DE202007011034U1 - Electronic module - Google Patents
Electronic module Download PDFInfo
- Publication number
- DE202007011034U1 DE202007011034U1 DE200720011034 DE202007011034U DE202007011034U1 DE 202007011034 U1 DE202007011034 U1 DE 202007011034U1 DE 200720011034 DE200720011034 DE 200720011034 DE 202007011034 U DE202007011034 U DE 202007011034U DE 202007011034 U1 DE202007011034 U1 DE 202007011034U1
- Authority
- DE
- Germany
- Prior art keywords
- electronic assembly
- circuit carrier
- circuit
- assembly
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
Abstract
Elektronische Baugruppe (1) umfassend einen mit einer im Wesentlichen zentrisch angeordneten Ausnehmung (2.1) versehenen Schaltungsträger (2), auf dessen Außenoberfläche eine Mehrzahl von Bauelementen (3) angeordnet ist.electronic Assembly (1) comprising one with a substantially centric arranged recess (2.1) provided circuit carrier (2), on its outer surface a Plurality of components (3) is arranged.
Description
Stand der TechnikState of the art
Die Erfindung betrifft eine elektronische Baugruppe nach dem Oberbegriff des Anspruchs 1.The The invention relates to an electronic assembly according to the preamble of claim 1.
Offenbarung der ErfindungDisclosure of the invention
Technische AufgabeTechnical task
Der Erfindung liegt die Aufgabe zugrunde, eine kompakt bauende elektronische Baugruppe zu schaffen, die kostengünstig herstellbar ist.Of the Invention is based on the object, a compact electronic construction To create an assembly that is inexpensive to produce.
Technische LösungTechnical solution
Diese Aufgabe wird durch eine elektronische Baugruppe mit den Merkmalen des Anspruchs 1 gelöst.These Task is by an electronic assembly with the features of claim 1.
Vorteile der ErfindungAdvantages of the invention
Die Erfindung geht von der Erkenntnis aus, dass eine besonders kompakte multifunktionale elektronische Baugruppe mit einem Schaltungsträger geschaffen werden kann, auf dessen Aussenoberfläche eine Mehrzahl von elektronischen Bauelementen, insbesondere Schaltelementen, angeordnet ist. Die Verbindung der Bauelemente untereinander und mit einer Kontakteinrichtung erfolgt vorteilhaft über Leiterbahnen und Kontaktflächen, die mehrdimensional verlaufend auf Oberflächenbereichen des Schaltungsträgers angeordnet sind. Der Schaltungsträger ist vorteilhaft als Spritzgussteil gefertigt und besteht aus einem teilkristallinen, teilaromatischen Hochtemperatur-Polyamid, das einen Schmelzpunkt von mindestens 295° Celsius und eine Biegetemperatur unter Last von etwa 260° Celsius bei etwa 0,45 MPa aufweist. Die auf den Schaltungsträger aufgebrachten Bauelemente werden vorteilhaft mit einem bleifreien Lot mit den Leiterbahnen bzw. Kontaktflächen verbunden. Vorteilhaft werden alle Lotverbindungen im Wesentlichen gleichzeitig hergestellt, wobei ein Dampfphasenlötverfahren zum Einsatz kommt.The Invention is based on the recognition that a particularly compact multifunctional electronic assembly created with a circuit carrier can be on the outer surface of a plurality of electronic Components, in particular switching elements, is arranged. The connection the components takes place with each other and with a contact device advantageous over Tracks and contact surfaces, the multi-dimensionally arranged arranged on surface areas of the circuit substrate are. The circuit carrier is advantageously manufactured as an injection molded part and consists of a semi-crystalline, semiaromatic high-temperature polyamide, which has a melting point of at least 295 ° Celsius and a bending temperature under load of about 260 ° Celsius at about 0.45 MPa. The on the circuit carrier Applied components become advantageous with a lead-free Lot connected to the tracks or contact surfaces. Advantageous all solder joints are made substantially simultaneously, wherein a vapor phase soldering method is used.
Weitere Vorteile ergeben sich aus weiteren Unteransprüchen, der Beschreibung und der Zeichnung.Further Advantages result from further subclaims, the description and the drawing.
Zeichnungdrawing
Ausführungsbeispiele der Erfindung werden nachfolgend unter Bezug auf die Zeichnung näher erläutert.embodiments The invention will be explained in more detail with reference to the drawing.
Es zeigen:It demonstrate:
Beschreibung der Ausführungsbeispieledescription the embodiments
Der
Schaltungsträger
Die
Leiterbahnen
Die
Kontakteinrichtung
Wie
insbesondere aus
Die
elektronische Baugruppe
In
weiteren Ausführungsvarianten
ist es denkbar, die Leiterbahnen
- 11
- Elektronische Baugruppeelectronic module
- 22
- Schaltungsträgercircuit support
- 2.12.1
- Ausnehmungrecess
- 33
- Schaltelementswitching element
- 3.13.1
- Schaltelementswitching element
- 3.23.2
- Schaltelementswitching element
- 3.33.3
- Schaltelementswitching element
- 3.43.4
- Schaltelementswitching element
- 3.53.5
- Schaltelementswitching element
- 3.63.6
- Schaltelementswitching element
- 3.73.7
- Schaltelementswitching element
- 3.83.8
- Schaltelementswitching element
- 3.93.9
- Schaltelementswitching element
- 3.103.10
- Schaltelementswitching element
- 3.113.11
- Schaltelementswitching element
- 44
- Leiterbahnconductor path
- 4.14.1
- Kontaktflächecontact area
- 4.24.2
- Kontaktflächecontact area
- 55
- Kontakteinrichtungcontactor
- 66
- Bestückungsflächemounting area
Claims (34)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200720011034 DE202007011034U1 (en) | 2007-08-08 | 2007-08-08 | Electronic module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200720011034 DE202007011034U1 (en) | 2007-08-08 | 2007-08-08 | Electronic module |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202007011034U1 true DE202007011034U1 (en) | 2007-10-18 |
Family
ID=38608623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200720011034 Expired - Lifetime DE202007011034U1 (en) | 2007-08-08 | 2007-08-08 | Electronic module |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202007011034U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2141315A3 (en) * | 2008-06-30 | 2014-03-26 | GEZE GmbH | Window, door or similar |
-
2007
- 2007-08-08 DE DE200720011034 patent/DE202007011034U1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2141315A3 (en) * | 2008-06-30 | 2014-03-26 | GEZE GmbH | Window, door or similar |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20071122 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20110128 |
|
R082 | Change of representative |
Representative=s name: DREISS PATENTANWAELTE PARTNERSCHAFT, DE |
|
R082 | Change of representative |
Representative=s name: DREISS PATENTANWAELTE PARTNERSCHAFT, DE |
|
R081 | Change of applicant/patentee |
Owner name: KROMBERG & SCHUBERT KG, DE Free format text: FORMER OWNER: KROMBERG & SCHUBERT GMBH & CO. KG, 42389 WUPPERTAL, DE Effective date: 20130430 |
|
R082 | Change of representative |
Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE Effective date: 20130430 Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE Effective date: 20121130 Representative=s name: DREISS PATENTANWAELTE PARTNERSCHAFT, DE Effective date: 20130430 Representative=s name: DREISS PATENTANWAELTE PARTNERSCHAFT, DE Effective date: 20121130 |
|
R157 | Lapse of ip right after 6 years |
Effective date: 20140301 |