Aufnahmeraum an seiner Außenwand mindestens ein Verbindungsteil aufweist. Im Verbindungsteil ist eine Durchbohrung ausgebildet, die mit dem Aufnahmeraum verbunden ist. Um die Wärmeleitfähigkeit der Kühlplatte zu erhöhen, kann entweder eine Mehrzahl von Wölbungen, die in einem Stanzverfahren von außen nach innen geformt sind, in dem Aufnahmeraum ausgebildet sein, oder kann eine Kapillarkonstruktion in dem Hohlraum angeordnet werden. Wenn eine Mehrzahl dieser Kühlplatten aufeinander zusammengesetzt wird, werden die Hohlräume in einzelnen Kühlplatten durch entsprechende Durchbohrungen einzelner Verbindungsteile zusammen verbunden. Außerdem kann eine Absperrscheibe an einer Durchbohrung angeordnet werden, um eine passende Menge Arbeitsflüssigkeit in dem Hohlraum zu verschließen. Mithilfe dieser Kühleranordnung kann ein kundenorientierter Kreislauf in vielfältigen Varianten je nach Bedarf ausgelegt werden. Außerdem können die Kühlrippen zwischen einzelnen Kühlplatten an dem Grundkörper geschweißt werden, sodass die Kühleranordnung eine einheitliche Ganzheit bildet, um die Wärmeleitfähigkeit zu erhöhen.According to the invention, a stackable cooler assembly is provided which is composed of a plurality of cooling plates joined together. The cooling plate referred to here consists of two halves, each having a receiving space which fits the opposite receiving space on the opposite half. After the two receiving spaces are matched and joined together, the cooling plate forms a cavity in itself, wherein the receiving space has at least one connecting part on its outer wall. In the connecting part a through hole is formed, which is connected to the receiving space. In order to increase the thermal conductivity of the cooling plate, either a plurality of bulges, which are formed in a punching method from outside to inside, in the receiving space may be formed, or a capillary structure may be arranged in the cavity. When a plurality of these cooling plates are assembled together, the cavities in individual cooling plates are connected together by respective bores of individual connecting parts. In addition, a shut-off disc can be placed on a throughbore to close a suitable amount of working fluid in the cavity. With the help of this cooler arrangement, a customer-oriented circuit can be designed in various variants as needed. In addition, the cooling fins between individual cooling plates can be welded to the base body, so that the radiator arrangement forms a uniform entirety in order to increase the thermal conductivity.
Zusammengefasst lassen sich mit der erfindungsgemäßen Konstruktion beispielsweise folgende Vorteile realisieren:
- i) Eine Mehrzahl von Kühlplatten der vorliegenden Erfindung kann aufeinander in einer Nachschaltung zusammengesetzt und durch ihre Verbindungsteile zusammengeschweißt werden, wobei eine Mehrzahl von Wölbungen, die in einem Stanzverfahren geformt sind, an einzelnen Hälften ausgebildet ist, um den Wärmeübertragungsweg des Arbeitsflüssigkeit zu verlängern und somit die Kühlleistung zu erhöhen.
- ii) Ein erfindungsgemäßer Kühler, bestehend aus einer Mehrzahl von Kühlplatten, die aufeinander zusammengesetzt sind, ist leicht erweiterungsfähig. Je nach Bedarf können die Kühlplatten in unterschiedlich Ausführungen und Mengen ausgestaltet werden, um einen kundenorientierten Kundenbedarf individuell zu decken.
- iii) Die vorliegende Erfindung mit der kreativen Konstruktion lässt sich schnell und einfach zusammenbauen. Um eine wirksame Wärmeleitfähigkeit und eine schnelle Wärmeabfuhr zu gewähren, kann der Kreislauf individuell ausgelegt werden.
- i) A plurality of cooling plates of the present invention may be successively assembled and welded together by their connecting parts, wherein a plurality of bulges formed in a stamping process are formed on individual halves to extend the heat transfer path of the working fluid, and thus to increase the cooling capacity.
- ii) A cooler according to the invention, consisting of a plurality of cooling plates, which are assembled on one another, is easily expandable. Depending on requirements, the cooling plates can be designed in different designs and quantities to individually cover a customer-oriented customer requirement.
- iii) The present invention with the creative construction can be assembled quickly and easily. To ensure effective thermal conductivity and rapid heat dissipation, the circuit can be designed individually.
Im Folgenden werden die Erfindung und ihre Ausgestaltungen anhand der Zeichnung näher erläutert. In der Zeichnung zeigt:In the following the invention and its embodiments will be explained in more detail with reference to the drawing. In the drawing shows:
Die vorliegende Erfindung betrifft eine Kühleranordnung, die aufeinander zusammensetzbar ist, wobei eine Mehrzahl von Kühlplatten
Die Kühlplatten sind aus einem gut wärmeleitfähigen Material wie z. B.: Kupfer oder Aluminium hergestellt. In Bezug auf
In dem oben erwähnte Kühler
In der
In der
In der
In
Die oben erwähnten vier Kühlplatten
In
Die Erfindung betrifft somit eine aufeinander stapelbare Kühleranordnung, die eine Mehrzahl von aufeinander stapelbaren Kühlplatten
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- DE 202009000540 [0004, 0012] DE 202009000540 [0004, 0012]
- DE 202010004350 [0005, 0014] DE 202010004350 [0005, 0014]
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202010014365U DE202010014365U1 (en) | 2010-10-15 | 2010-10-15 | Stackable cooler assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202010014365U DE202010014365U1 (en) | 2010-10-15 | 2010-10-15 | Stackable cooler assembly |
Publications (1)
Publication Number | Publication Date |
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DE202010014365U1 true DE202010014365U1 (en) | 2011-02-17 |
Family
ID=43603859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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DE202010014365U Expired - Lifetime DE202010014365U1 (en) | 2010-10-15 | 2010-10-15 | Stackable cooler assembly |
Country Status (1)
Country | Link |
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DE (1) | DE202010014365U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012112735A1 (en) * | 2012-12-20 | 2014-06-26 | Conti Temic Microelectronic Gmbh | Liquid cooler for use in control device of motor vehicle with internal combustion engine, has two housing halves which are connected with each other in form-fit manner, where fuel of internal combustion engine is used as cooling liquid |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202009000540U1 (en) | 2009-01-14 | 2009-04-09 | Thermasol Technology Co., Ltd. | Applicable cooler construction |
DE202010004350U1 (en) | 2010-03-30 | 2011-01-20 | Thermasol Technology Co., Ltd. | cooling system |
-
2010
- 2010-10-15 DE DE202010014365U patent/DE202010014365U1/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202009000540U1 (en) | 2009-01-14 | 2009-04-09 | Thermasol Technology Co., Ltd. | Applicable cooler construction |
DE202010004350U1 (en) | 2010-03-30 | 2011-01-20 | Thermasol Technology Co., Ltd. | cooling system |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012112735A1 (en) * | 2012-12-20 | 2014-06-26 | Conti Temic Microelectronic Gmbh | Liquid cooler for use in control device of motor vehicle with internal combustion engine, has two housing halves which are connected with each other in form-fit manner, where fuel of internal combustion engine is used as cooling liquid |
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Legal Events
Date | Code | Title | Description |
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R207 | Utility model specification |
Effective date: 20110324 |
|
R082 | Change of representative |
Representative=s name: ISARPATENT GBR PATENT- UND RECHTSANWAELTE, DE Representative=s name: ISARPATENT PATENTANWAELTE BEHNISCH, BARTH, CHA, DE Representative=s name: ISARPATENT - PATENTANWAELTE- UND RECHTSANWAELT, DE |
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R150 | Utility model maintained after payment of first maintenance fee after three years | ||
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20131112 |
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R151 | Utility model maintained after payment of second maintenance fee after six years | ||
R158 | Lapse of ip right after 8 years |